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wafer-level failure analysis

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Journal Articles
EDFA Technical Articles (2010) 12 (2): 4–11.
Published: 01 May 2010
...Jeng-Han Lee; Yung-Sheng Huang; David H. Su Wafer-level failure analysis plays an important role in IC fabrication, both in process development and yield enhancement. This article outlines the general flow for wafer-level FA and explains how it differs for memory and logic products. It describes...
Journal Articles
EDFA Technical Articles (2000) 2 (4): 25–30.
Published: 01 November 2000
... used during wafer fabrication. Copyright © ASM International® 2000 2000 ASM International contaminant counterdoping IDDQ testing solvent tank state-dependent defects Case History httpsdoi.org/10.31399/asm.edfa.2000-4.p025 0.7 Micron Technology: A Wafer Level Failure Analysis Case Study...
Journal Articles
EDFA Technical Articles (2000) 2 (3): 1–10.
Published: 01 August 2000
... to a specific stepper at the contact layer. Within two days of burn-in we knew the root cause was contact lithography. Armed with this information, the failure analysis lab did fault isolation and found that the failure mecha- (Continued on next page) Fig 2: Reliability versus wafer level yield. ( = 0.0217...
Journal Articles
EDFA Technical Articles (2012) 14 (2): 4–12.
Published: 01 May 2012
... and the extent of CPI-related mechanical failures. However, in the failure analysis laboratory it is very desirable to have a quantitative and sensitive method operating on the wafer level that can offer reasonable throughput for early assessment and monitoring of mechanical BEOL stability. Indentation Scratch...
Journal Articles
EDFA Technical Articles (2014) 16 (3): 4–12.
Published: 01 August 2014
... a significant 90% of the yield loss, it is obvious that they should be investigated as the first priority. Fig. 2 Package-level tester-based FI workflow Fig. 3 Yield-oriented wafer-level tester-based FI workflow 6 Electronic Device Failure Analysis Characterization on Test Vector Responses A second case...
Journal Articles
EDFA Technical Articles (2001) 3 (1): 1–18.
Published: 01 February 2001
... challenges, such as a need to remove the top level of metal without attacking the lower level of metal as well as removing interlevel dielectric layers. At this time, parallel plate plasma etchers entered the failure analysis labs with reactive ion etchers not far behind. They provided an anisotropic...
Journal Articles
EDFA Technical Articles (2022) 24 (3): 4–10.
Published: 01 August 2022
... wafer). Finally, we run a third sample of 1,300,000 trials of a random number generator, normally distributed with = 0 and 2 = 0.5 ( = 0.71), to represent the site-level of variation. Adding these three 5 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 24 NO. 3 Table 1 Comparison of MC population...
Journal Articles
EDFA Technical Articles (2020) 22 (4): 28–33.
Published: 01 November 2020
... recognition at post processing. ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 22 NO. 4 31 Fig. 5 The left side shows a distribution plot of CL intensity against CL emission energy for wafer level hyperspectral data recorded on a 4-in. green LED on sapphire. The p-value of 0.841 shown in the inset represents...
Journal Articles
EDFA Technical Articles (2001) 3 (4): 3–11.
Published: 01 November 2001
... database and pattern sets, the extraction can be automated and the analysis completed within minutes. The logic mapping flow is a natural extension of scan-based diagnosis with the potential to reach new levels of electrical failure analysis without the extensive data collection and resources associated...
Journal Articles
EDFA Technical Articles (2016) 18 (3): 54–55.
Published: 01 August 2016
... the development of advanced packaging solutions, such as fan-in wafer-level chip-scale packaging, fan-out wafer-level packaging, wire-bonded stacked dice, and package-on-package. These technologies are used in mass production and provide significant benefits in form factor but may not give the desired improvement...
Journal Articles
EDFA Technical Articles (2021) 23 (3): 4–7.
Published: 01 August 2021
...] Fig. 2 Optical image of test structures at the center of wafer, showing defects due to the dielectric breakdown between top-level metal straps. edfas.org 5 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 23 NO. 3 Fig. 3 Locations of four failed samples in a wafer are shown in the left image. The variation...
Journal Articles
EDFA Technical Articles (2009) 11 (3): 14–19.
Published: 01 August 2009
... behavior in all statistical levels (within wafer, wafer-to-wafer, lot-tolot, machine-to-machine, time effect). The second is to identify a pattern that is unique to the problem. (A pattern can be any repetition in shape, order, location, timing, etc.) A unique pattern related to the problem at hand...
Journal Articles
EDFA Technical Articles (2022) 24 (3): 32–40.
Published: 01 August 2022
..., the continually shrinking features and growth of heterogeneous packaging and wafer-level packaging drive urgent demand for even higher resolution but on larger samples, including larger packages and on wafers. Currently, gaps in nondestructive 2D and 3D imaging in failure analysis exist due to lack of resolution...
Journal Articles
EDFA Technical Articles (2010) 12 (2): 46–47.
Published: 01 May 2010
..., to enable true adaptive the component life cycle, from initial automatic test test analysis and yield optimization, each device must equipment (ATE) test at wafer and package, during be able to be tracked to the level of wafer lot, wafer burn-in, at the board manufacturing test step, in the number...
Journal Articles
EDFA Technical Articles (2005) 7 (2): 6–12.
Published: 01 May 2005
... Signature Three years ago, the authors were faced with a strange failure mode. Devices were returned to a wafer manufacturer from an assembly fab, who claimed that the devices did not pass the final test after his process, although they passed the final test at the wafer level. Initial optical inspections...
Journal Articles
EDFA Technical Articles (2013) 15 (2): 4–13.
Published: 01 May 2013
... that actively produces electrostatic discharges. Let s return to the first question: how to deal with real ESD failures. Most of them can be detected as time-zero failures at the very first test after wafer level (final device test, PCB, or component test). Although ESD failures can be latent and pass through...
Journal Articles
EDFA Technical Articles (1999) 1 (4): 14–20.
Published: 01 November 1999
...-implanted reference standard and appropriate consideration for the various SIMS artifacts, accuracy to within 2% of the standard value can be achieved with a similar level of relative precision. Applications of SIMS Analysis of ion implanted dopant profiles in silicon test wafers or devices is one...
Journal Articles
EDFA Technical Articles (2018) 20 (4): 24–29.
Published: 01 November 2018
... interposers MEMS devices wafer level fanout packages 2 4 httpsdoi.org/10.31399/asm.edfa.2018-4.p024 EDFAAO (2018) 4:24-29 1537-0755/$19.00 ©ASM International® ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 20 NO. 4 ADVANCED PACKAGING FAULT ISOLATION CASE STUDIES AND ADVANCEMENT OF EOTPR Jesse Alton1 Thomas...
Journal Articles
EDFA Technical Articles (2011) 13 (1): 12–19.
Published: 01 February 2011
... Source, Microsc. Microanal., 2010, 16(Suppl. 2), pp. 222-23. 11. R.J. Young, C. Rue, M. Schmidt, R. Schampers, and D. Wall: Site-Specific Analysis of Advanced Packaging Enabled by Focused Ion Beams (FIB Proc. Int. Wafer Level Packag. Conf., Oct. 11-14, 2010 (Santa Clara, Calif About the Author Richard...
Journal Articles
EDFA Technical Articles (2002) 4 (4): 11–16.
Published: 01 November 2002
... development. She joined Intel in 2001 as the P860 LYA Technology Transfer Engineer at Intel s Portland Technology Development Facility in Oregon. Presently, she is one of the Low Yield Analysis Engineers at Intel, MA, focusing on yield improvement and wafer-level failure analysis on microprocessors...