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device pins

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Journal Articles
EDFA Technical Articles (2004) 6 (4): 26–31.
Published: 01 November 2004
... coalesces into circumferential cracks in the solder joint, and these cracks deepen until catastrophic failure occurs. Copyright © ASM International® 2004 2004 ASM International circuit boards circumferential cracks crazing device pins power relays solder joints httpsdoi.org/10.31399...
Journal Articles
EDFA Technical Articles (1999) 1 (3): 1–28.
Published: 01 August 1999
... and angles, and with some equipment, arbitrary waveforms that response equipment in ATE can not be routed to specific a user programs. Typically a look-up table is generated by device pins through a typical relay tree due to the signal the test engineer to represent the digitally sampled equiv- loss...
Journal Articles
EDFA Technical Articles (2004) 6 (2): 28–30.
Published: 01 May 2004
... operating speed and pin count. The challenges in physical analysis are driven primarily by smaller device feature sizes and by the host of new materials being introduced. In addition to the technical challenges, infrastructure changes are also likely to occur. The industry paths for addressing...
Journal Articles
EDFA Technical Articles (1999) 1 (2): 4–6.
Published: 01 May 1999
... used bench test electronics, but as devices grew in complexity, so did bench test electronics, with a migration to higher pincount pattern generators and logic analyzers. Further increases in pin-count drove a new class of small footprint testers, commonly referred as ASIC verification testers...
Journal Articles
EDFA Technical Articles (2009) 11 (2): 23–29.
Published: 01 May 2009
...Jason Benz; William Bentley; Joseph Myers Thin film anomalies cause many device failures but they are often difficult to see. In this article, the authors explain how they found and identified an 8 to 10 nm film of tantalum causing pin shorts in a majority of ASIC modules from a particular lot...
Journal Articles
EDFA Technical Articles (2005) 7 (2): 6–12.
Published: 01 May 2005
... Introduction Electrostatic discharge (ESD) is usually considered an introduction of charge into or a discharge out of a semiconductor device by way of the pins. The wellknown ESD models, such as the human body model, the charged-device model, and the machine model, Fig. 1 Typical VDD-IDD behavior...
Journal Articles
EDFA Technical Articles (2017) 19 (4): 4–9.
Published: 01 November 2017
... DEVICE FAILURE ANALYSIS | VOLUME 19 NO. 4 device. Cracks were detected on four pins located on the same side of the component. Of course, this defect could have been seen from the beginning of the failure analysis process. X-ray imaging had been performed at the start, but it is almost impossible to find...
Journal Articles
EDFA Technical Articles (2000) 2 (4): 4–23.
Published: 01 November 2000
... that were not readily accessible. In the case of a microengine, the bottom half of a gear was exposed, but facing the ground plane. To manipu- Fig. 9: MEMS device with an exposed cross section of the gear revealing the hub and pin joint regions (produced by FIB machining). Fig. 10: A seized microengine...
Journal Articles
EDFA Technical Articles (1999) 1 (4): 4–26.
Published: 01 November 1999
... the transfer function. This failure mode is shown in Figure 1. The failure was isolated to the MIDDVDD pin. This pin should be about half the voltage of the DVDD pin (effectively 1.5V). Slm Part CDM IOOOV DAe 14 trans Ftmc Blank Code iN vs Voltage Out The mixed-signal device analysis described here...
Journal Articles
EDFA Technical Articles (2004) 6 (1): 25–28.
Published: 01 February 2004
... information, or specific device expertise, so that a quick determination of the likely failure site is possible. For example, in a standard advanced flip-chip pin grid array (PGA) device, likely failure sites are within the package, at the die/ package interface, and within the die itself. An example...
Journal Articles
EDFA Technical Articles (2004) 6 (3): 20–30.
Published: 01 August 2004
... Device Failure Analysis 21 I/O Interface Latchup Analysis (continued) a current meter, while each pin is stimulated with a variable current source. The time-integrated images of latchup emission are collected with an emissionbased microscope using the Hamamatsu C4880-21 back-illuminated charge-coupled...
Journal Articles
EDFA Technical Articles (2016) 18 (3): 10–16.
Published: 01 August 2016
... and EeLADA signals, respectively, on three embedded memory arrays. With selective pin/cycle matching, only one of the memory arrays is revealed, Fig. 3 Synchronizing signal and output pin waveforms viewed from an oscilloscope Fig. 2 Hardware implementation of EeLADA edfas.org 12 ELECTRONIC DEVICE FAILURE...
Journal Articles
EDFA Technical Articles (2003) 5 (3): 5–11.
Published: 01 August 2003
... offers advantages and disadvantages. Testers offer excellent control over parameters such as voltage, frequency, and pin timing, and operate in a deterministic way that can ease debug. They are also fast and can characterize many devices far more quickly than can be done in a system. However, testers...
Journal Articles
EDFA Technical Articles (2001) 3 (4): 29–35.
Published: 01 November 2001
... transistor Electronic Device Failure Analysis 31 Single Contact Optical Beam Induced Currents (continued) can image all junctions of an IC by just connecting a contact that is common to all the transistors. For this particular chip, the contact was the substrate pin. Figure 8 (a) shows the SCOBIC image...
Journal Articles
EDFA Technical Articles (2001) 3 (4): 9–13.
Published: 01 November 2001
... inspection and failure analysis that can detect open, high-resistance, and shorted interconnects without electrical contact1-2. The basic idea is detection of the magnetic field produced by OBIC (optical beam induced current) using a DC-SQUID (superconducting quantum interference devices) magnetometer...
Journal Articles
EDFA Technical Articles (2003) 5 (1): 11–14.
Published: 01 February 2003
... and Their Failure Analysis Challenges Susan X. Li, Advanced Micro Devices susan.li@amd.com Introduction CSPs in the market today, but all of them can be There is a trend in the electronic industry to miniaturize. From tower PCs to laptops to PocketPCs, from giant cell phones to pager size handsets, the demand...
Journal Articles
EDFA Technical Articles (2018) 20 (4): 16–22.
Published: 01 November 2018
... device (Fig. 6). While stress to the pin and mold from excessively hot soldering, pin forming, or PCB bending and stamping from the leadframe causes a small, micron-like pin delamination from the potting, the bond wire remains absolutely fixed. If the pin then starts moving, the (continued on page 20...
Journal Articles
EDFA Technical Articles (2021) 23 (2): 51–52.
Published: 01 May 2021
... into the results. Which result gives more useful information, Pin 7 shorted or Pin 7 has an early turn-on at 1.4 volts to Pin 12? And I can t end this discussion without a mention of hot button words in FA reports. If your customer uses the device you analyzed in an automotive module that goes into a million...
Journal Articles
EDFA Technical Articles (2021) 23 (3): 13–22.
Published: 01 August 2021
... attack EDFAAO (2021) 3:13-22 httpsdoi.org/10.31399/asm.edfa.2021-3.p013 1537-0755/$19.00 ©ASM International® 13 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 23 NO. 3 THE THREAT OF MALICIOUS CIRCUIT-BOARD ALTERATION: ATTACK TAXONOMY AND EXAMPLES Samuel H. Russ University of South Alabama, Mobile sruss...
Journal Articles
EDFA Technical Articles (2008) 10 (1): 18–22.
Published: 01 February 2008
... device can be caused to fail by an ESD event. Devices that withstand 4000 V are considered very robust. A common minimum expectation for ICs is a human body model damage threshold of more than 2200 V for any combination of two pins. Devices susceptible to damage by 1000 V or less require exceptional care...