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preferential etch

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Journal Articles
EDFA Technical Articles (1999) 1 (4): 9–13.
Published: 01 November 1999
...Margaret Wright Jenkins A new preferential etch for (100) and (111) oriented, p- and n-type silicon has been developed. This article describes the basic chemistry of the etching process and provides examples of how it defines critical features such as oxidation-induced stacking faults, dislocations...
Journal Articles
EDFA Technical Articles (1999) 1 (4): 1.
Published: 01 November 1999
... ER4 and Developments in the Electronics Failure Analysis Industry NOVEMBER 1999 CONTENTS Industry News 2 Failure Analysis A Brief History of ISTFAof a Mixed-Signal .. .4 Contract Lab Review . . . . 5 Roadmaps 6 ANew Preferential Etch .. 9 Secondary Ion Mass Spectrometry, SIMS. . . .. 14 Energy...
Journal Articles
EDFA Technical Articles (2016) 18 (1): 4–12.
Published: 01 February 2016
... in Low Voltage SEM? IEEE Trans. Electron Dev., Feb. 2004, 51(2), pp. 288-92. 8. M.W. Jenkins: A New Preferential Etch for Defects in Silicon Crystals, J. Electrochem. Soc., 1977, 124, pp. 757-59. 9. W.F. Lee, A. Chin, and P.H. Seah: Application of Wright Etch in Failure Analysis on Localized Abnormal...
Journal Articles
EDFA Technical Articles (2021) 23 (1): 4–10.
Published: 01 February 2021
... of an atmospheric oxygen-only plasma and its use for root cause failure analysis of complex semiconductor structures. ARTIFACT-FREE ATMOSPHERIC PRESSURE MICROWAVE-INDUCED PLASMA DECAPSULATION Decapsulation is conventionally carried out using acids or low-pressure reactive ion etching (RIE). While successfully used...
Journal Articles
EDFA Technical Articles (2021) 23 (4): 4–13.
Published: 01 November 2021
... a delayering framework for 130 nm technology was adapted and used on a 45 nm SPI module consisting of 11 metal layers, 10 via layers, two layers of polysilicon, and an active silicon layer. It explains how different polishing and etching methods are used to expose each layer with sufficient contrast for SEM...
Journal Articles
EDFA Technical Articles (2023) 25 (1): 4–8.
Published: 01 February 2023
... commonly using a focused ion beam (FIB), enables studying samples from real components (i.e., devices that may Fig. 1 SEM images of a Si-based lift-out biasing chip. The Si-based chip supports a thin membrane and Pt electrodes that are patterned up to a trench etched through the membrane which...