Music wire springs used in a printer return mechanism failed near the bend in the hook portion of the spring during qualification testing. Samples were examined in a scanning electron microscope equipped with an energy-dispersive x-ray microprobe. Fatigue fractures originated at rub marks on the inside edge of the spring. An investigation of loads encountered in service indicated that the springs had been loaded to a large fraction of the yield strength. Redesign of the spring mechanism was recommended.