Failures of interest in this article usually occur on single-sided, non-plated-through-hole circuit boards. Evidence of failure may be as subtle as crazing (a pattern of small surface cracks) of solder-joint surfaces or as catastrophic as burning of the circuit board. Over time, crazing coalesces into circumferential cracks in the solder joint, and these cracks deepen until catastrophic failure occurs.

This article assesses the progress that has been made in the development and implementation of through-silicon via (TSV) technology, the work yet to be done, and the challenges associated with potential failure mechanisms.