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MEMS devices

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Journal Articles
EDFA Technical Articles (2007) 9 (4): 48–51.
Published: 01 November 2007
...Colin Drummond This column explains how simulation tools and materials life data can provide a new level of productivity for engineers involved in forensic analysis of MEMS devices. Copyright © ASM International® 2007 2007 ASM International simulation materials data MEMS devices...
Journal Articles
EDFA Technical Articles (2000) 2 (3): 4–7.
Published: 01 August 2000
...Jeremy A. Walraven; Kenneth A. Peterson Experiments to assess microelectromechanical systems (MEMS) test their functionality and materials properties. These experiments provide knowledge and insight into MEMS failure modes and potential pathways to improve the lifetime of MEMS devices. This article...
Journal Articles
EDFA Technical Articles (2002) 4 (3): 11–14.
Published: 01 August 2002
...Jeremy A. Walraven; Jerry M. Soden; Edward I. Cole, Jr. This article presents the results of a study conducted at Sandia National Labs to assess the effect of electrostatic discharge on surface micromachined MEMS devices. This failure mode has largely been overlooked because ESD failure mechanisms...
Journal Articles
EDFA Technical Articles (2018) 20 (4): 24–29.
Published: 01 November 2018
... packages, and MEMS devices. It also discusses recent advancements in EOTPR systems and software. Electro optical terahertz pulse reflectometry (EOTPR) is a nondestructive fault isolation technique that is well suited for today’s ICs. This article provides examples of how EOTPR is being used...
Journal Articles
EDFA Technical Articles (2000) 2 (4): 4–23.
Published: 01 November 2000
...Jeremy A. Walraven; Kenneth A. Peterson This article describes how focused ion beam (FIB) technology is being used in combination with various other analytical tools for failure and yield analysis of MEMS devices. It provides examples showing how FIB is used with TEM analysis, AFM analysis...
Journal Articles
EDFA Technical Articles (2021) 23 (1): 50–51.
Published: 01 February 2021
... and made available to attendees for 30 days. The virtual format also made voting for best paper and best poster simpler. The theme for the workshop was The Rise of MEMS and 3D Failure Analysis. Microelectromechanical systems (MEMS) devices measure phenomena in the physical world and translate those...
Journal Articles
EDFA Technical Articles (2000) 2 (4): 10–11.
Published: 01 November 2000
... of silicon device FIB cross sections. The best cross sectioning results for observing the structure of the mushroom shaped gate were obtained when we specifically milled through the air bridge. Air bridges and gaps also occur in MEMs devices. A future publication will address the issues associated...
Journal Articles
EDFA Technical Articles (2003) 5 (4): 5–10.
Published: 01 November 2003
... to satisfy the needs of the communications and other emerging market segments. Some of these products are cell phones, PDAs, routers, hubs, switches, memory devices, flash cards, network processing units, optical devices (switches, amplifiers, diodes), and MEMS (accelerometers for air bags, ink jet printers...
Journal Articles
EDFA Technical Articles (2003) 5 (1): 5–9.
Published: 01 February 2003
... (MEMS). We also have a variety of design complexities, including discrete components, digital circuits, analog circuits, memory circuits, MEMS devices, radio frequency, and optoelectronic components. An example of the circuits analysts now face is shown in Fig. 2. Today s analysts also face more complex...
Journal Articles
EDFA Technical Articles (2021) 23 (4): 28–37.
Published: 01 November 2021
... While there are many methods for constructing an ion trap for QIS experiments,[9] the ion trap chips used in the failure examples discussed here are constructed on silicon (Si) substrates using both very large-scale integration (VLSI) integrated circuit and microelectromechanical systems (MEMS) device...
Journal Articles
EDFA Technical Articles (2017) 19 (4): 4–9.
Published: 01 November 2017
... and broad technical scope allowed him to assume the Chief Executive Officer position at NOVA MEMS (now ELEMCA) in early 2013. He is still involved in many failure analysis processes, dealing with both electronic devices and MEMS components. edfas.org ...
Journal Articles
EDFA Technical Articles (2008) 10 (4): 30–32.
Published: 01 November 2008
...E. Jan Vardaman This article provides a brief introduction to through-silicon via technology, a system-level architecture in which multiple layers of planar devices are stacked with interconnects running in the vertical as well as lateral direction. Some of the different fabrication processes...
Journal Articles
EDFA Technical Articles (2017) 19 (4): 12–20.
Published: 01 November 2017
... technology for the past five years. He has also spent more than 10 years doing research on MEMS devices. Before joining PrimeNano, Inc. in 2014 as a research and development scientist, Dr. Yang was a postdoctoral student at Stanford University, developing scanning microwave impedance microscopy (sMIM...
Journal Articles
EDFA Technical Articles (2012) 14 (3): 4–11.
Published: 01 August 2012
... are essential. Furthermore, FA is becoming an important strategic enabling factor for new products, not just another “cost factor.” Copyright © ASM International® 2012 2012 ASM International 3D integration 3-D x-ray computer tomography electronic device packaging SiP devices httpsdoi.org...
Journal Articles
EDFA Technical Articles (2018) 20 (2): 26–32.
Published: 01 May 2018
... within its trench to a specimen carrier using a glass probe micromanipulator.[6] S/TEM EXLO specimens are usually manipulated to carbon, formvar, or holey carbon coated 3-mm grids or similar. In addition, S/TEM EXLO specimens can also be manipulated to MEMS devices for heating, electrical, or other...
Journal Articles
EDFA Technical Articles (2014) 16 (2): 26–32.
Published: 01 May 2014
... those in the very near future. Yet, backside imaging is a critical tool for testing and FA of semiconductor devices, because metallization and packaging prevent frontside access. Backside imaging is used with many FA techniques, such as photon-emission microscopy, laser voltage probing, and laser...
Journal Articles
EDFA Technical Articles (2013) 15 (1): 4–9.
Published: 01 February 2013
... as a postdoctoral scholar at the University of California at Berkeley. His research interests include MEMS/NEMS sensors, radio-frequency signal processors, solar cells, photonic crystals, and thermoelectric devices. He has authored and coauthored more than 70 technical publications. 8 Electronic Device Failure...
Journal Articles
EDFA Technical Articles (2023) 25 (3): 23–30.
Published: 01 August 2023
... photonics KWWSVGRL RUJDVP HGIDS EDFAAO (2023) 3:23-30 1537-0755/$19.00 ©ASM International® 23 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 25 NO. 3 FAILURE ANALYSIS OF PHOTONIC INTEGRATED CIRCUITS Frieder H. Baumann, Brian Popielarski, Ryan Sweeney, Felix Beaudoin, and Ken Giewont GlobalFoundries, Malta...
Journal Articles
EDFA Technical Articles (2011) 13 (2): 4–11.
Published: 01 May 2011
... new imaging techniques to meet the challenges posed by thin-silicon devices, including MEMS, stacked die, through-silicon vias, and flip-chips. These techniques involve higher ultrasonic frequencies as Fig. 10 Unencapsulated stacked die with small voids imaged at 230 MHz 10 Electronic Device Failure...
Journal Articles
EDFA Technical Articles (2021) 23 (1): 29–33.
Published: 01 February 2021
...:29-33 httpsdoi.org/10.31399/asm.edfa.2021-1.p029 1537-0755/$19.00 ©ASM International® 29 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 23 NO. 1 COMPUTATIONAL FAILURE ANALYSIS OF RESISTIVE RAM USED AS A SYNAPSE IN A CONVOLUTION NEURAL NETWORK FOR IMAGE CLASSIFICATION Nagaraj Lakshmana Prabhu...