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life testing

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Journal Articles
EDFA Technical Articles (1999) 1 (2): 13–22.
Published: 01 May 1999
...J.M. Soden; C.L. Henderson; E.I. Cole, Jr. Sandia National Laboratories manufactures 0.5 µm CMOS ICs using local oxidation of silicon (LOCOS) and shallow trench isolation (STI) technologies. A program based on burn-in and life tests is being used to qualify the process for military and space...
Journal Articles
EDFA Technical Articles (1999) 1 (4): 21–23.
Published: 01 November 1999
...William F. Filter Stress voiding is an insidious IC failure mechanism that can be difficult to identify and arrest. It is of particular concern to those who produce and test ICs with aluminum-alloy interconnects or who assess the reliability of legacy devices with long service life. This article...
Journal Articles
EDFA Technical Articles (2008) 10 (1): 18–22.
Published: 01 February 2008
... becomes important during the life of the component. However, since stress testing is not conducted on the IC itself, errors are possible. A miscalculation in IC design can result in more than the expected stress on an IC element. A layout flaw can create a weak spot. Processing variations may produce...
Journal Articles
EDFA Technical Articles (2013) 15 (4): 22–25.
Published: 01 November 2013
..., can lead to complete malfunction of the component. Standard test procedures to prove the reliability are extremely time-consuming. End-of-life testing requirements force the development of accelerated reliability stress test concepts. New test procedures should be established to generate specific...
Journal Articles
EDFA Technical Articles (2014) 16 (3): 14–19.
Published: 01 August 2014
... is important. A passivation defect located at the negative end of a metal strip reduces lifetime significantly more than a defect located farther downstream.[4] A life test of microwave power transistors[5] attaches the electromigration mechanism to shorted junction failure, not just open metal. Nevertheless...
Journal Articles
EDFA Technical Articles (2017) 19 (1): 14–20.
Published: 01 February 2017
..., similar results have been achieved on test samples with pure silver wire using a higher concentration inhibitor solution. Both solutions have very long shelf life and are relatively safe to handle. Copyright © ASM International® 2017 2017 ASM International acid decapsulation corrosion...
Journal Articles
EDFA Technical Articles (2006) 8 (4): 32–34.
Published: 01 November 2006
...Jerry Soden This feature periodically visits significant moments in the life of ISTFA over the past three decades. This article reviews key events from past International Symposium for Testing and Failure Analysis events, held in 1976, 1986, and 1996. Copyright © ASM International® 2006 2006...
Journal Articles
EDFA Technical Articles (2015) 17 (1): 32–33.
Published: 01 February 2015
... failure modes. Other questions aimed at clarifying the COTS qualification, accelerated life testing, and destructive physical analysis methodologies. The attendees and panelists also discussed the complexity of the customer-manufacturer relationship and the inevitable identification of a responsible...
Journal Articles
EDFA Technical Articles (2001) 3 (1): 12–14.
Published: 01 February 2001
... and observations obtained from the analyses of several ICs. Copyright © ASM International® 2001 2001 ASM International construction analysis test method evaluation Construction Analysis httpsdoi.org/10.31399/asm.edfa.2001-1.p012 Construction Analysis, What (Good) is it? Tony Denboer Integrated Circuit...
Journal Articles
EDFA Technical Articles (2011) 13 (3): 46–48.
Published: 01 August 2011
... an extra delay in a scan test. The reject could not be localized with static techniques such as photoemission or OBIRCH. Moreover, from one life test we had five rejects that failed in exactly the same manner, so naturally the fab was anxious to completely understand this problem. We discovered that one...
Journal Articles
EDFA Technical Articles (2012) 14 (2): 22–27.
Published: 01 May 2012
... for failures initiated during a high-temperature operating life test) The Proceedings of ESREF 2011 are published in Microelectronics Reliability (Volume 51, Issues 9-11, 2011). The next ESREF conference will be held October 1 to 5, 2012, in Cagliari, Sardinia, Italy. This event will be very special because...
Journal Articles
EDFA Technical Articles (2020) 22 (3): 8–15.
Published: 01 August 2020
... to estimate a latent failure rate may be faced. For a new product, at the design and qualification step and before manufacturing, reliability tests, such as high temperature operating life (HTOL) tests, are run to accelerate product life and record failures at test end (test duration is calibrated...
Journal Articles
EDFA Technical Articles (2012) 14 (2): 28–29.
Published: 01 May 2012
... of Testing and Inspection Data Generated from Counterfeit Parts Inspection Bhanu Sood* and Paula M. George** *Center for Advanced Life Cycle Engineering, University of Maryland **Defense Logistics Agency J3314 bpsood@calce.umd.edu Paula.George@dla.mil Counterfeit electronic parts have become a significant...
Journal Articles
EDFA Technical Articles (2010) 12 (2): 46–47.
Published: 01 May 2010
..., to enable true adaptive the component life cycle, from initial automatic test test analysis and yield optimization, each device must equipment (ATE) test at wafer and package, during be able to be tracked to the level of wafer lot, wafer burn-in, at the board manufacturing test step, in the number...
Journal Articles
EDFA Technical Articles (2011) 13 (2): 47–48.
Published: 01 May 2011
... © ASM International® 2011 2011 ASM International aerospace industry counterfeit parts httpsdoi.org/10.31399/asm.edfa.2011-2.p047 Guest Columnist G-19A Test Laboratory Standards Bhanu Sood, Center for Advanced Life Cycle Engineering, University of Maryland bpsood@calce.umd.edu Determining...
Journal Articles
EDFA Technical Articles (2006) 8 (2): 28–34.
Published: 01 May 2006
.... This will be followed by extensive reliability characterization and evaluation, including dynamic burnin and high-temperature dynamic and static life testing that exceeds the requirements of Military Specification 883. This will establish the production readiness of the VA260 base array for use in highconsequence...
Journal Articles
EDFA Technical Articles (2009) 11 (2): 6–14.
Published: 01 May 2009
...-life testing that resulted in one of the output channels failing to switch. Figure 13 shows a simplified circuit diagram for the Class D amplifier. The typical approach of fault localization with TRE is to trace the signal path by looking at the input and outputs of each circuit block and comparing...
Journal Articles
EDFA Technical Articles (2008) 10 (1): 30–33.
Published: 01 February 2008
...Martin Keim; Tom Woods The organizer and moderator of the ISTFA 2007 panel discussion on failure analysis and testing of medical devices provide a summary of the discussion topics and areas of focus. Copyright © ASM International® 2008 2008 ASM International ISTFA panel discussion...
Journal Articles
EDFA Technical Articles (2018) 20 (4): 16–22.
Published: 01 November 2018
...Peter Jacob Automotive electronics are exposed to mechanical shock and vibration, thermal cycling, chemical attack, current and voltage spikes, electromagnetic interference, and other hazards. Early life failures, which are not uncommon, can be difficult to diagnose due to the many contributing...
Journal Articles
EDFA Technical Articles (2008) 10 (1): 6–11.
Published: 01 February 2008
...Stan Silvus A large dc motor in a servo positioning system began behaving erratically whenever the rotor was in certain positions. This article describes the examinations and tests that were conducted to determine the root cause of failure, which turned out to be a shorted motor winding stemming...