Explosive cladding is a viable method for cladding different materials together, but the complicated behavior of materials under ballistic impacts raises the probability of interfacial shear failure. To better understand the relationship between impact energy and interfacial shear, investigators conducted an extensive study on the shear strength of explosively cladded Inconel 625 and plain carbon steel samples. They found that by increasing impact energy, the adhesion strength of the resulting cladding can be improved. Beyond a certain point, however, additional impact energy reduces shear strength significantly, causing the cladding process to fail. The findings reveal the decisive role of plastic strain localization and the associated development of microcracks in cladding failures. An attempt is thus made to determine the optimum cladding parameters for the materials of interest.

Several surgical tool failures were analyzed to understand why they occur and how to prevent them. The study included drills, catheters, and needles subjected to the rigors of biomedical applications such as corrosive environments, high stresses, sterilization, and improper cleaning procedures. Given the extreme conditions to which surgical tools can be exposed, and the potential for misuse, failures are inevitable and systematic methods for analyzing them are necessary to keep them in check.

The pawl spring which was part of a selector switch used in telephone equipment failed. The springs were blanked from 0.4 mm (0.014 in.) thick tempered 1095 steel and then nickel plated. Numerous pits around the rivet holes were revealed by microscopic examination of longitudinal specimens. Delaminations that were formed at inclusion sites during punching of the rivet holes and that were filled with nickel during the plating operation were revealed by microscopic examination of the rivet hole. These delaminations were interpreted to have acted as stress raisers and initiated the fracture. Long, narrow sulfide stringers which were the probably the cause of delamination in this spring material were revealed in the raw material used to make the springs. It was concluded that fracture of the springs was caused by fatigue that had originated at delaminations around the rivet holes.

Rolling-contact fatigue (RCF) is a surface damage process due to the repeated application of stresses when the surfaces of two bodies roll on each other. This article briefly describes the various surface cracks caused by manufacturing processing faults or blunt impact loads on ceramic balls surfaces. It discusses the propagation of fatigue cracks involved in rolling contacts. The characteristics of various types of RCF test machines are summarized. The article concludes with a discussion on the various failure modes of silicon nitride in rolling contact. These include the spalling fatigue failure, the delamination failure, and the rolling-contact wear.

Several surface-mount chip resistor assemblies failed during monthly thermal shock testing and in the field. The resistor exhibited a failure mode characterized by a rise in resistance out of tolerance for the system. Representative samples from each step in the manufacturing process were selected for analysis, along with additional samples representing the various resistor failures. Visual examination revealed two different types of termination failures: total delamination and partial delamination. Electron probe microanalysis confirmed that the fracture occurred at the end of the termination. Transverse sections from each of the groups were examined metallographically. Consistent interfacial separation was noted. Fourier transform infrared and EDS analyses were also performed. It was concluded that low wraparound termination strength of the resistors had caused unacceptable increases in the resistance values, resulting in circuit nonperformance at inappropriate times. The low termination strength was attributed to deficient chip design for the intended materials and manufacturing process and exacerbated by the presence of polymeric contamination at the termination interface.