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focused ion beam

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Journal Articles
EDFA Technical Articles (2014) 16 (3): 20–23.
Published: 01 August 2014
...Taqi Mohiuddin This article discusses recent improvements in FIB circuit edit as well as general uses and optimization techniques. Copyright © ASM International® 2014 2014 ASM International FIB circuit edit focused ion beam httpsdoi.org/10.31399/asm.edfa.2014-3.p020 EDFAAO (2014) 3:20...
Journal Articles
EDFA Technical Articles (2000) 2 (4): 10–11.
Published: 01 November 2000
...Guy Perez; Florence Fos; Bruno Benteo; Romain Desplats High-frequency devices such as monolithic microwave ICs (MMICs) are used in telecommunication devices as well as in satellites for earth imaging and radar applications. This article discusses the use of focused ion beam (FIB) cross sectioning...
Journal Articles
EDFA Technical Articles (2001) 3 (1): 35–35C.
Published: 01 February 2001
...Rose M. Ring; Rama R. Goruganthu; Leslie Stevenson Flip chip mounted devices are difficult debug using conventional FIB tools because their internal circuitry is not easily accessible. New flip chip focused ion beam (FC FIB) systems overcome this limitation, however, making it possible to access...
Journal Articles
EDFA Technical Articles (2004) 6 (2): 6–11.
Published: 01 May 2004
... circuits IC repair httpsdoi.org/10.31399/asm.edfa.2004-2.p006 EDFAAO (2004) 2:6-11 FIB Tunable Circuits 1537-0755/$19.00 ©ASM International Focused Ion Beam (FIB) Tunable Circuits Richard S. Flores, Sandia National Laboratories floresr@sandia.gov Introduction Many challenges and uncertainties...
Journal Articles
EDFA Technical Articles (2011) 13 (1): 12–19.
Published: 01 February 2011
...Richard J. Young Packaging integration continues to increase in complexity, driving more samples into FA labs for development support and analysis. For many of the jobs, there is also a need for larger removal volumes, compounding the demand for tool time and throughput. Focused ion beam (FIB...
Journal Articles
EDFA Technical Articles (2016) 18 (1): 30–35.
Published: 01 February 2016
...Surendra Madala Plasma focused ion beam (PFIB) systems can generate ion beams with much higher current and are therefore able to remove larger volumes of material at much faster rates while still maintaining precise control of the beam and its milling action. This article explains how the improved...
Journal Articles
EDFA Technical Articles (2013) 15 (1): 37–40.
Published: 01 February 2013
... This article provides a summary of the presentations given at the four User’s Group meetings at ISTFA 2012. Each user group focused on one of the following topics: nanoprobing, contactless fault isolation, focused ion beam, and sample preparation. Copyright © ASM International® 2013 2013 ASM...
Journal Articles
EDFA Technical Articles (2009) 11 (2): 23–29.
Published: 01 May 2009
.... Initial attempts to delayer some of the failed modules resulted in the loss of the failure signal. It was then decided to use a focused ion beam to selectively mill through the interlayer dielectric. During milling, a secondary electron image revealed anomalous material between the fingers of a power...
Journal Articles
EDFA Technical Articles (2014) 16 (1): 31–48.
Published: 01 February 2014
... This article compiles summaries of User Group meetings held at ISTFA 2013, including the Contactless Fault Isolation User’s Group, the Focused Ion Beam User’s Group, the Sample Prep/3D Package User’s Group, and the Nanoprobing User’s Group. For each meeting, a brief synopsis of the presentations...
Journal Articles
EDFA Technical Articles (2015) 17 (4): 14–20.
Published: 01 November 2015
.... They describe each step of the analog circuit editing process, explaining how they deposit, characterize, and connect matched resistors using focused ion beam techniques. During a silicon debug, it was found that the gain of a radio receiver circuit dropped dramatically at certain frequencies due...
Journal Articles
EDFA Technical Articles (2019) 21 (1): 32–41.
Published: 01 February 2019
... “Failures Worth Analyzing.” It concludes with discussion highlights from the Focused Ion Beam, Sample Preparation, and Contactless Fault Isolation/Nanoprobing user group meetings held at the conference. Copyright © ASM International® 2019 2019 ASM International ISTFA 3 2 httpsdoi.org/10.31399...
Journal Articles
EDFA Technical Articles (2021) 23 (2): 33–37.
Published: 01 May 2021
...Tejinder Gandhi; Anita Madan; Ted Kolasa This article provides a recap and summaries of the EDFAS Virtual User Group Workshop held in January 2021. The summaries cover key participants, presentation topics, and discussion highlights from the Focused Ion Beam, Sample Preparation, Contactless Probing...
Journal Articles
EDFA Technical Articles (2023) 25 (2): 9–13.
Published: 01 May 2023
...David Akerson This article provides an introduction to focused ion beam (FIB) circuit editing, covering the basic process along with best practices and procedures. This article provides an introduction to focused ion beam (FIB) circuit editing, covering the basic process along with best...
Journal Articles
EDFA Technical Articles (2000) 2 (4): 4–23.
Published: 01 November 2000
...Jeremy A. Walraven; Kenneth A. Peterson This article describes how focused ion beam (FIB) technology is being used in combination with various other analytical tools for failure and yield analysis of MEMS devices. It provides examples showing how FIB is used with TEM analysis, AFM analysis...
Journal Articles
EDFA Technical Articles (2012) 14 (1): 27–31.
Published: 01 February 2012
... This article provides a summary of each of the four User’s Group meetings that took place at ISTFA 2011. The summaries cover key participants, presentation topics, and discussion highlights from each of the following groups: Group 1, Focused Ion Beam; Group 2, 3D Packaging and Failure Analysis...
Journal Articles
EDFA Technical Articles (2008) 10 (3): 6–16.
Published: 01 August 2008
... that will be necessary to keep FIB-based etching, milling, and deposition viable in the future. Copyright © ASM International® 2008 2008 ASM International copper deposition dielectrics etching FIB circuit edit focused ion beam interconnect milling httpsdoi.org/10.31399/asm.edfa.2008-3.p006 EDFAAO...
Journal Articles
EDFA Technical Articles (2011) 13 (2): 12–18.
Published: 01 May 2011
... for interconnects as technology features shrank below the 250 nm node. For multiple reasons, thick copper planes are used. Milling through these thick copper planes to enable CE access has been tremendously challenging and time-consuming. A successful focused ion beam (FIB) edit recipe must 12 Electronic Device...
Journal Articles
EDFA Technical Articles (2023) 25 (4): 12–16.
Published: 01 November 2023
..., et al.: Focused Ion Beam (FIB) for Chip Circuit Edit and Fault Isolation, Proc. Int. Symp. Test. Fail. Anal. (ISTFA), 2021, p. 73-79, doi.org/10.31399/asm.cp.istfa2021tph1. 10. M. Abramo, et al.: FIB Backside Isolation Techniques, Microelectronic Failure Analysis Desk Reference 2001 Supplement...
Journal Articles
EDFA Technical Articles (2014) 16 (1): 18–23.
Published: 01 February 2014
.../asm.edfa.2014-1.p018 EDFAAO (2014) 1:18-23 1537-0755/$19.00 ©ASM International® FIB-SEM Workshop Review Sixth FIB-SEM Workshop Nicholas Antoniou, Center for Nanoscale Systems, Harvard University nicholas@cns.fas.harvard.edu More than six years ago, a group of focused ion beam (FIB) and scanning electron...
Journal Articles
EDFA Technical Articles (2018) 20 (2): 26–32.
Published: 01 May 2018
.... lucille.giannuzzi@expresslo.com INTRODUCTION The ability to apply focused ion beam (FIB) milling to just about any material for site-specific scanning/ transmission electron microscopy (S/TEM) was realized in the mid 1990s to early 2000s. The first technique used to extract or lift out site-specific FIB milled...