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EDFA Technical Articles (2001) 3 (4): 37–39.
Published: 01 November 2001
...Stan Silvus This article presents three failure analysis case histories involving the use of silver in electrical applications. The first two failures, that of a relay and a trimming potentiometer, highlight the incompatibilities of silver and sulfur. The third failure, in which several surface...
EDFA Technical Articles (2018) 20 (4): 30–36.
Published: 01 November 2018
... ANALYSIS | VOLUME 20 NO. 4 31 Fig. 9 Copper die pad and aluminum die surface without damage with HNO3-Cu + H2SO4-Al. Fig. 10 SEM photo of Al wire and Al die surface. Fig. 2 SEM photo of Cu wire cross section after decapsulation by nitric/sulfuric acid mix. In this case, the hot water rinse was not used...
EDFA Technical Articles (1999) 1 (2): 1–20.
Published: 01 May 1999
...., B.A. Dodd, and R.E. Anderson, Internal Current Probing of Integrated Circuits Using Magnetic Force Microscopy, 31st Annual Proc. ReI. Phys., 1993 p.l68. NEW PS10l DECAPSULATION SYSTEM Various Etchants : Sulfuric Acid, Fuming Nitric Acid, Mixed Acid Modern Coating Solutions for Today's EM Sample Prep...
EDFA Technical Articles (2009) 11 (3): 20–27.
Published: 01 August 2009
..., emergency lighting, restricted access controls, alarm systems, and adequate fire protection and ventilation systems. Corrosive materials such as hydrofluoric, nitric, and sulfuric acid are commonly used in an FA laboratory. Therefore, the most important safety apparatus in a modern FA laboratory is the fume...
EDFA Technical Articles (2005) 7 (1): 10–14.
Published: 01 February 2005
... techniques that involve nitric or sulfuric acid to remove the molding compound above the die often introduces unwanted artifacts, such as pad corrosion and die or wire bond lifts, when done improperly. Additional problems arise from the decapsulation of GaAs radio frequency devices, which typically have...
EDFA Technical Articles (2019) 21 (3): 8–14.
Published: 01 August 2019
.... However, it does provide a superior method to precisely open well-defined areas on the micron scale. Other source gases are also possible in a pFIB, such as argon, oxygen, nitrogen, helium, and sulfur hexafluoride. While these alternative gases have an inferior milling rate compared to Xe, they provide...
EDFA Technical Articles (2005) 7 (4): 6–14.
Published: 01 November 2005
... via metal pads or other structures that attach to the metal wires of a CMOS circuit, a pin package, or a circuit board. Tour s team has investigated different elements that function as molecular alligator clips for connecting molecular devices to metallic wires. They have studied sulfur, selenium...
EDFA Technical Articles (2020) 22 (1): 30–41.
Published: 01 February 2020
... with NAND flash, NVM erasure, among others. Preparation using chemicals was briefly brought up. Heated sulfuric acid creates sulfates that will attack aluminum. Moisture and temperature play a critical role in the minimization of the attack. Issues related to mixing of acids were also discussed. Thanks...