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Product Analysis Forum

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Journal Articles
EDFA Technical Articles (1998) 1 (1): 3–4.
Published: 01 November 1998
...Richard Clark The Product Analysis Forum (PAF), sponsored by the Quality Council of SEMATECH, has been chartered to facilitate the ongoing development of tools and techniques for semiconductor characterization and failure analysis. Drawing on input from industry experts, universities, and national...
Journal Articles
EDFA Technical Articles (2001) 3 (1): 1–18.
Published: 01 February 2001
... extracted from the “Deprocessing/Inspection White Paper” generated by the SEMATECH Product Analysis Forum (PAF), with updates from the PAF response to the International Technology Roadmap for Semiconductors. Copyright © ASM International® 2001 2001 ASM International failure analysis...
Journal Articles
EDFA Technical Articles (2000) 2 (2): 32–32B.
Published: 01 May 2000
... by the SEMATECH Product Analysis Forum (PAF) in 1998 to develop a prototype Schlieren system demonstrated its potential and commercial feasibility ELECTRONIC DEVICE FAILURE ANALYSIS NEWS 32B ...
Journal Articles
EDFA Technical Articles (2001) 3 (4): 15–19.
Published: 01 November 2001
... (AAF) was formed in 1999 as a partner to the successful Sematech Product Analytical Forum (PAF) that concentrates on device-level analytical techniques. The AAF provides much-needed focus on techniques and tools that uniquely impact packaging and assembly and bridge the increasingly blurred interface...
Journal Articles
EDFA Technical Articles (1999) 1 (3): 6–17.
Published: 01 August 1999
... has been the chair of the SEMATECH Product Analysis Forum twice. Richard has been at Intel for the past four years, and holds a BSEE degree from Duke University. Valluri (Bob) Rao is a senior engineering manager at Intel, responsible for research, development, and deployment of advanced chip...
Journal Articles
EDFA Technical Articles (1999) 1 (2): 7–10.
Published: 01 May 1999
... at the University of New Mexico, and televised in the USA, as part of a graduate course in microelectronic failure analysis (see page 7 of the premiere issue of Electronic Device Failure Analysis News for more details). A team from the Sematech Product Analysis Forum, Sandia National Labs, and the University of New...
Journal Articles
EDFA Technical Articles (2001) 3 (4): 29–35.
Published: 01 November 2001
... are in charge beam induced currents, cathodoluminescence, photon emission microscopy, charging in electron beam systems, device reliability, and robust design of electronic systems. Glen Gilfeather is the director of Worldwide Device Analysis at AMD. He chaired the Product Analysis Forum (PAF) of Sematech...
Journal Articles
EDFA Technical Articles (2000) 2 (1): 4–27.
Published: 01 February 2000
..., are iocn.-asing in importance as devices become more complex. The SEMATECH Product Analysis Forum has highlighted fault isolation as its fOrcT11OSt development challenge. 11 is pemaps the most critical step in the FA process. SUbseqUCT1t analysis and defect identification arc CSSCT1tially impossible...