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solder joints

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Journal Articles
EDFA Technical Articles (2011) 13 (1): 4–11.
Published: 01 February 2011
...Nausha Asrar This article presents two case histories that shed light on the role of gold in lead-free solder joint failures and the damage mechanisms involved. One of the failures, a brittle fracture of the solder joint, is attributed to the synergistic effects of voids, intermetallic compounds...
Journal Articles
EDFA Technical Articles (2006) 8 (1): 16–24.
Published: 01 February 2006
...Martine Simard-Normandin; Melody Murison; Daniel Hebert; Joseph Fersht This article presents a method for determining the integrity of solder joints made from mixed and lead-free solders. It discusses the procedures involved in sample preparation and testing and explains how to interpret...
Journal Articles
EDFA Technical Articles (2004) 6 (4): 26–31.
Published: 01 November 2004
...Stan Silvus Failures of interest in this article usually occur on single-sided, non-plated-through-hole circuit boards. Evidence of failure may be as subtle as crazing (a pattern of small surface cracks) of solder-joint surfaces or as catastrophic as burning of the circuit board. Over time, crazing...
Journal Articles
EDFA Technical Articles (2016) 18 (1): 14–20.
Published: 01 February 2016
...Mototaka Ito; Jun Kato A detailed analysis based on FIB etching and SEM image capture was conducted on a flip-chip solder joint deep inside a tablet PC. 3D views reconstructed from SEM images show what appears to be a copper pillar with a solder cap connected to a copper trace on the substrate...
Journal Articles
EDFA Technical Articles (2017) 19 (4): 4–9.
Published: 01 November 2017
... on several pins and in some of the solder material. The cracks were caused by different rates of thermal expansion and were remedied with the help of thermomechanical analysis, EBSD imaging, and phase map comparisons for thick and thin solder joints. In this case study, the author describes...
Journal Articles
EDFA Technical Articles (2018) 20 (1): 20–31.
Published: 01 February 2018
...Mohammed Genanu; Babak Arfaei; Eric J. Cotts; Francis Mutuku; Eric Perfecto; Scott Pollard; Aric Shorey IBM engineers recently conducted a study to better understand and control the reliability of copper pillar solder joints in 2.5-D packages. Here they describe their approach and the results...
Journal Articles
EDFA Technical Articles (2017) 19 (1): 4–8.
Published: 01 February 2017
... an alternate FA approach that involves grinding away much of the PCB. Copyright © ASM International® 2017 2017 ASM International ball grid arrays BGA failures root cause analysis solder joints soldering defects 4 httpsdoi.org/10.31399/asm.edfa.2017-1.p004 EDFAAO (2017) 1:4-8 1537-0755...
Journal Articles
EDFA Technical Articles (2017) 19 (2): 4–9.
Published: 01 May 2017
... root cause analysis solder joint defects voids 4 httpsdoi.org/10.31399/asm.edfa.2017-2.p004 EDFAAO (2017) 2:4-9 1537-0755/$19.00 ©ASM International® ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 19 NO. 2 FAILURE ANALYSIS ON SOLDERED BALL GRID ARRAYS: PART II Gert Vogel, Siemens AG, Digital Factory...
Journal Articles
EDFA Technical Articles (2016) 18 (1): 30–35.
Published: 01 February 2016
..., and reliability properties of interconnects in microelectronic packaging and microsystem integration are closely related to the formation, growth, and physical properties of the different IMCs formed in the interfaces of solder joint contacts. Metallographic grinding techniques are typically used for cross...
Journal Articles
EDFA Technical Articles (2001) 3 (2): 4–8.
Published: 01 May 2001
... solvent for cleaning coil-termination solder joints. Many consumer food products contain salt (sodium chloride), so if coil-manufacturing personnel handle such foods and then work on coils 6 ELECTRONIC DEVICE FAILURE ANALYSIS NEWS without thoroughly washing their hands, they may introduce chlorine...
Journal Articles
EDFA Technical Articles (2014) 16 (1): 30–31.
Published: 01 February 2014
...) components. The BOS components include all non-PV panel components, such as solder joints, interconnects, capacitors, inverters, junction boxes, and so on. Dr. Yang added that, from a technical perspective, the PV industry s challenges include harsh, dynamic operating environments, a lack of component...
Journal Articles
EDFA Technical Articles (2014) 16 (2): 18–23.
Published: 01 May 2014
... surroundings could help identify if there was any external stress involved. Analyzing the solder joints allows identification of any possible manual rework. Next, external and internal construction of the CAP should be examined. External examination of the CAP is typically conducted using a stereomicroscope...
Journal Articles
EDFA Technical Articles (2015) 17 (1): 32–33.
Published: 01 February 2015
... localization, to localize failures in unique failure compo- solder reflow, shock-induced solder joint liftoff from the nents. Both Ted and Philippe emphasized the importance pad, and solder cracks. Both John and Bobby highlighted of analyzing system behavior to bridge the gap between that accelerated testing...
Journal Articles
EDFA Technical Articles (2018) 20 (1): 4–8.
Published: 01 February 2018
...) or closes (normally open) a connection with the fixed contacts left and right. The pins are soldered to the PCB. Fig. 2 (a) Plastic chip from an edge of the plastic part. (b) Flux particle from a remote solder joint. (c) Solid plastic chip from a plastic part. (d) Flattened plastic particle exactly...
Journal Articles
EDFA Technical Articles (2011) 13 (3): 4–11.
Published: 01 August 2011
... of this type generally create large internal stress and thus important component deformation. On the other hand, especially for large components with tens, hundreds, or even thousands of single solder joints to be done simultaneously, the failurefree solder operation critically depends on the flatness...
Journal Articles
EDFA Technical Articles (2005) 7 (1): 10–14.
Published: 01 February 2005
... cracking, shorts and opens on the die, passivation fracturing, wire bond cratering, excessive intermetallic growth, and poor solder joints (Fig. 5). Highly Accelerated Stress Test A highly accelerated stress test (HAST) is performed to evaluate nonhermetic packaging in humid environments. The use of high...
Journal Articles
EDFA Technical Articles (1999) 1 (2): 15–16.
Published: 01 May 1999
... (Fig. 2) detected strong cWorine content, along with some bromine, in the corrosion products. A vendor audit revealed that the coil manufacturer was using a halide-containing solder flux in terminating the coils and was using cWoroform spray to clean the coil-termination solder joints. Further...
Journal Articles
EDFA Technical Articles (2016) 18 (3): 4–8.
Published: 01 August 2016
... the possibility that the solder joint had been contaminated with a low-temperature solder during manufacture. Because component and PCB manufacturers who provide high-temperature assembly always offer low-temperature products as well, the possibility of inadvertently mixed solder alloys is a constant threat...
Journal Articles
EDFA Technical Articles (2020) 22 (3): 18–25.
Published: 01 August 2020
... such as semiconductor chips (silicon based), metal wires, solder joints, copper vias, intermetallic layer plus underfill, and molding compounds, which are organic materials. The inspection of heavy-elemental components such as metal wires, solder, and copper vias requires the use of highly energetic x-rays...
Journal Articles
EDFA Technical Articles (2012) 14 (1): 14–20.
Published: 01 February 2012
... Digest, www. sat-index.com/failures/. 4. M.S. Mason, G. Eng, M. Leung, G. Stupian, and T. Yeoh: Microanalysis for Tin Whisker Risk Assessment, Proc. 2011 IRPS, 2011, pp. 2G.3.1-2G.3.5. 5. K.N. Tu: Solder Joint Technology: Materials, Properties and Reliability, Springer, New York, 2007. 6. G. Stupian...