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PCB faults

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Journal Articles
EDFA Technical Articles (2017) 19 (2): 4–9.
Published: 01 May 2017
... are then examined using polarized light which readily passes through the remaining resin and fibers. As the examples in the article show, this approach can reveal a wide range of manufacturing defects in PCBs. Copyright © ASM International® 2017 2017 ASM International ball grid arrays PCB faults...
Journal Articles
EDFA Technical Articles (2021) 23 (1): 22–28.
Published: 01 February 2021
..., httpswww.eds-inc.com/leak.html. 6. J. Xu, J. Li, and Y. Jiang, Components Locating in PCB Fault Diagnosis Based on Infrared Thermal Imaging, Proc. Int Conf. Inform. Comp. Sci., 2009, p. 7-9, doi: 10.1109/ICIC.2009.109. ABOUT THE AUTHORS Zhifeng Zhu earned his bachelor s and master s degrees in materials...
Journal Articles
EDFA Technical Articles (2019) 21 (3): 16–24.
Published: 01 August 2019
... or structure of the chip/printed circuit board (PCB). Noninvasive attacks are executed actively or passively. Examples of active noninvasive attacks are fault injection techniques, brute force, and data remanence. Fault injection inspection/attack involves manipulating a chip in order to cause a transient...
Journal Articles
EDFA Technical Articles (2017) 19 (1): 4–8.
Published: 01 February 2017
... a second reflow. Fig. 4 Cross section of the solder faults from Fig. 3. Short circuits caused by flowing solder as a result of missing solder resist Fig. 3 X-ray image of solder faults at BGA balls Fig. 5 Microscopic inspection of the surface of the PCB reveals faulty solder resist. Underetched films broke...
Journal Articles
EDFA Technical Articles (2013) 15 (1): 35–36.
Published: 01 February 2013
...Dave Burgess One of the co-chairs of the Case Histories sessions at ISTFA 2012 provides a summary of three papers that demonstrate a solid understanding of the semiconductor FA process. The first paper describes the investigation of fractures in PCB traces, the second paper presents a method...
Journal Articles
EDFA Technical Articles (2014) 16 (4): 4–12.
Published: 01 November 2014
... threatened by intermittent PCB contacts. Intermittent PCB contact failures were observed upon introduction and early testing of the product (Fig. 6). Failures were fragile. Reseating modules corrected the faults. Units returned for analysis often worked normally with no problem. Without verifying...
Journal Articles
EDFA Technical Articles (2014) 16 (4): 26–34.
Published: 01 November 2014
...Dave Vallett Magnetic current imaging provides electrical fault isolation for shorts, leakage currents, resistive opens, and complete opens. In addition, it can be performed nondestructively from either side a die, wafer, packaged IC, or PCB. This article reviews the basic theory and attributes...
Journal Articles
EDFA Technical Articles (2001) 3 (4): 15–19.
Published: 01 November 2001
... bumps, bump pads, etc.) will require breakthroughs in real-time 3D Xray inspection. Ideally, such a 3D X-ray instrument could also detect cracks within and between BGA solder balls and PCBs. Acoustic inspection of flip chips is common for underfill defect detection and open bump detection. Smaller die...
Journal Articles
EDFA Technical Articles (2018) 20 (4): 24–29.
Published: 01 November 2018
... a more accurate defect location. Figure 3 shows the waveforms obtained for the failed unit (red trace), a KGD (green trace), a bare printed circuit board (PCB) substrate that terminates at the C4 bump pad (black trace), and a PCB substrate with interposer, which terminates at the µbump pad (blue curve...
Journal Articles
EDFA Technical Articles (2017) 19 (4): 36–44.
Published: 01 November 2017
... to reconstruct the 3-D model. The typical role of lab-based x-ray CT systems in FA and reverse engineering is to provide connectivity information on the printed circuit board (PCB) level and packaging components.[1-5] Synchrotron-based x-ray tomography can improve on the spatial resolution of lab-based x-ray...
Journal Articles
EDFA Technical Articles (2009) 11 (4): 14–21.
Published: 01 November 2009
... applications. Printed circuit boards (PCBs) can be very complex, with multiple layers and a high-density population of components. In addition, a fully populated board can be difficult to handle, and many times it requires time-consuming manual probing to isolate a defect. MCI can scan a large populated PCB...
Journal Articles
EDFA Technical Articles (2013) 15 (2): 4–13.
Published: 01 May 2013
... on the PCB with systemlevel testing. This is required to fully obtain the root cause. and very fast transmission line pulse[6] are examples of attempts to model experimentally observed ESD and reflect the complexity of ESD events in modern nanofabrication. At the American ESD Association s 2012 EOS/ ESD...
Journal Articles
EDFA Technical Articles (2003) 5 (1): 11–14.
Published: 01 February 2003
...Susan X. Li Chip-scale packages (CSPs) make efficient use of space on PCBs, but their small size, multilevel stacking arrangements, and complex interconnects present serious challenges when it comes to testing and failure analysis. This article describes some of the problems encountered when...
Journal Articles
EDFA Technical Articles (2012) 14 (3): 4–11.
Published: 01 August 2012
... redistribution layers (RDLs), chip embedding in laminate (embedded ICs in printed circuit boards, or PCBs), TSVs and TEVs (also used to build capacitors or inductors), and the continual shrinkage of existing interconnect technologies (e.g., fine-pitch wire bonding, highdensity routing of PCBs or laminate...
Journal Articles
EDFA Technical Articles (2022) 24 (2): 24–32.
Published: 01 May 2022
... process in fabrication is provided. The rest of the article is structured as follows: The second section provides an overview to explain interposer for advanced packaging technologies, interposer fabricating parameters, printed circuit board (PCB) vs interposer relationships, and applications. The third...
Journal Articles
EDFA Technical Articles (2021) 23 (4): 14–17.
Published: 01 November 2021
... microscopy, x-ray, EDX, and light microscopy. Barth has a special interest in solving difficult preparation tasks. His expertise ranges from PCB cracks to transistor gate oxide defects, including anomalies in capacitors, diodes, resistors, and dendrite growth on circuit boards. edfas.org ...
Journal Articles
EDFA Technical Articles (2013) 15 (2): 14–21.
Published: 01 May 2013
...Susan Li Chip-scale packages (CSPs) make efficient use of space on PCBs, but their small size, multilevel stacking arrangements, and complex interconnects present serious challenges when it comes to testing and failure analysis. This article describes some of the problems encountered when dealing...
Journal Articles
EDFA Technical Articles (2020) 22 (1): 14–19.
Published: 01 February 2020
...-378. 4. N. Erdman, R. Campbell, and S. Asahina: Precise SEM Cross Section Polishing via Argon Beam Milling, Microscopy Today, 2006, 14, p. 22-25. 5. M.J. Solis: Alternative Methods for Cross-Sectioning of SMT and PCB Related Architectures, SMTA International Conference Proceedings, 2015, p. 122...
Journal Articles
EDFA Technical Articles (2022) 24 (1): 33–42.
Published: 01 February 2022
... using a low stress molding compound to re-encapsulate the backside or using dummy Si or underfill for support. Bryan Tracy requested recommendations for a midsized, fast band saw that is multimaterial compatible for cutting aluminum around a PCB board. Suggestions included a diamond wire saw, Harbor...
Journal Articles
EDFA Technical Articles (2020) 22 (2): 4–12.
Published: 01 May 2020
... Proc. Symp. Phys. Fai. Anal. Integr. Circuits (IPFA), 2016, p. 374-378. 16. M.J. Solis, Alternative Methods for Cross-Sectioning of SMT and PCB Related Architectures, SMTA International Conference Proceedings, 2015, p. 122-127. ABOUT THE AUTHORS Fauzia Khatkhatay earned her doctorate degree from Texas...