Visual examination, using the unaided eye or a low-power optical magnifier, is typically one of the first steps in a failure investigation. This article presents the guidelines for selecting samples for scanning electron microscope examination and optical metallography and for cleaning fracture surfaces. It discusses damage characterization of metals, covering various factors that influence the damage, namely stress, aggressive environment, temperature, and discontinuities.

X-ray diffraction (XRD) residual-stress analysis is an essential tool for failure analysis. This article focuses primarily on what the analyst should know about applying XRD residual-stress measurement techniques to failure analysis. Discussions are extended to the description of ways in which XRD can be applied to the characterization of residual stresses in a component or assembly and to the subsequent evaluation of corrective actions that alter the residual-stress state of a component for the purposes of preventing, minimizing, or eradicating the contribution of residual stress to premature failures. The article presents a practical approach to sample selection and specimen preparation, measurement location selection, and measurement depth selection; measurement validation is outlined as well. A number of case studies and examples are cited. The article also briefly summarizes the theory of XRD analysis and describes advances in equipment capability.

The torque-arm assembly (aluminum alloy 7075-T73) for an aircraft nose landing gear failed after 22,779 simulated flights. The part, made from an aluminum alloy 7075-T73 forging, had an expected life of 100,000 simulated flights. Initial study of the fracture surfaces indicated that the primary fracture initiated from multiple origins on both sides of a lubrication hole that extended from the outer surface to the bore of a lug in two cadmium-plated flanged bushings made of copper alloy C63000 (aluminum bronze) that were press-fitted into each bored hole in the lug. Sectioning and 2x metallographic analysis showed small fatigue-type cracks in the hole adjacent to the origin of primary fracture. Hardness and electrical conductivity were typical for aluminum alloy 7075. This evidence supported the conclusion that the arm failed in fatigue cracking that initiated on each side of the lubrication hole since no material defects were found at the failure origin. Recommendations included redesign of the lubrication hole, shot peeing of the faces of the lug for added resistance to fatigue failure, and changing of the forging material to aluminum alloy 7175-T736 for its higher mechanical properties.

This article focuses primarily on what an analyst should know about applying X-ray diffraction (XRD) residual stress measurement techniques to failure analysis. Discussions are extended to the description of ways in which XRD can be applied to the characterization of residual stresses in a component or assembly. The article describes the steps required to calibrate instrumentation and to validate stress measurement results. It presents a practical approach to sample selection and specimen preparation, measurement location selection, and measurement depth selection, as well as an outline on measurement validation. The article also provides information on stress-corrosion cracking and corrosion fatigue. The importance of residual stress in fatigue is described with examples. The article explains the effects of heat treatment and manufacturing processes on residual stress. It concludes with a section on the XRD stress measurements in multiphase materials and composites and in locations of stress concentration.

This article describes some of the common elemental composition analysis methods and explains the concept of referee and economy test methods in failure analysis. It discusses different types of microchemical analyses, including backscattered electron imaging, energy-dispersive spectrometry, and wavelength-dispersive spectrometry. The article concludes with information on specimen handling.

This article focuses on the visual or macroscopic examination of damaged materials and interpretation of damage and fracture features. Analytical tools available for evaluations of corrosion and wear damage features include energy dispersive spectroscopy, electron probe microanalysis, Auger electron spectroscopy, secondary ion mass spectroscopy, and X-ray powder diffraction. The article discusses the analysis and interpretation of base material composition and microstructures. Preparation and examination of metallographic specimens in failure analysis are also discussed. The article concludes with a review of the evaluation of polymers and ceramic materials in failure analysis.

This article provides a discussion on the metallographic techniques used for failure analysis, and on fracture examination in materials, with illustrations. It discusses various metallographic specimen preparation techniques, namely, sectioning, mounting, grinding, polishing, and electrolytic polishing. The article also describes the microstructure examination of various materials, with emphasis on failure analysis, and concludes with information on the examination of replicas with light microscopy.

The scanning electron microscopy (SEM) is one of the most versatile instruments for investigating the microstructure of metallic materials. This article highlights the development of SEM technology and describes the operation of basic systems in an SEM, including the electron optical column, signal detection and display equipment, and vacuum system. It discusses the preparation of samples for observation using an SEM and describes the application of SEM in fractography. If the surface remains unaffected and undamaged by events subsequent to the actual failure, it is often a simple matter to determine the failure mode by the use of an SEM. In cases where the surface is altered after the initial failure, the case may not be so straightforward. The article presents typical examples that illustrate these points. Image dependence on the microscope type and operating parameters is also discussed.