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Journal Articles
EDFA Technical Articles (2015) 17 (4): 4–12.
Published: 01 November 2015
...Kirk A. Martin; Nancy Weavers This is the second article in a two-part series on how to properly thin curved and highly warped die. Part I, published in the August 2015 issue of EDFA , introduces the concept of contour machining, a CNC technique driven by thickness measurement data, and describes...
Journal Articles
EDFA Technical Articles (2022) 24 (4): 34–38.
Published: 01 November 2022
... thickness measurements. With careful processing, cleaning, and RST measurements, samples can be reliably processed to a 50 μm thickness with a variation of +/- 2.5 μm across the majority of the die. die mounting die thinning remaining silicon thickness sample mounting surface profile thickness...
Journal Articles
EDFA Technical Articles (2015) 17 (3): 20–28.
Published: 01 August 2015
...Kirk A. Martin This article, the first in a two-part series, discusses the challenges of thinning highly warped die and explains how they can be overcome with contour machining driven by thickness measurements. The machine that was used measures die surface profiles in situ, producing a wire frame...
Journal Articles
EDFA Technical Articles (2023) 25 (1): 16–19.
Published: 01 February 2023
...Kirk A. Martin The processes and considerations for locally thinning an area of interest to the desired remaining silicon thickness are described. Copyright © ASM International® 2023 2023 ASM International The processes and considerations for locally thinning an area of interest...
Journal Articles
EDFA Technical Articles (2009) 11 (2): 23–29.
Published: 01 May 2009
...Jason Benz; William Bentley; Joseph Myers Thin film anomalies cause many device failures but they are often difficult to see. In this article, the authors explain how they found and identified an 8 to 10 nm film of tantalum causing pin shorts in a majority of ASIC modules from a particular lot...
Journal Articles
EDFA Technical Articles (2011) 13 (2): 4–11.
Published: 01 May 2011
... and explains how they can be resolved. Copyright © ASM International® 2011 2011 ASM International acoustic microimaging F-number focal length spatial resolution thin-silicon devices httpsdoi.org/10.31399/asm.edfa.2011-2.p004 EDFAAO (2011) 2:4-11 Acoustic Microimaging 1537-0755/$19.00 ©ASM...
Journal Articles
EDFA Technical Articles (2003) 5 (4): 13–24.
Published: 01 November 2003
... etching, and FIB circuit edit and modification. Copyright © ASM International® 2003 2003 ASM International backside analysis laser voltage probing light induced voltage alteration photon emission microscopy thinning httpsdoi.org/10.31399/asm.edfa.2003-4.p013 EDFAAO (2003) 4:13-24 Review ©...
Journal Articles
EDFA Technical Articles (2010) 12 (1): 6–12.
Published: 01 February 2010
...David W. Niles; Ronald W. Kee Designing circuit edits at the contact level offers tremendous advantages in reliability and yield success over similar edits designed in the metal stack. To that end, a full-thickness backside circuit edit strategy has been developed that eliminates part thinning...
Journal Articles
EDFA Technical Articles (2022) 24 (1): 3–10.
Published: 01 February 2022
... procedure and demonstrate its use on complex semiconductor pad stacks. They also present experimental results that shed new light on the relationship between probe tip contact force and crack probability in thin, brittle layers typical of BEOL layer stacks in CMOS ICs. Engineers at Infineon Technologies...
Journal Articles
EDFA Technical Articles (2022) 24 (3): 32–40.
Published: 01 August 2022
... in which the system is used to reveal cracks in thin redistribution layers, voids in organic substrates, and variations in TSV metallization on 300-mm wafers. As the authors explain, each scan can be done in as little as a few minutes regardless of sample size, and the resulting images are clear...
Journal Articles
EDFA Technical Articles (2000) 2 (1): 20–23.
Published: 01 February 2000
... to specific processing errors and suggested how to fix them. Although the investigation relied heavily on traditional observational tools, they were applied in new ways using a relatively new technique, FIB backside thinning, to gain critical proof of nucleation and confirm suspected processing errors...
Journal Articles
EDFA Technical Articles (2000) 2 (3): 12–19.
Published: 01 August 2000
... that require little or no additional thinning for TEM analysis. The method can also be used to prepare plan view TEM samples as well as samples for SEM analysis and light microscopy. Copyright © ASM International® 2000 2000 ASM International cross-section samples plan view samples TEM analysis...
Journal Articles
EDFA Technical Articles (2000) 2 (4): 1–21.
Published: 01 November 2000
... using lowbeam-voltage field-emission scanning electron microscopes (FE-SEMs). In response to this need, a prototype microcalorimeter energy-dispersive spectrometer has been developed. This article discusses the capabilities of the new tool and demonstrates its use in thin-film and particle analysis...
Journal Articles
EDFA Technical Articles (2004) 6 (4): 32–40.
Published: 01 November 2004
... in any SEM using special sample holders. No other modifications are required. Test results presented in the article show that 1 to 2 nm resolution is possible in thin sections, uncoated polysilicon gates, and photoresist. Copyright © ASM International® 2004 2004 ASM International forward...
Journal Articles
EDFA Technical Articles (2008) 10 (1): 12–16.
Published: 01 February 2008
...Nathan Wang; Susan Li A new and improved sample preparation technique was developed by Wang. This technique uses an FIB instrument for the 90° rotation of a small portion of the specimen on the original grid by taking advantage of static force. All sample preparation steps, including thin-section...
Journal Articles
EDFA Technical Articles (2016) 18 (2): 4–10.
Published: 01 May 2016
.... It identifies critical machine parameters and explains how environmental effects, runout, and geometric inaccuracies contribute to uncertainty and positioning error. It also assesses the precision, accuracy, and repeatability required for backside thinning and delayering systems. Failure analysts use...
Journal Articles
EDFA Technical Articles (2016) 18 (4): 24–29.
Published: 01 November 2016
...Ingrid De Wolf Chip-level 3D integration, where chips are thinned, stacked, and vertically interconnected using TSVs and microbumps, brings as many challenges as it does improvements, particularly in the area of failure analysis. This article assesses the capabilities of various FA techniques...
Journal Articles
EDFA Technical Articles (2017) 19 (4): 4–9.
Published: 01 November 2017
... on several pins and in some of the solder material. The cracks were caused by different rates of thermal expansion and were remedied with the help of thermomechanical analysis, EBSD imaging, and phase map comparisons for thick and thin solder joints. In this case study, the author describes...
Journal Articles
EDFA Technical Articles (2017) 19 (4): 36–44.
Published: 01 November 2017
... the backside using automated thinning and large-area plasma FIB delayering. Advantages to this approach include a reduction in manual planarization and depackaging and a higher degree of precision and repeatability. Deprocessing of ICs is often the final step for defect validation in FA cases with limited...
Journal Articles
EDFA Technical Articles (2001) 3 (4): 15–19.
Published: 01 November 2001
... already pushes the limits of SAM resolution. Another major die issue is thin film crackingdelamination exacerbated by increased stress at the die surface, decreased adhesion inherent in Cu/lowk thin films, and the mechanical fragility of the ultra- Fig. 2 Analytical solutions must be compatible...