Microelectronics Failure Analysis: Desk Reference (Seventh Edition)
Scanning Electron Microscopy
-
Published:2019
Abstract
This article provides an overview of how to use the scanning electron microscope (SEM) for imaging integrated circuits. The discussion covers the principles of operation and practical techniques of the SEM. The techniques include sample mounting, sample preparation, sputter coating, sample tilt and image composition, focus and astigmatism correction, dynamic focus and image correction, raster alignment, and adjusting brightness and contrast. The article also provides information on achieving ultra-high resolution in the SEM. It concludes with information on the general characteristics and applications of environmental SEM.
Sign in
ASM members
Member Sign InW. Vanderlinde, Scanning Electron Microscopy, Microelectronics Failure Analysis: Desk Reference, 7th ed., Edited By Tejinder Gandhi, ASM International, 2019, p 413–433, https://doi.org/10.31399/asm.tb.mfadr7.t91110413
Download citation file:
Join Failure Analysis Society
The ASM Failure Analysis Society (FAS) is a community where failure analysis professionals from all over the world can learn and grow in their field.