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plasma FIB delayering

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Journal Articles
EDFA Technical Articles (2019) 21 (3): 4–6.
Published: 01 August 2019
... plasma FIB. Both systems were used to delayer an Intel 14 nm processor from M8 down to the transistor contacts. As the images in the article show, a 100 × 100 µm window was opened by the Xe plasma FIB and a 20 × 20 µm window was opened with the Ga FIB. Related issues such as processing time, end point...
Journal Articles
EDFA Technical Articles (2016) 18 (1): 30–35.
Published: 01 February 2016
... delayering PFIB milling plasma focused ion beam site-specific analysis 3 0 httpsdoi.org/10.31399/asm.edfa.2016-1.p030 EDFAAO (2016) 1:30-35 1537-0755/$19.00 ©ASM International® ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 18 NO. 1 PLASMA FIB PROVIDES VITAL DELAYERING AND SITESPECIFIC FAILURE ANALYSIS...
Journal Articles
EDFA Technical Articles (2017) 19 (4): 36–44.
Published: 01 November 2017
... the backside using automated thinning and large-area plasma FIB delayering. Advantages to this approach include a reduction in manual planarization and depackaging and a higher degree of precision and repeatability. Deprocessing of ICs is often the final step for defect validation in FA cases with limited...
Journal Articles
EDFA Technical Articles (2021) 23 (4): 4–13.
Published: 01 November 2021
... etching behavior. As a delayering technique, RIE can be limited by the material of interest particularly if it can contaminate RIE chambers, such as copper, making it difficult to use for fabrication intended systems. The P-FIB is a state-of-the-art dry etching tool that sources ions from a xenon plasma...
Journal Articles
EDFA Technical Articles (2017) 19 (1): 26–40.
Published: 01 February 2017
... and size of the depletion zone and to verify dopant process parameters. EBAC, on the other hand, allows the localization of opens and shorts within Dr. Tomá Hrn of Tescan, Czech Republic, presented xenon plasma FIB delayering and nanoprobing on an Intel 14 nm sample. Using a commercially available Intel...
Journal Articles
EDFA Technical Articles (2023) 25 (2): 4–8.
Published: 01 May 2023
... through electrical testing or x-ray imaging, then the FIB can drill down to the exact site and image the defect. Though it cannot perform whole-chip delayering, the FIB has the advantage of being able to etch a small area and repair a broken metal trace or via by depositing platinum atoms through...
Journal Articles
EDFA Technical Articles (2019) 21 (3): 8–14.
Published: 01 August 2019
... of advancements in gas-assisted etching, ion source alternatives, compact spectroscopy, and high-speed lasers. Copyright © ASM International® 2019 2019 ASM International automated IC deprocessing large area delayering plasma FIB SEM imaging spectroscopy 8 httpsdoi.org/10.31399/asm.edfa.2019-3...
Journal Articles
EDFA Technical Articles (2023) 25 (3): 54–55.
Published: 01 August 2023
... for ever thinner remaining silicon thickness or even complete removal of bulk silicon without affecting device functionality. Plasma FIB (PFIB) planar delayering has become popular at the advanced nodes due to aggressive scaling of interconnect Zhang layers. Delayering of thick upper metal Cu layers...
Journal Articles
EDFA Technical Articles (2019) 21 (3): 16–24.
Published: 01 August 2019
... or backside. 2) Delayering: Process of removing materials layer by layer for imaging and analysis. Wet/dry plasma etching, FIB, or polishing are used for delayering the chip. 3) Imaging: After exposing a new layer, high-resolution images are collected and stitched together for extracting netlists. Commonly...
Journal Articles
EDFA Technical Articles (2021) 23 (4): 14–17.
Published: 01 November 2021
... the location of the defect. Figure 5b shows the ACKNOWLEDGMENT The authors would like to acknowledge J. Myers and R. Russotti for the FIB analysis shown. resulting EBAC signal, isolating the perimeter via chain fail down to one link. The sample was then resized and sectioned in a tri-beam FIB using a Ga beam...
Journal Articles
EDFA Technical Articles (2016) 18 (4): 30–40.
Published: 01 November 2016
... complex semiconductor packages. After identifying pressing issues and potential bottlenecks with state-of-the-art FA flows, the authors present two case studies demonstrating the capabilities of electro-optical terahertz pulse reflectometry (EOTPR), plasma FIB milling, and 3D X-ray imaging. The FA results...
Journal Articles
EDFA Technical Articles (2018) 20 (1): 36–S-6.
Published: 01 February 2018
... simulation, excellent imaging and nanomachining control, and ultrafast secondary ion mass spectrometry (SIMS) acquisition. Sharang, from Tescan Orsay, presented the second talk, Delayering Capabilities Using Xe+ Plasma FIB and Associated In Situ Nanoprobing Operations. He began by showing impressive...
Journal Articles
EDFA Technical Articles (2021) 23 (2): 33–37.
Published: 01 May 2021
... prepared by our panel as conversation starters. Moderator Valerie Brogden kicked off the talks with a discussion of the experimental results obtained on the Hydra multi-species Plasma FIB. Experiments were run to compare yields with various ions (O+, N+, Ar+, Xe+ vs Ga+) at different accelerating voltages...
Journal Articles
EDFA Technical Articles (2022) 24 (1): 33–42.
Published: 01 February 2022
... in conjunction with their plasma FIB, while the Zeiss uses a laser built into their LMIS gallium crossbeam. Discussions followed with the two panelists about tool utilization, speed and workflow optimization, damage heating zone of femtosecond vs picosecond lasers, subsequent analysis by 3D x-ray, prep...
Journal Articles
EDFA Technical Articles (2001) 3 (1): 12–14.
Published: 01 February 2001
..., plasma (RIE) etcher, cross sectioning tools, optical microscopes (stereo and metallurgical), decapsulation equipment, an FIB, and an x-ray system. Of course, all of the equipment must have high quality image capture capability. Put all this in a lab that has at least some access for daylight (a safety...
Journal Articles
EDFA Technical Articles (2020) 22 (1): 30–41.
Published: 01 February 2020
... of primary applications and tool configurations. easy access to one of these tools. As the majority of the attendees were sectioning/imaging/ STEM-TEM users, the session began there. Lukas Hladik from Tescan presented on the art of large area planar delayer by xenon plasma FIB, and the Richard Young from...
Journal Articles
EDFA Technical Articles (2019) 21 (1): 32–41.
Published: 01 February 2019
.... The urgency to come up with new cooling solutions was voiced. For nanoprobing, the plasma FIB is being used to achieve uniform including: lock-in thermography, 3D packaging technol- and quicker results for sample prep. The idea of adding an ogy impact on probing, challenges for sample prep, cross argon ion...