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analog circuits

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Journal Articles
EDFA Technical Articles (2009) 11 (2): 6–14.
Published: 01 May 2009
...Keith R. Sarault; Gerben Boon Time-resolved emission (TRE) systems are used in many FA labs for internal timing analysis of digital ICs. In this article, the authors explain how they use TRE systems to diagnose analog circuit failures as well. The key to their success is the use of an asynchronous...
Journal Articles
EDFA Technical Articles (2015) 17 (4): 14–20.
Published: 01 November 2015
.... They describe each step of the analog circuit editing process, explaining how they deposit, characterize, and connect matched resistors using focused ion beam techniques. During a silicon debug, it was found that the gain of a radio receiver circuit dropped dramatically at certain frequencies due...
Journal Articles
EDFA Technical Articles (2003) 5 (3): 23–28.
Published: 01 August 2003
...Steve Frank This article provides a high level overview of high speed analog circuits and associated failure analysis techniques. It discusses the failure modes and mechanisms of voltage reference circuits, high speed op amps, and digital-to-analog and analog-to-digital converters, the fundamental...
Journal Articles
EDFA Technical Articles (2021) 23 (3): 8–12.
Published: 01 August 2021
... circuit, so that extensive mixed-signal simulations are possible, which include digital and analog functions like analog-to-digital converters (ADC). If this model-based approach is applied Fig. 1 Workflow for a model-based development of subcircuit of a mixed-signal ASIC. and validated in the design...
Journal Articles
EDFA Technical Articles (2004) 6 (1): 6–11.
Published: 01 February 2004
... ~60 µA went through the breakdown path or the path needed a resistance less than 20 k .22 Timing delay in buffer circuit paths did not show substantial degradation until the breakdown leakage current approached 500 µA. It would appear that the most sensitive circuits to oxide breakdown would be analog...
Journal Articles
EDFA Technical Articles (2023) 25 (4): 57–58.
Published: 01 November 2023
... challenges, there is a growing difficulty in the field of analog debug and system-level FA due to the lack of controllability and accessibility for such devices and circuits. The lack of standards for fault modeling and test coverage of analog circuits results to limited or no diagnostics at all. Current OFI...
Journal Articles
EDFA Technical Articles (2010) 12 (3): 44–47.
Published: 01 August 2010
.... Old literature on silicon completely eliminate the original power-demand sensing. This concept has been extended into analog circuits, where the laser is used to modify various analog parameters (e.g., phase delay). absorption was resurrected and used to determine how thin a silicon substrate needed...
Journal Articles
EDFA Technical Articles (2004) 6 (2): 6–11.
Published: 01 May 2004
... trimming of resistors in analog circuits, capacitance tuning in matching circuits, trimming of microstrips or termination stubs in high-frequency circuit applications, enabling or disabling of fuse links in memory chips to invoke redundant memory elements, and so on. Laser trimming is often used...
Journal Articles
EDFA Technical Articles (2010) 12 (4): 12–20.
Published: 01 November 2010
... and a high SNR. Direct monitoring of signals in the frequency domain is also possible. When focusing on one specific spectral line, shifts in the dynamic behavior of an analog circuit can be detected with respect to the local laser influence. General Setup The general setup for laser-based lock...
Journal Articles
EDFA Technical Articles (2005) 7 (1): 10–14.
Published: 01 February 2005
... is not an issue, because most chips now have refractory barrier metals such as Ti:W that are corrosion resistant. However, this becomes a different story with regard to analog circuits, such as operational amplifiers, that have very small input bias requirements. A small amount of electrolytic leakage (10 to 50...
Journal Articles
EDFA Technical Articles (2003) 5 (1): 5–9.
Published: 01 February 2003
... (MEMS). We also have a variety of design complexities, including discrete components, digital circuits, analog circuits, memory circuits, MEMS devices, radio frequency, and optoelectronic components. An example of the circuits analysts now face is shown in Fig. 2. Today s analysts also face more complex...
Journal Articles
EDFA Technical Articles (2004) 6 (1): 13–21.
Published: 01 February 2004
... in Fig. 7. The high current made the problem relatively ob- vious: One of the Vss clamps (M1 in Fig. 8a and b, placed to avoid noise on an analog circuit) was not fully cut off. Connected as shown in Fig. Volume 6, No. 1 Electronic Device Failure Analysis 17 Characterization and Debug of Reverse-Body...
Journal Articles
EDFA Technical Articles (2006) 8 (2): 28–34.
Published: 01 May 2006
... not properly implemented and that the analog circuits of the oscillator were drawing static current. In order to confirm this, a series of focused ion beam (FIB) circuit edit operations were performed on the oscillator. The FIB operations were designed to remove and isolate the oscillator so that it could...
Journal Articles
EDFA Technical Articles (1999) 1 (4): 4–26.
Published: 01 November 1999
...Alan Righter; Alan Kennen Techniques used by failure analysts to provide proper stimuli to diagnose failures in mixed-signal ICs differ from routine digital IC tester stimuli. Mixed-signal parts not only require vector stimulus (i.e., set timing and frequency base), but also analog output sense...
Journal Articles
EDFA Technical Articles (2005) 7 (3): 22–28.
Published: 01 August 2005
.... Figure 3 shows the top-level circuit implementation of ODLYA. The main components of this analysis scheme are PMOS and NMOS current mirrors (CMs), a unity-gain operational amplifier (op-amp), an analog-to-digital converter (ADC), a resistive ladder, a variable resistance generator, and a scan chain...
Journal Articles
EDFA Technical Articles (2009) 11 (1): 14–21.
Published: 01 February 2009
... logo is associated with Precision Monolithics, Inc., which was acquired by Analog Devices in 1990. Inspection of the circuit layout and pin out was also used before deciding if this component was authentic. Motorola In a similar example, Fig. 7 shows a component package marked Motorola, but the die...
Journal Articles
EDFA Technical Articles (2012) 14 (2): 22–27.
Published: 01 May 2012
... with much information on techniques related to from the EFUG website at www.imec.be/efug/. package fault isolation, including x-ray tomography, Nearly 40 people attended the EUFANET workshop, with a topic of Failure Analysis Mechanisms in Analog, Power, and RF Devices and Applications. scanning acoustic...
Journal Articles
EDFA Technical Articles (2017) 19 (4): 22–34.
Published: 01 November 2017
.... Patent 5,086,477, 1992. 28. Calibre xRC Parasitic Extraction, Datasheet, Mentor Graphics,2004. 29. QRC, Extraction User Manual, Version 11, Cadence, 2015, p. 1. 30. Extraction Techniques for High-Performance, High-Capacity Simulation, Synopsys, 2009. 31. Dolphin Integration, Analog & Mixed Signal IC...
Journal Articles
EDFA Technical Articles (1999) 1 (3): 1–28.
Published: 01 August 1999
...Alan Righter This article discusses the challenges involved in testing analog and mixed-signal ICs and provides practical guidance and insights on how to deal with them. Copyright © ASM International® 1999 1999 ASM International analog components mixed-signal ICs mixed signal testers...
Journal Articles
EDFA Technical Articles (2003) 5 (3): 5–11.
Published: 01 August 2003
... techniques external to the chip are also used by debug engineers. These include tools such as logic analyzers that allow the debugger to trace down when incorrect or missing results occur at the pins of a device, and oscilloscopes that can be used to debug analog/timing related events on external pins...