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backside deprocessing

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Journal Articles
EDFA Technical Articles (2017) 19 (4): 36–44.
Published: 01 November 2017
... the backside using automated thinning and large-area plasma FIB delayering. Advantages to this approach include a reduction in manual planarization and depackaging and a higher degree of precision and repeatability. Deprocessing of ICs is often the final step for defect validation in FA cases with limited...
Journal Articles
EDFA Technical Articles (2003) 5 (4): 13–24.
Published: 01 November 2003
...), and laser-based fault isolation methods with emphasis on light-induced voltage alteration (LIVA). It explains how laser voltage probing is used for backside waveform acquisition and describes backside sample preparation and deprocessing techniques including parallel polishing and milling, laser chemical...
Journal Articles
EDFA Technical Articles (2004) 6 (2): 28–30.
Published: 01 May 2004
..., and the factors driving circuit inaccessibility from the topside are not expected to change. It would appear that backside deprocessing is a logical extension of this trend. There will be more pressure on global techniques, due to the continuing increase in the cost and time required for probing solutions. Better...
Journal Articles
EDFA Technical Articles (1998) 1 (1): 3–4.
Published: 01 November 1998
... laboratories, the PAF has identified critical needs in three areas: software fault isolation, backside fault isolation, and deprocessing & inspection. This article discusses the current state of deprocessing and inspection technology and provides insights into how some of the future challenges...
Journal Articles
EDFA Technical Articles (2019) 21 (3): 8–14.
Published: 01 August 2019
... from the automated deprocessing routine is shown in Fig. 2. Key elements to the success of the automated delayering process include ultra-thinning of the die from the backside prior to pFIB delayering and the ability to program the operation of the pFIB, SEM, CURRENT STATE OF LARGE AREA IC DEPROCESSING...
Journal Articles
EDFA Technical Articles (2014) 16 (1): 26–29.
Published: 01 February 2014
... of 28-nm Bulk-Si Flip-Chip ICs Using SEM and Backside Deprocessing by Yuanjing (Jane) Li, Steven Scott, and Howard Lee Marks). Following the theme of Empower Innovation, we invited the world-renowned Professsor Krishna Saraswat from Stanford University to present a keynote speech entitled...
Journal Articles
EDFA Technical Articles (2002) 4 (4): 5–9.
Published: 01 November 2002
...David P. Vallett A review of the 2001 edition of the International Technology Roadmap for Semiconductors indicates major obstacles ahead. Of the three basic failure analysis steps—inspection, deprocessing, and fault isolation—the latter is the most at risk, especially physical fault isolation...
Journal Articles
EDFA Technical Articles (2013) 15 (3): 4–11.
Published: 01 August 2013
... sensitive material to the surface of the device (e.g., liquid crystal). The issue with spatial resolution has also been addressed with the use of the solid immersion lens (SIL) with backside analysis.[1] In addition, phase shifts related to the heat propagation inside the device under test (DUT) can be used...
Journal Articles
EDFA Technical Articles (2018) 20 (1): 36–S-6.
Published: 01 February 2018
... platform, they retained the full gas-delivery system (commonly used etch and deposition gases) and other desirable system features. Planar FIB deprocessing from the backside and frontside Key advantages of Cs+ LoTIS is its small spot size yet A sub-pico-amp FinFET edit example using the latest high...
Journal Articles
EDFA Technical Articles (2019) 21 (4): 60–62.
Published: 01 November 2019
...) for hyperspectral large area rapid full-field chemical delayer imaging of full die. I believe a comprehensive solution to IC deprocessing combines high resolution spectroscopic electron-based imaging from backside thinned die of the first several layers with x-ray tomography of the upper layers. Ptychography[4...
Journal Articles
EDFA Technical Articles (2019) 21 (3): 16–24.
Published: 01 August 2019
... or backside. 2) Delayering: Process of removing materials layer by layer for imaging and analysis. Wet/dry plasma etching, FIB, or polishing are used for delayering the chip. 3) Imaging: After exposing a new layer, high-resolution images are collected and stitched together for extracting netlists. Commonly...
Journal Articles
EDFA Technical Articles (2000) 2 (2): 1–10.
Published: 01 May 2000
... materials. Many of these defects can be imaged for coarse localization without any deprocessing of the sample. SQUID sensors can produce weak current images even in the presence of background current five orders of magnitude stronger. This high sensitivity also enables effective imaging with much lower...
Journal Articles
EDFA Technical Articles (2013) 15 (2): 22–30.
Published: 01 May 2013
... of several variables (such as stain recipe, time, temperature, and light) that affect the chemical etch process. For failure analysis (FA) applications, staining must be performed after exposing the fail site by deprocessing or precise cross sectioning of the failing device. The differences between the state...
Journal Articles
EDFA Technical Articles (1998) 1 (1): 8–11.
Published: 01 November 1998
... and physical etching from surface or backside of samples1. But conventional etching has some hazards. Complicated deprocessing is required for direct observation and defect points may not be the same size or shape as the original. And, unless in conjunction with direct observation, electrical defects without...
Journal Articles
EDFA Technical Articles (2013) 15 (1): 37–40.
Published: 01 February 2013
... and contamination issues were explained. The final speaker, Richard Stallcup from DCG NanoInstruments, gave a presentation on backside electron beam absorbed current (EBAC) fault isolation. The backside sample preparation and EBAC images were very refreshing. The first presenter, Antonio Orozco from Neocera...
Journal Articles
EDFA Technical Articles (2017) 19 (2): 55–56.
Published: 01 May 2017
...] The Panel Discussion noted that an FA engineer must have the capability to handle several techniques to localize defects in increasingly complex devices. He/she must be knowledgeable about deprocessing techniques. He/ she must understand design, layout, fabrication, test, and application. In addition...
Journal Articles
EDFA Technical Articles (2011) 13 (3): 46–48.
Published: 01 August 2011
... only by a few engineers at the cutting edge. These techniques required a further breakthrough to move them into the mainstream. In approximately 2000, some of my colleagues were working on deprocessing ICs by complete silicon removal. For this technique, a die is glued metallization-side down onto...
Journal Articles
EDFA Technical Articles (2010) 12 (2): 4–11.
Published: 01 May 2010
... spacing between S0-bar and B-bar on a multiplexer under various voltages SRAM chip with low-voltage failure. After layer-by-layer deprocessing, no abnor- mality was found in the backend routing; function of time. Figure 4 illustrates a real TRE case in transistor mismatch among the SRAM cells was highly...
Journal Articles
EDFA Technical Articles (2018) 20 (2): 18–24.
Published: 01 May 2018
... pins on the DUT, this technique monitors the modulation in the reflected laser beam from the active regions, such as drain and channel through silicon backside. Figure 4 is a simple diagram of the LVI/LVP setup. The LVI detector collects data in the frequency-domain from numerous points in the field...
Journal Articles
EDFA Technical Articles (2003) 5 (1): 15–21.
Published: 01 February 2003
... into manufacturing process control, and product oriented FA had to face a paradigm shift to analysis techniques from the backside of the chip. All this improved the FA invest situation. However, the performance expectation of the customers remained paired with their unwillingness to define fixed rules. The nuts...