1-20 of 36 Search Results for

bridging faults

Sort by
Journal Articles
EDFA Technical Articles (2001) 3 (4): 21–26.
Published: 01 November 2001
... in implementing a TBFA process and addresses the challenges that are likely to be encountered. It explains how to gather data required to link observed behavior to specific faults, how to set up and use fault dictionaries, and how to handle unmodeled as well as bridging faults. It also discusses the use of TBFA...
Journal Articles
EDFA Technical Articles (2001) 3 (3): 7–11.
Published: 01 August 2001
... equivalent to the stuck-at 1 fault at the input of the inverter, but are not equivalent to a stuck-at 1 ELECTRONIC DEVICE FAILURE ANALYSIS NEWS Fault Models Fig. 2: Equivalent faults on a two input multi- Fig. 3: Simple bridging fault models. plexer. fault at input S, because that fault also fans out...
Journal Articles
EDFA Technical Articles (2007) 9 (3): 6–16.
Published: 01 August 2007
... on the gates, such as a layout or a SPICE description. The actual failure of a die is usually called a defect in design-for-test, distinguishing it from a fault, which is an abstract logical model of the defect used by the tools. For example, a bridge fault only indicates that two nets in the design...
Journal Articles
EDFA Technical Articles (2001) 3 (4): 3–11.
Published: 01 November 2001
... Design & Test of Computers, (6)4, 1989, p 49-60. 5. D. B. Lavo, B. Chess, T. Larrabee, and F. J. Ferguson, Diagnosing Realistic Bridging Faults with Single Stuck-At Information, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, (17)3, 1998, p 255-267. 6. C. L. Henderson...
Journal Articles
EDFA Technical Articles (2008) 10 (1): 30–33.
Published: 01 February 2008
... test-pattern generation tools are capable of: stuck-at tests, delay fault tests, bridging fault tests, n-detection tests, and memory tests. Beyond that, there are also functional tests and Fmax tests. These tests are applied on wafers, packages, and systems. Burn-in tests are also executed. However...
Journal Articles
EDFA Technical Articles (2005) 7 (4): 32–36.
Published: 01 November 2005
... the top end of a floating conductor. Fig. 3 The grain size of the deposited copper is too big, so all the metal islands are bridged together through the deposited copper. The fault site becomes difficult to observe. Results and Discussion Fully Open Case After electroplating the sample, copper ions...
Journal Articles
EDFA Technical Articles (2000) 2 (1): 4–27.
Published: 01 February 2000
... in the de\ iec's electrical signaturc_ Clearly, 1000 signatures and data collected from other characterization tests (listed in Section 2.2) provided useful defect mfonnation. 1000 fault diagnosis (utilizing bolh the pscudo--stuck-at and bridging fault models) \l.-1lS sucrcssfully applied for a nwnber...
Journal Articles
EDFA Technical Articles (2011) 13 (3): 12–16.
Published: 01 August 2011
... by a region of excessive modulation of the LVI data. These areas appear as regions of increased intensity of the LVI data when compared to surrounding areas.[4] In some cases, this type of LVI effect has been demonstrated to be indicative of the location of a bridging fault.[3] When used with EFA data, LVI...
Journal Articles
EDFA Technical Articles (2019) 21 (1): 4–9.
Published: 01 February 2019
... diagnosis suspects. Further, if the net is physically close to the net driven by c1 in the M2 layer, then a M2 Bridge between the two nets also becomes a diagnosis suspect, and so on. Finally, the fault f1 can also be associated with a defect inside the OR cell c2. However, because the design...
Journal Articles
EDFA Technical Articles (2010) 12 (2): 20–28.
Published: 01 May 2010
... This article summarizes major discussion points from four User’s Group meetings held at the ISTFA 2009 conference. The topics addressed are "Optical Techniques: Growth and Limitations," "Resolution of Nanoprobing for 45 nm and Beyond: New Challenges," "FIB," and "Fast ASIC Fault Isolation...
Journal Articles
EDFA Technical Articles (2010) 12 (2): 12–18.
Published: 01 May 2010
... bridge reported net names), while others use *Formerly with AMD 12 Electronic Device Failure Analysis layout information as a posterior filtering step. This case study uses the most accurate, true layout-aware method, in which the layout information is included in the core diagnosis engine itself...
Journal Articles
EDFA Technical Articles (2018) 20 (3): 54–55.
Published: 01 August 2018
... leads to a reduced PFA success rate, if still using simulation-based EDA tools. Therefore, the current trend is to use AI to bridge the gap between fault model and real defect behavior, to tolerate inaccuracy and noises. One example is a paper recently published in the Proceedings of Asian Test...
Journal Articles
EDFA Technical Articles (2016) 18 (4): 4–14.
Published: 01 November 2016
... top-down scanning electron microscopy (SEM) inspection. However, as defined previously, the root cause of a clock-type failure could be any failure in the buffers and the interconnects of the preload data and clock lines, or a bridging fault in the preload data and clock input circuits in any...
Journal Articles
EDFA Technical Articles (2018) 20 (2): 18–24.
Published: 01 May 2018
...Zhigang Song; Laura Safran Selecting a fault isolation technique for a particular type of SRAM logic failure requires an understanding of available methods. In this article, the authors review common fault isolation techniques and present several case studies, explaining how they determined which...
Journal Articles
EDFA Technical Articles (2007) 9 (1): 24–25.
Published: 01 February 2007
... infrastructure. Bridging the gap be- tween diagnosis and fault isolation by performing local searches instead of global ones, thus narrowing the fault to a specific region, will help identify a starting point for failure analysis. In summary, the panel identified different factors that will improve...
Journal Articles
EDFA Technical Articles (2009) 11 (2): 23–29.
Published: 01 May 2009
... the analysis quickly. However, no evidence of damage was observed in the bulk silicon. Fault Isolation Two different fault isolation techniques were used in parallel in an attempt to isolate a physical location for analysis. The two techniques included laser signal injection microscopy (LSIM)[1] and photon...
Journal Articles
EDFA Technical Articles (2020) 22 (1): 55–56.
Published: 01 February 2020
... bridge. Neither the failure mechanism nor the root cause is immediately addressed. Only the identification of the logical fault and physical location of a defect are the major goals of an individual failure analysis. By comparison, diagnostics involved in the analysis of discrete diodes and transistors...
Journal Articles
EDFA Technical Articles (2023) 25 (3): 54–55.
Published: 01 August 2023
... analysis typically consists of two major sequential steps. The first step, fault isolation, involves using software diagnostics, ATE testers, and various optical-based fault isolation techniques to narrow down the faulty area. The second step, post-isolation, focuses on further localizing the defective...
Journal Articles
EDFA Technical Articles (2002) 4 (3): 5–9.
Published: 01 August 2002
...Anne Gattiker; Jerry Soden; Chuck Hawkins CMOS IC failure mechanisms are of three general types: bridge defects, open circuit defects, and parametric related failures. This article summarizes bridge and open-circuit defect properties and provides references for further self-study. Bridge defects...
Journal Articles
EDFA Technical Articles (2023) 25 (2): 44–46.
Published: 01 May 2023
... node introduced, the requirements are increased, resulting in a seemingly never-ending cycle of advancements. There are gaps in the FAFRC roadmap that do not have a solution identified at this time, but they may be bridged with advancements of existing technologies or new technologies not currently...