1-20 of 131 Search Results for

defect density

Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
EDFA Technical Articles (2000) 2 (3): 1–10.
Published: 01 August 2000
...-in test. Y = e( Dy × A) Yr = M × e( Dr × A) (1) (2) where A is the microprocessor area, Dy the yield defect density, and Dr the reliability defect (latent defect) density. M represents the maximum possible yield fraction. Since reliability defect density is modeled as a fraction of the yield defect...
Journal Articles
EDFA Technical Articles (2007) 9 (1): 6–13.
Published: 01 February 2007
... on simple IC layout parameters including wire width, wire spacing, and channel density. The authors explain how they derived the model and how it compares to actual data. They also discuss the causes and effects of open and short defects and define the concepts of critical area and layout sensitivity...
Journal Articles
EDFA Technical Articles (2012) 14 (4): 4–11.
Published: 01 November 2012
... sensor dark current spectroscopy defect density metal contaminants httpsdoi.org/10.31399/asm.edfa.2012-4.p004 EDFAAO (2012) 4:4-11 Dark Current Spectroscopy 1537-0755/$19.00 ©ASM International® Finding the Invisible Contaminants in CMOS Image Sensor Pixels: The DCS Technique Florian Domengie...
Journal Articles
EDFA Technical Articles (2008) 10 (3): 46–48.
Published: 01 August 2008
... for the IFM or fabless company. Guest Columnist Yield Yield enhancement in the IFM environment is defined by very tight collaboration between the IFM and the foundry, but in a way that protects the intellectual property (IP) of both. The two basic FA yield areas are defect density reduction and parametric...
Journal Articles
EDFA Technical Articles (2018) 20 (3): 4–7.
Published: 01 August 2018
... to predict electrical wafer final test yield.[1,2] Although the math differs, all of the models account for process fault density and product design complexity. For the purposes of modelling electrical test yield, a fault is defined as a physical defect that causes the device not to meet the electrical test...
Journal Articles
EDFA Technical Articles (2017) 19 (3): 4–11.
Published: 01 August 2017
... transition energy at 3.13 eV. Evidently, PDA or silicatization removes or decreases the density of such defects. This study employs internal multiphoton photon emission (IMPE) to transfer charge between the silicon substrate and high-k film stacks. TD-EFISH generation probes subsequent charge-trapping...
Journal Articles
EDFA Technical Articles (2020) 22 (3): 8–15.
Published: 01 August 2020
... will be performed on a population that could have also this failure but for which no same failure was reported. If a correction of this defect is not possible, for example when it deals with a defect density, some different estimation methods can be proposed.[2] In field context, confidence interval is usually...
Journal Articles
EDFA Technical Articles (2001) 3 (4): 3–11.
Published: 01 November 2001
... to inaccuracies. The second imperative for logic mapping is the existence of in-line defect inspections at strategic points during wafer fabrication. The data can generally predict defect densities and determine whether the equipment is functioning within tolerance. It is critical to have clean IDI data because...
Journal Articles
EDFA Technical Articles (2006) 8 (3): 12–17.
Published: 01 August 2006
... of transistors.[11] In the damascene-copper process, vias and metal are patterned and etched prior to the additive metallization. Because of this, micromasking during the next lithography step can occur.[12] The open-defect density in copper shows a higher value than that found in aluminum.[12] Rodriguez...
Journal Articles
EDFA Technical Articles (2020) 22 (4): 28–33.
Published: 01 November 2020
... CONTROL of the resulting semiconductor. This has, for example, Dislocation and point defects density in high electron been performed on AlGaN,[3] AlGaAs,[4] and an example of mobility transistor (HEMT) structures. Rapid dislocation the type of data needed is shown in Fig. 3. By the same density...
Journal Articles
EDFA Technical Articles (2014) 16 (4): 26–34.
Published: 01 November 2014
... individual conductors and defects on numerous planes beneath the surface able to be observed. Attributes of Magnetic Current Images An important aspect of the inversion process is that it results in current density. Thus, the width of conductors carrying current modulates the intensity of the signal...
Journal Articles
EDFA Technical Articles (2014) 16 (3): 14–19.
Published: 01 August 2014
... the observed failure mode? Does the defect location correspond to likely accumulation or voiding sites? Consider both layout and circuit factors. Consider current density and temperature implications. Consider high voltage between an accumulation site and adjacent metal. Accumulation will mechanically stress...
Journal Articles
EDFA Technical Articles (2012) 14 (2): 14–20.
Published: 01 May 2012
... traces forming the root cause for the Localization of Electrical Defects by Lock-In Thermography shorts.[5] Consequently, a combination of high-resolution SAM and LIT is able to support the analysis of both electrical opens and shorts in high-density Lock-in thermography (LIT) is a novel technique...
Journal Articles
EDFA Technical Articles (2019) 21 (2): 4–7.
Published: 01 May 2019
... power, the power density of a 532-nm laser is approximately 6.3 times larger than that of a 1340-nm laser. Similarly, the power density of a 1064-nm laser is approximately 1.59 times larger than that of a 1340-nm laser. Larger power density means that more heat is generated at the defect site, resulting...
Journal Articles
EDFA Technical Articles (2009) 11 (4): 14–21.
Published: 01 November 2009
... applications. Printed circuit boards (PCBs) can be very complex, with multiple layers and a high-density population of components. In addition, a fully populated board can be difficult to handle, and many times it requires time-consuming manual probing to isolate a defect. MCI can scan a large populated PCB...
Journal Articles
EDFA Technical Articles (2022) 24 (1): 29–32.
Published: 01 February 2022
..., local current density, ac noise, and local temperature variations. Copyright © ASM International® 2022 2022 ASM International defect localization local hotspots nitrogen vacancy centers scanning NV microscopy scanning nitrogen vacancy magnetometry SNVM EDFAAO (2022) 4:29-32...
Journal Articles
EDFA Technical Articles (2022) 24 (1): 17–28.
Published: 01 February 2022
... origins of defects by providing quantitative data regarding defect densities and energy depths. Typically, DLTS is carried out in association with a MOS capacitor and cannot directly determine the spatial distribution of defects. However, prior work has suggested that such information could potentially...
Journal Articles
EDFA Technical Articles (2005) 7 (4): 6–14.
Published: 01 November 2005
... to more than $100 billion[2] (Fig. 1). Furthermore, power dissipation increasingly troubles designers in the industry, because scaling leads not only to higher current densities when devices are active but also to increased leakage current when idle. For this reason, low-power designs can be expected...
Journal Articles
EDFA Technical Articles (2002) 4 (2): 10–16.
Published: 01 May 2002
...Edward I. Cole Jr. This article provides a qualitative overview of several new defect localization techniques, including charge-induced voltage alteration (CIVA), light-induced voltage alteration (LIVA), thermally-induced voltage alteration (TIVA), and Seebeck effect imaging (SEI). It explains how...
Journal Articles
EDFA Technical Articles (2002) 4 (4): 5–9.
Published: 01 November 2002
... SQUID microscopy and laser probes such as OBIRCH/TIVArely either on adequate defect signal reaching the surface or sufficient laser signal reaching the defect, respectively. But as defects become smaller, the number and density of wiring levels increases, and background currents and power dissipation...