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junction delineation

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Journal Articles
EDFA Technical Articles (2000) 2 (1): 1–9.
Published: 01 February 2000
...Michael Strizich Electron beam induced current (EBIC) analysis is a versatile tool that can be used by anyone with access to a SEM. This article explains how failure analysts are using the EBIC mode in SEMs to detect junction and oxide defects, simplify junction delineation, and reveal subsurface...
Journal Articles
EDFA Technical Articles (2015) 17 (2): 32–33.
Published: 01 May 2015
...Doug Hamilton; Phoumra Tan Lightly doped source-drain diffusions are difficult if not impossible to delineate using wet chemical etching, but with a few process modifications and the use of edge shorting, a 20:1 HNO 3 /HF etch for 5 s at room temperature can reveal almost any junction profile...
Journal Articles
EDFA Technical Articles (2001) 3 (2): 15–17.
Published: 01 May 2001
...Hal Edwards Scanning capacitance spectroscopy (SCS) is a new way to use a scanning capacitance microscope (SCM) to delineate pn junctions in silicon devices. SCS produces two-dimensional pn junction maps with features as small as 10 nm. It can also estimate the pn junction depletion width and hence...
Journal Articles
EDFA Technical Articles (2013) 15 (2): 22–30.
Published: 01 May 2013
.... Sam.Subramanian@freescale.com Introduction Even after precise fault isolation, visualization of dopant-related anomalies in integrated circuits is extremely challenging. Usually, selective chemical staining techniques[1,2] are used to delineate p-n junctions. However, junction staining can be inconsistent because...
Journal Articles
EDFA Technical Articles (2010) 12 (2): 4–11.
Published: 01 May 2010
.... Failure Analysis Integr. Circuits (IPFA), June 27-July 1, 2005, pp. 285-89. 7. W.T. Chang, T.E. Hsieh, G. Zimmermann, and L. Wang: Advanced Static Random Access Memory Soft Fail Analysis Using Nanoprobing and Junction Delineation Transmission Electron Microscopy, Vac. Sci. Technol., 2007, B25, pp. 202...
Journal Articles
EDFA Technical Articles (2011) 13 (4): 14–19.
Published: 01 November 2011
... the techniques, SCM is most extensively developed and applied in FA due to its relatively easier sample preparation and short turnaround time. Although the junction location determined by SCM can be subject to surface quality and sample bias,[1-5] the problem can be mitigated by using a good sample as reference...