Search Results for condensing lenses

This is the second article in a two-part series on deep ultraviolet (DUV) microscopy. The first part, published in the February 2000 issue of EDFA, discusses the working principles and capabilities of the method and the types of applications for which it is suited. In this issue, the author describes the basic design of DUV microscopes, the role of major components, and their effect on imaging quality.

X-ray tomography has been rapidly gaining acceptance in the semiconductor industry since the first demonstration of its use on IC interconnect in 1999. As failure analysts are discovering, X-ray imaging is more powerful than visible light microscopy and can be used to analyze larger samples than those that fit in an electron microscope. This article provides an introduction to the physics, signal processing, and algorithms involved in X-ray imaging and tomography and the factors that affect resolution.

This article discusses the generation of heat that occurs in ICs during failure analysis and examines the effectiveness of various die cooling techniques including heat spreading films, spray cooling, and liquid and air jet impingement.