Skip Nav Destination
Close Modal
Search Results for
MEMS devices
Update search
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
NARROW
Format
Topics
Journal
Article Type
Date
Availability
1-20 of 41 Search Results for
MEMS devices
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
1
Sort by
Journal Articles
EDFA Technical Articles (2007) 9 (4): 48–51.
Published: 01 November 2007
...Colin Drummond This column explains how simulation tools and materials life data can provide a new level of productivity for engineers involved in forensic analysis of MEMS devices. Copyright © ASM International® 2007 2007 ASM International simulation materials data MEMS devices...
Abstract
View article
PDF
This column explains how simulation tools and materials life data can provide a new level of productivity for engineers involved in forensic analysis of MEMS devices.
Journal Articles
EDFA Technical Articles (2000) 2 (3): 4–7.
Published: 01 August 2000
...Jeremy A. Walraven; Kenneth A. Peterson Experiments to assess microelectromechanical systems (MEMS) test their functionality and materials properties. These experiments provide knowledge and insight into MEMS failure modes and potential pathways to improve the lifetime of MEMS devices. This article...
Abstract
View article
PDF
Experiments to assess microelectromechanical systems (MEMS) test their functionality and materials properties. These experiments provide knowledge and insight into MEMS failure modes and potential pathways to improve the lifetime of MEMS devices. This article demonstrates the use of optical microscopy and SEM analysis to determine various causes of failure in MEMS devices.
Journal Articles
EDFA Technical Articles (2002) 4 (3): 11–14.
Published: 01 August 2002
...Jeremy A. Walraven; Jerry M. Soden; Edward I. Cole, Jr. This article presents the results of a study conducted at Sandia National Labs to assess the effect of electrostatic discharge on surface micromachined MEMS devices. This failure mode has largely been overlooked because ESD failure mechanisms...
Abstract
View article
PDF
This article presents the results of a study conducted at Sandia National Labs to assess the effect of electrostatic discharge on surface micromachined MEMS devices. This failure mode has largely been overlooked because ESD failure mechanisms often mimic the effects of stiction-adhesion. To measure the susceptibility of MEMS devices to ESD, Sandia engineers built and tested a silicon microengine and a torsional ratcheting microactuator. Test results indicate that the effects of ESD are highly dependent on device design, component stiffness, and geometry and that slight modifications can bring improvements.
Journal Articles
EDFA Technical Articles (2018) 20 (4): 24–29.
Published: 01 November 2018
... packages, and MEMS devices. It also discusses recent advancements in EOTPR systems and software. Electro optical terahertz pulse reflectometry (EOTPR) is a nondestructive fault isolation technique that is well suited for today’s ICs. This article provides examples of how EOTPR is being used...
Abstract
View article
PDF
Electro optical terahertz pulse reflectometry (EOTPR) is a nondestructive fault isolation technique that is well suited for today’s ICs. This article provides examples of how EOTPR is being used to investigate 2.5D and 3D packages, wafer level fanout packages, and MEMS devices. It also discusses recent advancements in EOTPR systems and software.
Journal Articles
EDFA Technical Articles (2000) 2 (4): 4–23.
Published: 01 November 2000
...Jeremy A. Walraven; Kenneth A. Peterson This article describes how focused ion beam (FIB) technology is being used in combination with various other analytical tools for failure and yield analysis of MEMS devices. It provides examples showing how FIB is used with TEM analysis, AFM analysis...
Abstract
View article
PDF
This article describes how focused ion beam (FIB) technology is being used in combination with various other analytical tools for failure and yield analysis of MEMS devices. It provides examples showing how FIB is used with TEM analysis, AFM analysis, scanning acoustic microscopy, and scanning laser microscopy.
Journal Articles
EDFA Technical Articles (2021) 23 (1): 50–51.
Published: 01 February 2021
... and made available to attendees for 30 days. The virtual format also made voting for best paper and best poster simpler. The theme for the workshop was The Rise of MEMS and 3D Failure Analysis. Microelectromechanical systems (MEMS) devices measure phenomena in the physical world and translate those...
Abstract
View article
PDF
This column provides commentary about the 2020 EDFAS Virtual Workshop. Highlights from the three days of online sessions include a keynote address on the history of MEMS, a panel discussion on 3D packaging technologies, and nearly 60 technical papers and posters. Workshop attendees also had the opportunity to walk through a virtual Expo Hall and learn about new analytical tools and techniques and interact with equipment vendors.
Journal Articles
EDFA Technical Articles (2000) 2 (4): 10–11.
Published: 01 November 2000
... of silicon device FIB cross sections. The best cross sectioning results for observing the structure of the mushroom shaped gate were obtained when we specifically milled through the air bridge. Air bridges and gaps also occur in MEMs devices. A future publication will address the issues associated...
Abstract
View article
PDF
High-frequency devices such as monolithic microwave ICs (MMICs) are used in telecommunication devices as well as in satellites for earth imaging and radar applications. This article discusses the use of focused ion beam (FIB) cross sectioning and sample decoration techniques for analyzing MMICs and III-V materials.
Journal Articles
EDFA Technical Articles (2003) 5 (4): 5–10.
Published: 01 November 2003
... to satisfy the needs of the communications and other emerging market segments. Some of these products are cell phones, PDAs, routers, hubs, switches, memory devices, flash cards, network processing units, optical devices (switches, amplifiers, diodes), and MEMS (accelerometers for air bags, ink jet printers...
Abstract
View article
PDF
The Assembly Analytical Forum (AAF) is an organization under the auspices of the Sematech Quality Council. The AAF charter is to develop Packaging Analytical Roadmaps five to ten years into the future that are consistent with the International Technology Roadmap for semiconductors (ITRS). At ISTFA 2003, the AAF will convene with interested conference attendees to review, edit, and validate a white paper that will quantify critical gaps in the current suite of test, measurement, and characterization tools used in the semiconductor industry and provide recommendations on how to address them. The intent is to update the document biannually and review it in numerous industry venues to ensure its relevancy and utility. This article is somewhat of a preview to the Rev 0 AAF white paper.
Journal Articles
EDFA Technical Articles (2003) 5 (1): 5–9.
Published: 01 February 2003
... (MEMS). We also have a variety of design complexities, including discrete components, digital circuits, analog circuits, memory circuits, MEMS devices, radio frequency, and optoelectronic components. An example of the circuits analysts now face is shown in Fig. 2. Today s analysts also face more complex...
Abstract
View article
PDF
Analysis of semiconductor components is an increasingly complex task. Today’s analyst is called on to find a needle in a haystack. Every year, the needles get smaller, the haystacks get bigger, and the customer wants them found faster. With this in mind, how should we train analysts to perform this daunting task? There are several major thrusts that our education/training efforts need to take if we are to successfully analyze modern semiconductor components. These thrusts include: process, technology, cross-training, and techniques. This article discusses the history of training activities in the failure/product analysis discipline and describes where this area is heading.
Journal Articles
EDFA Technical Articles (2021) 23 (4): 28–37.
Published: 01 November 2021
... While there are many methods for constructing an ion trap for QIS experiments,[9] the ion trap chips used in the failure examples discussed here are constructed on silicon (Si) substrates using both very large-scale integration (VLSI) integrated circuit and microelectromechanical systems (MEMS) device...
Abstract
View article
PDF
Trapped ion systems are one of the leading technology platforms for quantum computing. This article describes the construction and operation of ion trap devices and the various modes of failure that have been observed. Examples of failure in either the rendering or use of packaged trap chips are presented, including electrode shorts and opens, detached bond wires, and RF breakdown damage.
Journal Articles
EDFA Technical Articles (2017) 19 (4): 4–9.
Published: 01 November 2017
... and broad technical scope allowed him to assume the Chief Executive Officer position at NOVA MEMS (now ELEMCA) in early 2013. He is still involved in many failure analysis processes, dealing with both electronic devices and MEMS components. edfas.org ...
Abstract
View article
PDF
In this case study, the author describes the investigation of a defective DC-DC converter retrieved from an aircraft following the report of abnormal system behavior. Electrical testing, local probing, X-ray imaging, and cross-sectional analysis led to the discovery of cracks on several pins and in some of the solder material. The cracks were caused by different rates of thermal expansion and were remedied with the help of thermomechanical analysis, EBSD imaging, and phase map comparisons for thick and thin solder joints.
Journal Articles
EDFA Technical Articles (2008) 10 (4): 30–32.
Published: 01 November 2008
...E. Jan Vardaman This article provides a brief introduction to through-silicon via technology, a system-level architecture in which multiple layers of planar devices are stacked with interconnects running in the vertical as well as lateral direction. Some of the different fabrication processes...
Abstract
View article
PDF
This article provides a brief introduction to through-silicon via technology, a system-level architecture in which multiple layers of planar devices are stacked with interconnects running in the vertical as well as lateral direction. Some of the different fabrication processes in use are discussed along with related challenges.
Journal Articles
EDFA Technical Articles (2017) 19 (4): 12–20.
Published: 01 November 2017
... technology for the past five years. He has also spent more than 10 years doing research on MEMS devices. Before joining PrimeNano, Inc. in 2014 as a research and development scientist, Dr. Yang was a postdoctoral student at Stanford University, developing scanning microwave impedance microscopy (sMIM...
Abstract
View article
PDF
Scanning microwave impedance microscopy (sMIM) is a relatively new method for making electrical measurements on test samples in AFMs. This article presents examples in which sMIM technology is used to measure dielectric coefficients, doping concentrations, and nanoscale C-V curves for different semiconductor and dielectric materials. It also explains how measured results compare with theoretical models, confirming the validity of each approach.
Journal Articles
EDFA Technical Articles (2012) 14 (3): 4–11.
Published: 01 August 2012
... are essential. Furthermore, FA is becoming an important strategic enabling factor for new products, not just another “cost factor.” Copyright © ASM International® 2012 2012 ASM International 3D integration 3-D x-ray computer tomography electronic device packaging SiP devices httpsdoi.org...
Abstract
View article
PDF
It seems that scaling of chip technology according to Moore’s Law will continue for digital functionalities (logic and memory); however, increasing system integration on chip and package levels, called “More than Moore,” has been observed in the past several years. This strong trend in the worldwide semiconductor industry enables more functionality, diversification, and higher value by creating smart microsystems. This article discusses the many challenges faced in FA of 3-D chips, where well-staffed and equipped FA labs are essential. Furthermore, FA is becoming an important strategic enabling factor for new products, not just another “cost factor.”
Journal Articles
EDFA Technical Articles (2018) 20 (2): 26–32.
Published: 01 May 2018
... within its trench to a specimen carrier using a glass probe micromanipulator.[6] S/TEM EXLO specimens are usually manipulated to carbon, formvar, or holey carbon coated 3-mm grids or similar. In addition, S/TEM EXLO specimens can also be manipulated to MEMS devices for heating, electrical, or other...
Abstract
View article
PDF
Ex-situ lift out (EXLO) techniques rely on van der Waals forces to transfer FIB milled specimens to various types of carriers using a glass probe micromanipulator. This article describes some of the latest EXLO techniques for site specific scanning transmission electron microscopy, including the use slotted half-grids and vacuum-assisted lift out for plan-view analysis.
Journal Articles
EDFA Technical Articles (2014) 16 (2): 26–32.
Published: 01 May 2014
... those in the very near future. Yet, backside imaging is a critical tool for testing and FA of semiconductor devices, because metallization and packaging prevent frontside access. Backside imaging is used with many FA techniques, such as photon-emission microscopy, laser voltage probing, and laser...
Abstract
View article
PDF
Researchers at Boston University have made significant improvements in the resolution that can be achieved with backside imaging techniques. In this article, they explain how they optimize lateral and longitudinal resolution of IR-based methods using aplanatic solid immersion lenses in combination with adaptive optics that correct for aberrations, interferometry to improve signal-to-noise ratios, vortex beams that overcome diffraction limitations, and image reconstruction techniques based on prior knowledge about the objects under investigation.
Journal Articles
EDFA Technical Articles (2013) 15 (1): 4–9.
Published: 01 February 2013
... as a postdoctoral scholar at the University of California at Berkeley. His research interests include MEMS/NEMS sensors, radio-frequency signal processors, solar cells, photonic crystals, and thermoelectric devices. He has authored and coauthored more than 70 technical publications. 8 Electronic Device Failure...
Abstract
View article
PDF
Engineers at Sandia National Laboratories have developed a technology that may bring down the cost and improve the efficiency of photovoltaic energy conversion. Here they explain how they manufacture photovoltaic modules containing as many as 100,000 silicon solar cells using conventional IC fabrication and PCB assembly techniques. They also explain how they estimate module efficiency based on the IV characteristics of individual cells and the detection of open and short circuits.
Journal Articles
EDFA Technical Articles (2023) 25 (3): 23–30.
Published: 01 August 2023
... photonics KWWSVGRL RUJDVP HGIDS EDFAAO (2023) 3:23-30 1537-0755/$19.00 ©ASM International® 23 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 25 NO. 3 FAILURE ANALYSIS OF PHOTONIC INTEGRATED CIRCUITS Frieder H. Baumann, Brian Popielarski, Ryan Sweeney, Felix Beaudoin, and Ken Giewont GlobalFoundries, Malta...
Abstract
View article
PDF
This article introduces silicon photonics, describes what is needed for photonics failure analysis, and shows examples of analysis results for failures in modern silicon photonics circuits.
Journal Articles
EDFA Technical Articles (2011) 13 (2): 4–11.
Published: 01 May 2011
... new imaging techniques to meet the challenges posed by thin-silicon devices, including MEMS, stacked die, through-silicon vias, and flip-chips. These techniques involve higher ultrasonic frequencies as Fig. 10 Unencapsulated stacked die with small voids imaged at 230 MHz 10 Electronic Device Failure...
Abstract
View article
PDF
Acoustic microimaging has advanced over the past few years in response to the growing use of thinner silicon die and innovative packaging designs. This article reviews the basic principles of acoustic imaging technology and describes some of the applications made possible by improvements in spatial resolution, focal length, F-number, and water couplant temperature control. It also discusses common imaging challenges and explains how they can be resolved.
Journal Articles
EDFA Technical Articles (2021) 23 (1): 29–33.
Published: 01 February 2021
...:29-33 httpsdoi.org/10.31399/asm.edfa.2021-1.p029 1537-0755/$19.00 ©ASM International® 29 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 23 NO. 1 COMPUTATIONAL FAILURE ANALYSIS OF RESISTIVE RAM USED AS A SYNAPSE IN A CONVOLUTION NEURAL NETWORK FOR IMAGE CLASSIFICATION Nagaraj Lakshmana Prabhu...
Abstract
View article
PDF
Various NVM technologies are being explored for neuromorphic system realization, including resistive RAM, ferroelectric RAM, phase change RAM, spin transfer torque RAM, and NAND flash. This article discusses the potential of RRAM for such applications and evaluates key performance and reliability metrics in the context of neural network image classification. The authors conclude that the accuracy-power tradeoff may be further improved using alternative material stacks and multi-layer dielectrics so as to achieve better control of the oxygen vacancy or metallic filamentation process that governs RRAM switching characteristics.
1