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EDFA Technical Articles (2001) 3 (4): 37–39.
Published: 01 November 2001
...Stan Silvus This article presents three failure analysis case histories involving the use of silver in electrical applications. The first two failures, that of a relay and a trimming potentiometer, highlight the incompatibilities of silver and sulfur. The third failure, in which several surface...
EDFA Technical Articles (2017) 19 (1): 14–20.
Published: 01 February 2017
...Kirk A. Martin; Nancy Weavers Silver bond wires can be protected from damage during acid decapsulation by injecting a corrosion inhibitor into the acid stream. Recent experiments show that the injection of an iodic acid solution is effective over a wide range of process parameters, including etch...
EDFA Technical Articles (2018) 20 (1): 20–31.
Published: 01 February 2018
... International® ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 20 NO. 1 MICROSTRUCTURE AND RELIABILITY OF TIN-SILVER MICRO-COPPER PILLAR ASSEMBLIES Mohammed Genanu1, Babak Arfaei1, Eric J. Cotts1, Francis Mutuku1,2, Eric Perfecto3, Scott Pollard4, and Aric Shorey4 1Physics and Materials Science, Binghamton...
EDFA Technical Articles (2017) 19 (4): 36–44.
Published: 01 November 2017
EDFA Technical Articles (2016) 18 (3): 4–8.
Published: 01 August 2016
...John Bescup This article explains how the failure of a high-voltage capacitor led to the discovery of an unusual defect. Testing showed that the capacitor shorted due to silver migration, which investigators believe was facilitated by voids in the dielectric that had been present from the time...
EDFA Technical Articles (2021) 23 (1): 4–10.
Published: 01 February 2021
... in routine analysis, these decapsulation methods have reached their limits with increasingly complex packages, and the use of a wide variety of materials. Acid etching causes corrosion damage on exposed metallization and bond wires, specifically if these are copper or silver. Conventional plasma...
EDFA Technical Articles (2006) 8 (1): 16–24.
Published: 01 February 2006
...-in, and a transistor, not part of the study, needed to be replaced. The capacitors used in this study were Samsung parts available in regular or green versions, and the BGAs were from Via Technologies, also available in regular and green versions. The balls of the lead-free BGAs were made of a tin-silver-copper (SAC...
EDFA Technical Articles (2016) 18 (1): 22–28.
Published: 01 February 2016
... largerdiameter wire are produced by wedge bonding aluminum or copper, using either round wire or ribbon (a flattened form of round wire). During the past 5 years there has been a major transition in our industry from ball bonding with gold wire to the use of copper, palladium-coated copper, or silver wire...
EDFA Technical Articles (2018) 20 (1): 4–8.
Published: 01 February 2018
... the middle contact of the three terminals on the right in Fig. 1, which connects or disconnects to the left and right contact. Nickel/silver or silver/tin oxide is used as the contact material. Sometimes they are gold plated, but the failure mechanisms are incidental in the cases shown. Fig. 1 X-ray...
EDFA Technical Articles (2002) 4 (4): 29–33.
Published: 01 November 2002
... of less than 50 µm, while ensuring that the gold bonded wire was still attached to the p-type material of the device. The backside of the thinned device was attached to a half copper mesh TEM grid with silver paint, while the gold bond wire remained free. The silver paint made electrical contact between...
EDFA Technical Articles (2010) 12 (4): 44–46.
Published: 01 November 2010
... that take place at each face-to-face meeting are called Shared Learning and Silver Bullets. Shared Learning is a set of presubmitted responses to a series of questions formulated and agreed upon by the members weeks before the meeting. All members who provide Shared Learning in turn receive the written...
EDFA Technical Articles (2022) 24 (2): 4–10.
Published: 01 May 2022
.... Further EDS mapping confirmed the foreign material is silver (Ag). SEM/EDS analysis on more failed LEDs found the same Ag dendrite at the hotspot area between P-GaN and N-GaN, as shown in Figs. 11b and c. After cleaning the Ag dendrite with sulfate, the IV curve of the failing sample becomes the same...
EDFA Technical Articles (2015) 17 (2): 32–33.
Published: 01 May 2015
... with conductive colloidal silver. The paint was fully cured, and the sample was electrically shorted to an SEM sample mount for imaging. RESULT: SUCCESS Figures 1 to 3 illustrate typical results of wet etching on a 28 nm CMOS polished die cross section. Fig. 2 Deep N-well structure with multiple NMOS gates...
EDFA Technical Articles (2018) 20 (4): 30–36.
Published: 01 November 2018
... during acid decapsulation. Due to the new epoxy molding compound (EMC) now in widespread use, manual decapsulation is less and less possible. EMC requires a positive pressure that can only be obtained with an acid pump. In addition, the introduction of copper and silver for wires as well as polyimides...
EDFA Technical Articles (2013) 15 (4): 14–21.
Published: 01 November 2013
...) SIMS depth profile showing a magnesium-doped p-GaN layer, followed by the AlGaN electron-blocking layer, the MQW, the silicon-doped n-superlattice, and n-GaN. Fig. 5 Cree flipped LED device 16 Electronic Device Failure Analysis Fig. 6 Luxeon flipped LED device a reflective surface, usually a silver...
EDFA Technical Articles (2007) 9 (1): 14–18.
Published: 01 February 2007
... geometry but with all Fresnel zone-plate (FZP) optics in combination with the shorter-wavelength O = 13.9/13.2 nm output from a laser-pumped nickel-like silver/cadmium collisionally excited EUV laser. This imaging system reached a spatial resolution of better than 38 nm, unsurpassed for a tabletop system...
EDFA Technical Articles (2013) 15 (4): 22–25.
Published: 01 November 2013
... surface treatments such as silver or an adhesion promoter, and silicon with different metallization and passivation layers. Measurement by BST depends on shear height and shear speed. In addition to characterizations before the Fig. 3 Observed failure mode for a P-DSO-36 heat-slug package (SAM, cross...
EDFA Technical Articles (2004) 6 (1): 25–28.
Published: 01 February 2004
... of signals within the package is desired. The preparation of a short-circuit reference standard to simulate a short at the die/package interface is straightforward. This can be done by applying a conductive film, such as silver conductive paint used for scanning electron microscopy sample preparation...
EDFA Technical Articles (2021) 23 (2): 13–19.
Published: 01 May 2021
... is available at httpsdoi.org/10.1038/nature21698. PXCT can also contribute to other areas of electronics manufacturing. For example, the technique has been used to analyze solders in advanced electronics manufacturing. Here silver sintered powders show benefits over conventional solders in terms...
EDFA Technical Articles (1999) 1 (2): 13–22.
Published: 01 May 1999
... to conclude that the shorts occurred during packaging. The high reliability packaging of these SRAMs is performed by a service company. There are several elevated temperature steps during packaging: die attach (a silver glass material), (see case Histories, page 22) Case Histories, continued pre-seal bake...