Search Results for dc motor

A large dc motor in a servo positioning system began behaving erratically whenever the rotor was in certain positions. This article describes the examinations and tests that were conducted to determine the root cause of failure, which turned out to be a shorted motor winding stemming form damage most likely caused by the tool used to pack the conductors into the core slot.

This article discusses the primary differences between electrostatic discharge (ESD) and electrical overstress (EOS) and the circumstances under which they occur. It also explains how to differentiate ESD from EOS during failure analysis and how to avoid common misunderstandings and mistakes.

Automotive electronics are exposed to mechanical shock and vibration, thermal cycling, chemical attack, current and voltage spikes, electromagnetic interference, and other hazards. Early life failures, which are not uncommon, can be difficult to diagnose due to the many contributing factors. This article provides an overview of automotive electronic failures and presents guidelines for determining the root cause.

Scanning laser-SQUID microscopy is a new electrical inspection and failure analysis technique that can detect open, high-resistance, and shorted interconnects without electrical contact in areas ranging in size from a few square microns to an entire die. This article describes the setup of a prototype laser-SQUID system, explaining how it works and how it compares to other nondestructive defect localization techniques. It presents application examples in which laser-SQUID microscopy is used to locate gate oxide shorts to within 1.3 μm and detect IC defects prior to bond-pad pattering and after bonding and packaging. It also includes a series of images acquired from a board-mounted chip with fields of view ranging from 5 x 5 mm down to 50 x 50 μm.

This article explains how to find shorted components on PCB assemblies using infrared-based direct current injection, a nondestructive method that has several advantages over magnetic microscopy and voltage drop measurement techniques. An application example involving a power board failure is also provided.

This article provides an overview of deep ultraviolet (DUV) microscopy, the factors that led to its development, and the types of applications for which it is suited in semiconductor device manufacturing, testing, and inspection. It also includes several images demonstrating it capabilities relative to visible light microscopy.