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ASM Technical Books
Microelectronics Failure Analysis: Desk Reference (Seventh Edition)
Edited by
ASM International
ISBN electronic:
978-1-62708-247-1
Publication date:
2019
Book Chapter
Failure Analysis Terms and Definitions
By
Christopher L. Henderson
Semitracks Inc.
Christopher L. Henderson
Search for other works by this author on:
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Published:2019
Abstract
This article is a compilation of terms and definitions related to failure analysis that have been addressed in the proceedings of the International Symposium for Testing and Failure Analysis.
Topics
Automobiles and trucks,
Electronic packaging,
Scanning electron microscopy,
Atomic force microscopy,
Optical light microscopy,
Scanning acoustic microscopy,
Focused ion beam tomography,
Electrooptical components,
Failure mode and effects analysis,
Root cause analysis,
Failure mechanisms and analysis
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Citation
Christopher L. Henderson, Failure Analysis Terms and Definitions, Microelectronics Failure Analysis: Desk Reference, 7th ed., Edited By Tejinder Gandhi, ASM International, 2019, p 678–694, https://doi.org/10.31399/asm.tb.mfadr7.t91110678
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Now available in the Digital Library! Volume 11B serves as a reference and guide to help engineers determine the causes of failure in plastic components and make corrective adjustments through design and manufacturing modifications.
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