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failure mode verification

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Journal Articles
EDFA Technical Articles (2010) 12 (2): 4–11.
Published: 01 May 2010
... the tools and procedures used for failure mode verification, electrical analysis, fault localization, sample preparation, chemical analysis, and physical failure analysis. It also discusses the importance of implementing corrective actions and tracking the results. Wafer-level failure analysis plays...
Journal Articles
EDFA Technical Articles (1999) 1 (2): 4–6.
Published: 01 May 1999
... sophisticated equipment such as pattern generators and logic analyzers. In anticipation of further increases in pin count and density, a new class of small footprint testers is emerging. These portable systems, called ASIC verification testers, facilitate the transfer of ATE test programs to failure analysis...
Journal Articles
EDFA Technical Articles (2017) 19 (4): 22–34.
Published: 01 November 2017
... the signal locations is able to explain the root cause of the failure. In such scenarios, simple layout analyses suffice. For more complicated failure modes, ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 19 NO. 4 (a) (b) Fig. 1 Layout trace of suspected failing net connecting (a) single emission hotspot and (b...
Journal Articles
EDFA Technical Articles (2021) 23 (3): 8–12.
Published: 01 August 2021
...Mathias Heitauer; Martin Versen This article presents an automation workflow for the development of analog and mixed-signal devices similar to the two-stage process used for the design and verification of logic ICs. The use of a co-simulation interface makes it possible to build and verify failure...
Journal Articles
EDFA Technical Articles (2018) 20 (1): 10–18.
Published: 01 February 2018
... analysis localization because of its dynamic failure mode with a test sequence that is hard to set up. It does not show abnormality in parametric measurements when probing isolated transistors, because of its transient electrical activation. Finally, it does not show visible and morphological defects...
Journal Articles
EDFA Technical Articles (2000) 2 (3): 4–7.
Published: 01 August 2000
...Jeremy A. Walraven; Kenneth A. Peterson Experiments to assess microelectromechanical systems (MEMS) test their functionality and materials properties. These experiments provide knowledge and insight into MEMS failure modes and potential pathways to improve the lifetime of MEMS devices. This article...
Journal Articles
EDFA Technical Articles (2009) 11 (2): 23–29.
Published: 01 May 2009
... verification confirmed the fails and revealed that the short was to a particular power supply. Initial Analysis A total of four failing ASIC modules were submitted for physical analysis. The modules were a sampling of maverick fails from a particular module lot and were identified as shorted pin failures...
Journal Articles
EDFA Technical Articles (2017) 19 (3): 22–27.
Published: 01 August 2017
... International® ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 19 NO. 3 PRACTICAL QUANTITATIVE SCANNING MICROWAVE IMPEDANCE MICROSCOPY St.J. Dixon-Warren and B. Drevniok, TechInsights Inc. sdixonwarren@techinsights.com INTRODUCTION Scanning probe microscopy (SPM)-based electrical measurement techniques,[1...
Journal Articles
EDFA Technical Articles (2014) 16 (4): 4–12.
Published: 01 November 2014
... of critical terms can cloud our thinking. Important examples include the terms failure, cause, root cause, failure mode, and failure mechanism. Failure. In the definition above, failure refers to the failure event. (The product stopped working.) For convenience, the word failure is sometimes loosely used...
Journal Articles
EDFA Technical Articles (2012) 14 (3): 4–11.
Published: 01 August 2012
... novel failure mechanisms in new technologies such as 3-D SiP. Such an approach can be called design for reliability, in which involved FA tools, characterization methods, and resources are used in a preventive mode. Aspects of People and Lab Management An efficient (3-D) SiP integrating high...
Journal Articles
EDFA Technical Articles (2019) 21 (3): 16–24.
Published: 01 August 2019
... verification and failure analysis, and 2) how to implement countermeasures that protect the chip/PCB/software/bitstream from reverse engineering. Each has its own issues and complications. ELECTRICAL PROBING AND CIRCUIT EDIT Electrical probing inspection/attack directly probes a signal wire for extracting...
Journal Articles
EDFA Technical Articles (2003) 5 (1): 15–21.
Published: 01 February 2003
... and be specified for all respective technologies. We use an SRAM analysis flow example taken from C. Brillert, et al.3 It does not include every possible failure mode in the SRAM array but presents a selection of frequently occurring fails. The creation of an analysis process flow is only justified...
Journal Articles
EDFA Technical Articles (2009) 11 (3): 14–19.
Published: 01 August 2009
..., but it is quite typical to generate new data specifically for this purpose (for example, conducting experiments). The leading thinking mode should be If .then where the if is the possible outcome of the verification action, and the then is the conclusion made by this statement about the suggested model...
Journal Articles
EDFA Technical Articles (2018) 20 (3): 10–16.
Published: 01 August 2018
... capacitors serve to filter out noise or unwanted voltage spikes, the failure mode for a counterfeit capacitor is likely to be an intermittent glitch or reset of an IC. These failure modes are notoriously difficult to troubleshoot and may be more likely to result in changing the integrated circuit rather than...
Journal Articles
EDFA Technical Articles (2003) 5 (4): 5–10.
Published: 01 November 2003
... the AAF is a white paper that describes the key package technology drivers, their relation to potential fail mechanisms, analytical tools for electrical verification, fault isolation, and physical root-cause analysis. This document will quantify the gaps in the current tool suites, with recommendations...
Journal Articles
EDFA Technical Articles (2004) 6 (1): 6–11.
Published: 01 February 2004
..., W. Abadeer, L K. Han, and S. Lo: Structural Dependence of Dielectric Breakdown in Ultra-Thin Gate Oxides and Its Relationship to Soft Breakdown Modes and Device Failure, Tech. Digest IEDM, 1998, pp.187-90. 19. W.K. Henson, N. Yang, S. Kubicek, E.M. Vogel, J J. Wortman, K.D. Meyer, and A. Naem...
Journal Articles
EDFA Technical Articles (2001) 3 (1): 35–35C.
Published: 01 February 2001
... design failures and fixes. Several Icache and Dcache bits were destroyed for physical verification of the bitmap test program. Since the process was done from the backside, milling the active region or exposing the local interconnects was enough to render the cells nonfunctional. It was also used...
Journal Articles
EDFA Technical Articles (2001) 3 (4): 15–19.
Published: 01 November 2001
... must be applied to confirm the presence of such defects. Similar issues apply to PCB when analyzing fully enabled assemblies (fully packaged devices including thermal management and EMI shielding options). Electrical opens in PCB are a common failure mode and are frequently created when the substrate...
Journal Articles
EDFA Technical Articles (2003) 5 (3): 5–11.
Published: 01 August 2003
... may show up as early/late/ missing/incorrect patterns at the pins. System failures can manifest themselves as failures during boot-up of the system, during focused or randomized system testing, or even in system applications. Both testers and systems are useful for verification and debug, and each...
Journal Articles
EDFA Technical Articles (2005) 7 (4): 16–22.
Published: 01 November 2005
... current, our analyst performed a failure mode effects analysis, looking at the outcome if key discrete components had failed by an open or short, or if a short in an intra- or interlevel board metallization was possibly present. The results of the electrical testing showed that all the discrete components...