This article summarizes major discussion points from four User’s Group meetings held at the ISTFA 2009 conference. The topics addressed are "Optical Techniques: Growth and Limitations," "Resolution of Nanoprobing for 45 nm and Beyond: New Challenges," "FIB," and "Fast ASIC Fault Isolation: Efficiency and Accurate Resolution of Software-Based Fault Isolation."

This article provides a summary of each of the four User’s Group meetings that took place at ISTFA 2011. The summaries cover key participants, presentation topics, and discussion highlights from each of the following groups: Group 1, Focused Ion Beam; Group 2, 3D Packaging and Failure Analysis; Group 3, Finding the Invisible Defect; and Group 4, Nanoprobing and Electrical Characterization.

This article provides a summary of the presentations given at the four User’s Group meetings at ISTFA 2012. Each user group focused on one of the following topics: nanoprobing, contactless fault isolation, focused ion beam, and sample preparation.

Several technology-focused User's Groups met at ISTFA 2014 to discuss current issues and advances in their areas of interest. This article summarizes key discussion points from the Contactless Fault Isolation User's Group, the Nanoprobing User's Group, the Sample Prep/3-D Package User's Group, and the FIB User's Group.

This article compiles summaries of User Group meetings held at ISTFA 2013, including the Contactless Fault Isolation User’s Group, the Focused Ion Beam User’s Group, the Sample Prep/3D Package User’s Group, and the Nanoprobing User’s Group. For each meeting, a brief synopsis of the presentations and subsequent dialog is provided.

This article provides a recap and summaries of the EDFAS Virtual User Group Workshop held in January 2021. The summaries cover key participants, presentation topics, and discussion highlights from the Focused Ion Beam, Sample Preparation, Contactless Probing and Nanoprobing, and System on Package virtual group meetings.

The 47th International Symposium for Testing and Failure Analysis (ISTFA 2021) was held in Phoenix, Ariz., from October 31 to November 4, 2011. This article provides a summary of the keynote presentation, technical program, panel discussion, tutorials, User Group meetings, and the Women in Electronics Failure Analysis (WEFA) event.

The 36th International Symposium for Testing and Failure Analysis (ISTFA 2010) was held in Dallas, Texas, November 14-18, 2010. This article gives a brief summary of the keynote presentation, technical program, panel discussions, tutorials, and User’s Group meetings.

The 37th International Symposium for Testing and Failure Analysis (ISTFA 2011) was held in San Jose, Calif., November 13-17, 2011. This article provides a summary of the keynote presentation, technical program, panel discussion, tutorials, User’s Group meetings, and equipment exposition.

The 38th International Symposium for Testing and Failure Analysis (ISTFA 2012) was held in Phoenix, Ariz., November 11-15, 2012. This article provides a summary of the keynote presentation, technical program, panel discussion, tutorials, User’s Group meetings, and equipment exposition.

The 39th International Symposium for Testing and Failure Analysis (ISTFA 2013) was held in San Jose, Calif., November 3-7, 2012. This article provides a summary of the keynote presentation, technical program, panel discussion, tutorials, User’s Group meetings, and equipment exposition.

The 41st International Symposium for Testing and Failure Analysis (ISTFA 2015) was held in Portland, Ore., November 1-5, 2015. This article provides a summary of the keynote presentation, technical program, panel discussion, tutorials, User’s Group meetings, and equipment exposition.

The 42nd International Symposium for Testing and Failure Analysis (ISTFA 2016) was held in Fort Worth, Texas, November 6-10, 2016. This article provides a summary of the keynote presentation, technical program, panel discussion, tutorials, and User’s Group meetings.

The 43rd International Symposium for Testing and Failure Analysis (ISTFA 2017) was held in Pasadena, Calif., November 5-9, 2017. This article provides a summary of the keynote presentation, technical program, panel discussion, tutorials, and User’s Group meetings.

The 44th International Symposium for Testing and Failure Analysis (ISTFA 2018) was held in Phoenix, Ariz., October 28 - November 1, 2018. This article provides a summary of the highlights and identifies key contributors to the event. It also includes a summary of a panel discussion on the topic “Failures Worth Analyzing.” It concludes with discussion highlights from the Focused Ion Beam, Sample Preparation, and Contactless Fault Isolation/Nanoprobing user group meetings held at the conference.

The 45th International Symposium for Testing and Failure Analysis (ISTFA 2019) was held in Portland, Oregon, November 10-14, 2019. This article gives a brief summary of the highlights and identifies key contributors to the event. It also includes highlights of panel discussions from the inaugural meeting of Women in Electronics Failure Analysis (WEFA) and the panel discussion "What Does Artificial Intelligence Mean to Failure Analysis Engineers?" The article concludes with a brief recap of each of the four User Group meetings that took place during the conference: Sample Prep, System on Package, FIB/Circuit Edit, and Nanoprobing.

This column provides commentary about the 2020 EDFAS Virtual Workshop. Highlights from the three days of online sessions include a keynote address on the history of MEMS, a panel discussion on 3D packaging technologies, and nearly 60 technical papers and posters. Workshop attendees also had the opportunity to walk through a virtual Expo Hall and learn about new analytical tools and techniques and interact with equipment vendors.

The 40th International Symposium for Testing and Failure Analysis (ISTFA 2014) was held November 8 to 14, 2014, at the George R. Brown Convention Center in Houston, Texas. “Exploring the Many Facets of Failure Analysis,” the theme of ISTFA 2014, emphasized the diverse nature of semiconductor failure analysis in the 21st century. The technical sessions, keynotes, and tutorials at ISTFA 2014 covered a wide range of topics from fault isolation and sample prep to extreme environment failures and the birth of the digital signal processor.

FIB circuit edit tools and techniques have thus far kept pace with the evolution of interconnect materials in ICs and downward scaling of device dimensions. This article assesses the coming challenges for FIB circuit edit technology and the changes that will be necessary to keep FIB-based etching, milling, and deposition viable in the future.

The 22nd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2011) was held October 3 to 7, 2011, in Bordeaux, France. The conference concentrated on two main areas in electronics that concern designers, manufacturers, and users: (1) strategy for quality and reliability assessment of electronic circuits and systems, and (2) advanced analysis techniques for technology and product evaluation. This article reports on highlights of the technical program.