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soft failures

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Journal Articles
EDFA Technical Articles (2002) 4 (4): 11–16.
Published: 01 November 2002
...Edward I. Cole, Jr.; Paiboon Tangyunyong; Charles F. Hawkins; Michael R. Bruce; Victoria J. Bruce; Rosalinda M. Ring; Wan-Loong Chong Resistive interconnections, a type of soft failure, are extremely difficult to find using existing backside methods, and with flip-chip packages, alternative front...
Journal Articles
EDFA Technical Articles (2016) 18 (4): 4–14.
Published: 01 November 2016
... macros and show how they are used to diagnose skip test, clock-type, and soft single-latch failures. This article explains how the success rate of in-line scan chain logic macros can be nearly doubled for certain types of failures with the help of laser voltage imaging and laser voltage probing...
Journal Articles
EDFA Technical Articles (2016) 18 (3): 10–16.
Published: 01 August 2016
... ASM International® 2016 2016 ASM International electrically enhanced LADA laser-assisted device alteration soft defect localization soft failures 1 0 httpsdoi.org/10.31399/asm.edfa.2016-3.p010 EDFAAO (2016) 3:10-16 1537-0755/$19.00 ©ASM International® ELECTRONIC DEVICE FAILURE ANALYSIS...
Journal Articles
EDFA Technical Articles (2024) 26 (2): 32–38.
Published: 01 May 2024
... ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 2 acquiring clean repeatable data sets from a reference unit and then extracting the equivalent data from the fail unit. If there is a soft failure or a failure mode that can be modulated by changing the value of the supply voltage at (a) a given clock...
Journal Articles
EDFA Technical Articles (2018) 20 (2): 18–24.
Published: 01 May 2018
... suitable method for isolating the faults of soft failures. ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 20 NO. 2 Although a laser scanning microscope is also employed for LVI/LVP, the technique is quite different from TIVA or CPA. Instead of detecting the electrical characteristic change through the biased...
Journal Articles
EDFA Technical Articles (2010) 12 (2): 4–11.
Published: 01 May 2010
... mentioned approaches work effectively with so-called hard failures, that is, failures that are not very sensitive to testing conditions, such as the applied voltage. However, a different kind of functional failure soft failures is notably difficult to isolate. In recent years, a new class of techniques...
Journal Articles
EDFA Technical Articles (2018) 20 (1): 10–18.
Published: 01 February 2018
...Thierry Parrassin; Laurent Clément Soft electrical failures caused by monograin defects can have a significant impact on yield in technology nodes below 40 nm. Moreover, the failures are hard to identify and the defects give very few signatures during localization testing. In this article...
Journal Articles
EDFA Technical Articles (2014) 16 (3): 4–12.
Published: 01 August 2014
... in debug turnaround time. These failing dice are usually selected from a specific wafer with signature or failure modes (hard or soft fails) of interest. Under the current workflow, there are no prior insights into the electrical failure signatures for the entire population of failing dice. There is a lack...
Journal Articles
EDFA Technical Articles (2004) 6 (1): 6–11.
Published: 01 February 2004
... soft failure time-dependent dielectric breakdown httpsdoi.org/10.31399/asm.edfa.2004-1.p006 EDFAAO (2004) 1:6-11 Ultrathin Oxides 1537-0755/$19.00 ©ASM International Ultrathin Gate Oxide Breakdown: A Failure That We Can Live With? John S. Suehle, National Institute of Standards and Technology...
Journal Articles
EDFA Technical Articles (2018) 20 (3): 24–33.
Published: 01 August 2018
... represents a shift in current flow through the conductor. Typically, an abrupt contrast change is observed on hard open failures and a gradual contrast intensity change is observed on marginal or soft open failures. CURRENT IMAGING Another complementary method for measuring current flow inside a sample...
Journal Articles
EDFA Technical Articles (2009) 11 (2): 30–34.
Published: 01 May 2009
...., Austin, Texas keith.harber@freescale.com Introduction Regardless of the technology node, failure analysis (FA) of soft failures in flash memory arrays can be complex, and successful root-cause analysis often depends on the electrical understanding of the failure. Extensive electrical characterization...
Journal Articles
EDFA Technical Articles (2012) 14 (1): 27–31.
Published: 01 February 2012
... types, the mindset for interpretation of these failures must be changed. Vijay categorized invisible failures from the truly invisible that can only be confirmed with an electrical validation (ionic contamination, hydrogen poisoning, package stresses, intermittency, soft failures, design aberrations...
Journal Articles
EDFA Technical Articles (1999) 1 (4): 21–23.
Published: 01 November 1999
..., extensive voiding can cause unacceptable resistance increases in interconnects, or soft failures. Life testing to assess the susceptibility of an IC technology to stress voiding is, at best, difficult, because acceleration factors can be dis- mally low. If one selects the wrong temperature...
Journal Articles
EDFA Technical Articles (2012) 14 (4): 12–18.
Published: 01 November 2012
... induced resistance change (OBIRCH), and soft defect localization (SDL) for failures in the devices periphery of the array are discussed. The SDL technique may require an adaptation to memory test systems in order to provide high-speed comparison, allowing SDL image acquisition times of a few minutes...
Journal Articles
EDFA Technical Articles (2010) 12 (4): 22–27.
Published: 01 November 2010
... being dynamic laser stimulation (DLS1] To successfully localize a defect, appropriate laser stimulation techniques should be chosen based on the failed device characteristics. Soft and hard defects are the two main types of failure mode. A device affected by a soft defect is usually functional...
Journal Articles
EDFA Technical Articles (2004) 6 (3): 13–18.
Published: 01 August 2004
... International parametric failures resistive interconnection localization soft defect localization timing skew httpsdoi.org/10.31399/asm.edfa.2004-3.p013 EDFAAO (2004) 3:13-18 Parametric Failures 1537-0755/$19.00 ©ASM International Parametric Failures Can Be a Pain in the Backside Jaume Segura...
Journal Articles
EDFA Technical Articles (2016) 18 (2): 16–27.
Published: 01 May 2016
.... Copyright © ASM International® 2016 2016 ASM International FinFETs planar transistors radiation-induced soft errors soft-error susceptibility SRAMs 1 6 httpsdoi.org/10.31399/asm.edfa.2016-2.p016 EDFAAO (2016) 2:16-27 1537-0755/$19.00 ©ASM International® ELECTRONIC DEVICE FAILURE ANALYSIS...
Journal Articles
EDFA Technical Articles (2015) 17 (1): 33–37.
Published: 01 February 2015
..., as technologies continue to advance, the understanding of true device characteristics has become more important for soft failure localization and for process and design characterization. The use of nanoprobing data for true device characterization requires a thorough investigation into the certainty...
Journal Articles
EDFA Technical Articles (2000) 2 (2): 12–24.
Published: 01 May 2000
... that are not evident from simple point data measurements. This information is routinely required for semiconductor failure analysis. For instance, current leakage may have a channel characteristic related to ionic contamination and soft avalanche junction breakdown characteristics may be related to reverse-bias...
Journal Articles
EDFA Technical Articles (2018) 20 (1): 32–35.
Published: 01 February 2018
...Guo Xianxin This article explores the failure of a DC/DC converter without start-up overshoot and provides solutions to a problem that is relevant to space electronic systems. This article explores the failure of a DC/DC converter without start-up overshoot and provides solutions to a problem...