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electrical inspection

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Journal Articles
EDFA Technical Articles (2001) 3 (4): 9–13.
Published: 01 November 2001
...Kiyoshi Nikawa Scanning laser-SQUID microscopy is a new electrical inspection and failure analysis technique that can detect open, high-resistance, and shorted interconnects without electrical contact in areas ranging in size from a few square microns to an entire die. This article describes...
Journal Articles
EDFA Technical Articles (2012) 14 (2): 28–29.
Published: 01 May 2012
... Decapsulation and destructive physical analysis Electrical testing Miscellaneous techniques such as Fourier transform infrared, Raman, and x-ray photoelectron spectroscopy and thermomechanical techniques Scanning acoustic microscopy Scanning electron microscopy and optical inspection Radiological...
Journal Articles
EDFA Technical Articles (1999) 1 (4): 15–17.
Published: 01 November 1999
...Robert Lowry Electronic device failure analysis usually starts with electrical testing, followed by visual inspection via optical microscopy, then examination in a scanning electron microscope. When imaging reveals the need to determine the composition of materials, defects, and suspected...
Journal Articles
EDFA Technical Articles (1999) 1 (3): 19–30.
Published: 01 August 1999
... structures for gate oxide modules were failing the bulk gate oxide integrity criteria when electrically tested at metal-1 Final Inspection (FI). Specifically, the p-channel test structure with a poly/gate antenna ratio (area of poly/area of gate oxide) of ~ 1000 had a failure rate of ~ 90%, with most...
Journal Articles
EDFA Technical Articles (2001) 3 (4): 3–11.
Published: 01 November 2001
... the Data The term overlay describes the superposition of the in-line defect inspection data and the suspected nodes from electrical failure analysis. To make these pieces compatible, the scan diagnosis results are translated into a series of polygons. Each polygon retains information about its size...
Journal Articles
EDFA Technical Articles (2019) 21 (3): 16–24.
Published: 01 August 2019
... to the structure and function of a chip can be identified as a hardware trojan. Researchers have proposed several electrical-based methodologies to detect these types of modifications. However, in recent years, the research community has proposed physical inspection methodologies as an emerging solution to verify...
Journal Articles
EDFA Technical Articles (2017) 19 (1): 4–8.
Published: 01 February 2017
... be visually inspected. Therefore, obtaining information about the location of an open or short circuit is only possible by making electrical measurements or by performing an x-ray inspection. Experience shows that the PCB is predominantly the main source relating to problems involving soldering of BGA balls...
Journal Articles
EDFA Technical Articles (1998) 1 (1): 3–4.
Published: 01 November 1998
... (AFM) and Scanning Probe Microscopy (SPM) using various probes provide unique possibilities for inspection and other applications. Probes are available for measuring electric fields, magnetic fields, capacitance, and thermal effects. These offer possibilities for fail site isolation tools based on SPM...
Journal Articles
EDFA Technical Articles (2002) 4 (4): 5–9.
Published: 01 November 2002
... will be problematic but to a lesser extent. Fortunately, electron and scanning-probe microscopes currently used for inspection have resolution to spare. Deprocessing methods, derived mostly from IC manufacturing techniques, have the potential to stay ahead of the curve. Electrical fault isolation techniques like bit...
Journal Articles
EDFA Technical Articles (2016) 18 (3): 4–8.
Published: 01 August 2016
... of manufacture. Through some combination of time, electric potential, trapped humidity, and elevated operating temperature, plate material migrated into the voids, creating a short path that led to the failure. Using acoustic images as a guide, the failed capacitor was cross-sectioned, allowing investigators...
Journal Articles
EDFA Technical Articles (2018) 20 (4): 4–12.
Published: 01 November 2018
... acoustic lens with 80 µm focal length. edfas.org sides of all three bonds, adhesion is higher, likely still allowing for some electrical contact. As mentioned, the inspection of the entire bonding interface would not be possible by any other technique. This is because selective etching would not stop...
Journal Articles
EDFA Technical Articles (2011) 13 (2): 47–48.
Published: 01 May 2011
... the what, how, when, and why in a root-cause failure investigation is a complicated process, one that requires a deliberated approach, the right tools, and an open mind. Today, this process is further complicated for field-returned electrical, electronic, and electromechanical (EEE) parts due...
Journal Articles
EDFA Technical Articles (2019) 21 (2): 30–36.
Published: 01 May 2019
.../specification through electrical testing and/or physical inspection. Although electronics RE is often considered in a negative light (e.g., illegal cloning of designs and/or disclosing sensitive information to a competitor or adversary), it is the only foolproof way to detect malicious alteration or tampering...
Journal Articles
EDFA Technical Articles (2022) 24 (2): 24–32.
Published: 01 May 2022
... fabrication, physical inspection is a prevalent assurance technique for package assurance to identify defects, testing for electrical connection, temperature, and vibrational shock resistance. For inspection and failure analysis, both nondestructive and destructive identification techniques are used.[9] Based...
Journal Articles
EDFA Technical Articles (2020) 22 (3): 28–35.
Published: 01 August 2020
... in the development of nondestructive inspection equipment and signal processing technology for high sensitivity detection. Taiichi Takezaki received bachelor s, master s and Ph.D. degrees from Hokkaido University, Japan, in 2002, 2004, and 2007, respectively, all in electrical and electronics engineering. He joined...
Journal Articles
EDFA Technical Articles (2009) 11 (1): 14–21.
Published: 01 February 2009
... Robust incoming inspection procedures[7] Access to analytical capabilities for component analysis Procurement can also benefit from a strong relationship with the analytical team that provides observations on the component form, fit, and function to meet the device specification. This analytical...
Journal Articles
EDFA Technical Articles (2005) 7 (4): 16–22.
Published: 01 November 2005
...Thomas Paquette This article presents best practices and procedures for analyzing printed circuit board assembly failures. It discusses the role of electrostatic discharge and electrical overstress, the increasing complexity of ball grid arrays and buried vias, the challenges associated with lead...
Journal Articles
EDFA Technical Articles (2016) 18 (3): 54–55.
Published: 01 August 2016
... TSV Fiji product has delivered faster performance than the previous-generation GDDR5 technology. Tremendous work has been done so that products can be manufactured using 3-D silicon integration technology. Many challenges have been addressed, including design complexity, electrical signal integrity...
Journal Articles
EDFA Technical Articles (2007) 9 (4): 22–25.
Published: 01 November 2007
... the characterization of these resistors, the treatment of the samples prior to electrical testing on the nanoprober was found to have a significant impact. Following sample preparation, care must be taken during the subsequent inspection to avoid changing the resistor characteristics. The impact of SEM inspections...
Journal Articles
EDFA Technical Articles (2021) 23 (2): 4–12.
Published: 01 May 2021
..., Storrs, in 2014. He is currently an assistant professor with the electrical and computer engineering department at the University of Florida. His current research interest is primarily on physical attacks and inspection of electronics. This includes a wide range of products from electronic systems...