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finite element modeling

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Journal Articles
EDFA Technical Articles (2017) 19 (4): 12–20.
Published: 01 November 2017
..., confirming the validity of each approach. Copyright © ASM International® 2017 2017 ASM International C-V curves dielectric coefficient doping concentration finite element modeling scanning microwave impedance microscopy 1 2 httpsdoi.org/10.31399/asm.edfa.2017-4.p012 EDFAAO (2017) 4:12-20...
Journal Articles
EDFA Technical Articles (2002) 4 (1): 5–10.
Published: 01 February 2002
... the effect of filled holes. We used the Ansys finite element program (Ansys Inc., Cannonsburgh, Pa.) for this study. Figure 3 shows a simple, 3-dimensional model with periodic boundary conditions used to examine the effects of pure bending on a substrate-like structure. The model was run with unfilled vias...
Journal Articles
EDFA Technical Articles (2007) 9 (4): 48–51.
Published: 01 November 2007
... advances in microsystems simulation software (finite-element computer-aided engineering and system modeling software) may surprise failure analysts who have not been monitoring the technology. Products such as MEMS-Pro (SoftMEMS, Los Gatos, Calif.) and CoventorWare (Coventor, Cary, N.C for example...
Journal Articles
EDFA Technical Articles (2010) 12 (3): 10–18.
Published: 01 August 2010
... finite-difference model. A three-dimensional mesh and temperatureindependent material properties were used to describe the thermal geometry. Steady-state temperature solutions were calculated with a commercial finitedifference solver. Thermal profiles were calculated for several areas in the test...
Journal Articles
EDFA Technical Articles (2012) 14 (3): 4–11.
Published: 01 August 2012
... closely together in a 3-D package. Electrical and thermomechanical behavior as well as thermal management become is- sues with high complexity. Intensive use of finite-element modeling (FEM) simulation Fig. 1 Schematic drawing of a pressure sensor SiP. Courtesy of Infineon Technologies AG Volume 14, No. 3...
Journal Articles
EDFA Technical Articles (2001) 3 (3): 7–11.
Published: 01 August 2001
..., memory elements, and analog components are all used in testing. See Aitken9 or recent proceedings of the International Test Conference for more details on these. While these models are used in TBFL, in general it is better to start with those 9 Fault Models FAULT MODELS, continued listed earlier...
Journal Articles
EDFA Technical Articles (2017) 19 (3): 22–27.
Published: 01 August 2017
... and the quasi-3-D model show different behavior, but the overall trend is similar. Indeed, greater differences are expected for a more complete 3-D model done via finite-element methods or some other technique. The behavior demonstrated in Fig. 2(b) motivates the idea of using a sample with a series of known...
Journal Articles
EDFA Technical Articles (2008) 10 (4): 30–32.
Published: 01 November 2008
... of EDA tools and methodologies that will allow circuit designers to use the technology.[8] Design tools remain a weak link in the 3-D infrastructure, with better thermal modeling, finite-element analysis, floor planning, and layout tools required for a smooth 3-D design flow. Current design tools used...
Journal Articles
EDFA Technical Articles (2011) 13 (3): 4–11.
Published: 01 August 2011
... of the various system materials and thus create internal stress. Controlling and minimizing this internal stress has long been an important issue when dealing with the reliability expectations of any electronic system. Finite-element (FE) modeling is commonly used to forecast the consequences of temperature...
Journal Articles
EDFA Technical Articles (2005) 7 (3): 6–12.
Published: 01 August 2005
... the general three-dimensional nature of the microstructure of the specific structure by a cross section through the center of that structure. Due to strong adherence to the predictions of Moore s Law,[1] the dimensions of structural elements of microelectronic parts have been shrinking by a factor of 70...
Journal Articles
EDFA Technical Articles (2020) 22 (2): 4–12.
Published: 01 May 2020
... 309, p. 533 537. 8. S.P. Lo, Y.Y. Lin, and J.C. Huang: Analysis of Retaining Ring Using Finite Element Simulation in Chemical Mechanical Polishing Process, Int. J. Adv. Manuf. Technol., 2007, 34, p. 547 555. 9. B.G. Ko, H.C. Yoo and J.G. Park: Effects of Pattern Density on CMP Removal Rate...
Journal Articles
EDFA Technical Articles (1999) 1 (3): 6–17.
Published: 01 August 1999
... wires or logical nets with high confidence. Figure 1 shows the basic design and diagnosis process using scan. First, a structural or logic-level IC design is created representing the IC as logic gates (AND, OR, INVERT, etc.) and sequential storage elements (e.g., latches and flip-flops). Fault models...
Journal Articles
EDFA Technical Articles (2012) 14 (1): 27–31.
Published: 01 February 2012
... the tools of simulation and models of the manifestation of electrical signature to its failing element. The second speaker, Chris Schuermyer, a product leader at Mentor Graphics, said that finding the invisible defect requires an evolution in the way we think about the role of FA. In its most fundamental...
Journal Articles
EDFA Technical Articles (2019) 21 (3): 16–24.
Published: 01 August 2019
..., the semiconductor industry has evolved toward a horizontal business model. However, the involvement of third party intellectual property (IP) owners and offshore foundries has raised concerns regarding security and trust. Outsourcing design and fabrication invites vulnerability regarding malicious activities...