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combinational logic analysis

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Journal Articles
EDFA Technical Articles (2018) 20 (2): 10–16.
Published: 01 May 2018
... International combinational logic analysis fault isolation laser voltage probing 1 0 httpsdoi.org/10.31399/asm.edfa.2018-2.p010 EDFAAO (2018) 2:10-16 1537-0755/$19.00 ©ASM International® ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 20 NO. 2 COMBINATIONAL LOGIC ANALYSIS WITH LASER VOLTAGE PROBING Venkat...
Journal Articles
EDFA Technical Articles (2024) 26 (2): 32–38.
Published: 01 May 2024
... al.: Di erential Laser Voltage Probe: A New Approach to a Fundamental Technique, Proc. Int. Symp. Test. Fail. Anal., 2022, p. 144-152, doi.org/10.31399/asm.cp.istfa2022p0144. 3. V.K. Ravikumar, et al.: Pattern Search Automation for Combinational Logic Analysis, Proc. Int. Symp. Test. Fail. Anal...
Journal Articles
EDFA Technical Articles (2017) 19 (4): 22–34.
Published: 01 November 2017
...; intuitively, the input to Inv 3 will be floating, and emissions should be observed as well. Based on experience, direct physical failure analysis on Inv 1 and 2 is not recommended. The inputs A, B, and C to the combinational logic involved in the CUD were identified and a testbench model was created...
Journal Articles
EDFA Technical Articles (2005) 7 (2): 20–28.
Published: 01 May 2005
... result from a violation of the design timing rules that are specific and unbending. Combinational Logic Circuit Timing Combinational logic has a relatively simple timing interpretation but a complexity when statistical variation is included in the analysis. Timing Parameters in Combinational Logic...
Journal Articles
EDFA Technical Articles (2006) 8 (2): 22–27.
Published: 01 May 2006
... by narrowing it down to a specific element. The combined use of software fault diagnostic tools with physical probing can lead to a very precise and efficient resolution to a device analysis. The linking of the logical design to the physical design is a key element of completing this workflow. Designers work...
Journal Articles
EDFA Technical Articles (2007) 9 (3): 6–16.
Published: 01 August 2007
... and future designs. Failure Analysis Using Scan-Logic Diagnosis It is becoming increasingly difficult to produce a successful root-cause analysis in the face of new challenges, such as new materials, structures, and processes. A combination of established diagnosis capabilities and new advanced diagnosis...
Journal Articles
EDFA Technical Articles (2006) 8 (3): 12–17.
Published: 01 August 2006
... Approximately 18 years ago, the failure analysis and test world knew, wrote about, and discussed the CMOS stuck-open fault (SOF) failure mode. It has an unusual property showing a logic failure sensitive to a specific 2-pair sequence of logic input states.[1-4] A paper written in 1989 found 125 papers written...
Journal Articles
EDFA Technical Articles (2016) 18 (4): 4–14.
Published: 01 November 2016
... confirm the failure and help with understanding the failure signature. This article discusses combining these two techniques in an in-line scan chain logic macro diagnosis, which has greatly improved the failure analysis success rate. INTRODUCTION Historically, static random access memory (SRAM) yields...
Journal Articles
EDFA Technical Articles (2001) 3 (3): 7–11.
Published: 01 August 2001
...Robert C. Aitken Although much traditional FA depends on physical observation to localize failures, electrical techniques are also important, particularly with advances in design for testability (DFT) on modern ICs. DFT structures combined with automated test equipment and algorithmic fault...
Journal Articles
EDFA Technical Articles (2014) 16 (3): 4–12.
Published: 01 August 2014
... to achieve this is prioritization. Prioritization is a standard practice in software fault isolation (FI) tools such as static random ac- (a) (b) Fig. 1 (a) SRAM bitmapping and (b) volume logic scan diagnosis workflows 4 Electronic Device Failure Analysis cess memory (SRAM) bitmapping and electronic device...
Journal Articles
EDFA Technical Articles (2002) 4 (3): 5–9.
Published: 01 August 2002
... location, the next important concept is one called the critical resistance. Fig. 1 Bridge defect positions (a) in logic circuits, (b) in transistors Volume 4, No. 3 Fig. 2 Resistive bridge from signal node to VDD Electronic Device Failure Analysis 5 Bridge and Open Circuit Defect Properties (continued...
Journal Articles
EDFA Technical Articles (2007) 9 (1): 20–23.
Published: 01 February 2007
... the semiconductor, with the resolution of SE imaging. EBIC analysis is also very useful in isolating electrical shorts through several layers of metallization when other isolation techniques, such as light emission or liquid crystal, would fall short (Fig. 2). Memory Array Failure Analysis Using a combination...
Journal Articles
EDFA Technical Articles (2019) 21 (1): 12–19.
Published: 01 February 2019
... httpsdoi.org/10.31399/asm.edfa.2019-1.p012 EDFAAO (2019) 1:12-19 1537-0755/$19.00 ©ASM International® ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 21 NO. 1 AN AUTOMATED METHODOLOGY FOR LOGIC CHARACTERIZATION VEHICLE DESIGN Zeye Liu, Ben Niewenhuis, Soumya Mittal, Phillip Fynan, and R.D. (Shawn) Blanton...
Journal Articles
EDFA Technical Articles (2019) 21 (1): 4–9.
Published: 01 February 2019
... results. Diagnosis employs simulation analysis to determine a set of potential defects (also called diagnosis suspects) from the failure log of a defective die. Typically, due to logical and electrical equivalencies, the size of this set of diagnosis suspects is greater than one. Therefore, in addition...
Journal Articles
EDFA Technical Articles (2022) 24 (4): 12–21.
Published: 01 November 2022
... paths are not matched, then the memory element produces known values instead of random values. In previous works, implementing a cross-couple element using combinational logic on an FPGA was not straight forward due to inability to create combinational loops13] however, the authors have been successful...
Journal Articles
EDFA Technical Articles (2015) 17 (1): 33–37.
Published: 01 February 2015
.... Mike Bruce (Independent Consultant) gave the third presentation, On-Die Logic Analyzer. Based on scanning optical microscopy (SOM) and on-die logic analysis (ODLA), which is a method to quickly identify logic timing patterns, information to identify logic pattern matches and mismatches can be done...
Journal Articles
EDFA Technical Articles (2004) 6 (4): 18–25.
Published: 01 November 2004
... or if the programmed inputs are identically zero due to the pull-down action of the resistor. Otherwise, a logical one is produced. Fig. 1 The crosspoint array 18 Electronic Device Failure Analysis Fig. 2 Exploitation of a single column of a CPA using a wiredOR construction to implement simple logic functions...
Journal Articles
EDFA Technical Articles (2005) 7 (1): 16–24.
Published: 01 February 2005
...) problems. and then uses the scan archi- tecture to test the general combinational logic. Most of the scan problems associated with sample oper- ations and the scan enable are easily identifiable, and the errors fall out in the course of scan testing. If the scan chains have shifting problems where the data...
Journal Articles
EDFA Technical Articles (2006) 8 (2): 28–34.
Published: 01 May 2006
... of the metal interconnect. The architecture of an SASIC typically consists of a sea of interwoven high-performance logic and memory combined with embedded, interspersed IP. The amount and types of internal logic, memory, and IP will vary from vendor to vendor. The SASICs possess (continued on page 30) 28...
Journal Articles
EDFA Technical Articles (2010) 12 (2): 12–18.
Published: 01 May 2010
..., generating and applying dedicated debug test patterns to the die[4] will usually improve the resolution. Another method In failure analysis (FA), these suspects are used to point to a location and provide a logical explanation is to provide layout information to the diagnosis tool. There are different ways...