The 36th International Symposium for Testing and Failure Analysis (ISTFA 2010) was held in Dallas, Texas, November 14-18, 2010. This article gives a brief summary of the keynote presentation, technical program, panel discussions, tutorials, and User’s Group meetings.

Summary of a panel discussion held at ISTFA 2009 to address the following questions. Where is failure analysis heading as a business? What career options are open to an engineer in this field? How do I demonstrate my value to management? Which skills and knowledge will be needed tomorrow? What can I do to find new employment? Should I start or continue my career in semiconductor failure analysis?

This article summarizes major discussion points from four User’s Group meetings held at the ISTFA 2009 conference. The topics addressed are "Optical Techniques: Growth and Limitations," "Resolution of Nanoprobing for 45 nm and Beyond: New Challenges," "FIB," and "Fast ASIC Fault Isolation: Efficiency and Accurate Resolution of Software-Based Fault Isolation."

The 47th International Symposium for Testing and Failure Analysis (ISTFA 2021) was held in Phoenix, Ariz., from October 31 to November 4, 2011. This article provides a summary of the keynote presentation, technical program, panel discussion, tutorials, User Group meetings, and the Women in Electronics Failure Analysis (WEFA) event.

A brief look at the roots of ISTFA, the International Symposium for Testing and Failure Analysis.

At the ISTFA ’99 event, the organizers arranged for the first time a panel discussion on failure analysis related purely to EOS/ESD issues. Each panelist presented their area of expertise followed by two hours of lively exchange with the attendees and among attendees. The panel discussed how to differentiate EOS and ESD failures. These failures are more critical with the industry move to submicron geometries and newer interconnect materials and other processing technologies, such as copper and flip-chip processing.

This article reviews key events from past International Symposium for Testing and Failure Analysis events, held in 1975, 1985, and 1995.

This feature periodically visits significant moments in the life of ISTFA over the past three decades. This article reviews key events from past International Symposium for Testing and Failure Analysis events, held in 1976, 1986, and 1996.

The organizer and moderator of the ISTFA 2007 panel discussion on failure analysis and testing of medical devices provide a summary of the discussion topics and areas of focus.

The 37th International Symposium for Testing and Failure Analysis (ISTFA 2011) was held in San Jose, Calif., November 13-17, 2011. This article provides a summary of the keynote presentation, technical program, panel discussion, tutorials, User’s Group meetings, and equipment exposition.

This article provides a summary of each of the four User’s Group meetings that took place at ISTFA 2011. The summaries cover key participants, presentation topics, and discussion highlights from each of the following groups: Group 1, Focused Ion Beam; Group 2, 3D Packaging and Failure Analysis; Group 3, Finding the Invisible Defect; and Group 4, Nanoprobing and Electrical Characterization.

This article provides a summary of the ISTFA 2011 Panel Discussion, which centered on the challenge of finding ever-smaller defects in semiconductor devices.

This article provides a summary of the presentations given at the four User’s Group meetings at ISTFA 2012. Each user group focused on one of the following topics: nanoprobing, contactless fault isolation, focused ion beam, and sample preparation.

The 38th International Symposium for Testing and Failure Analysis (ISTFA 2012) was held in Phoenix, Ariz., November 11-15, 2012. This article provides a summary of the keynote presentation, technical program, panel discussion, tutorials, User’s Group meetings, and equipment exposition.

This article provides a summary of the ISTFA 2012 Panel Discussion on the FA challenges associated with 3D integrated packages.

This article compiles summaries of User Group meetings held at ISTFA 2013, including the Contactless Fault Isolation User’s Group, the Focused Ion Beam User’s Group, the Sample Prep/3D Package User’s Group, and the Nanoprobing User’s Group. For each meeting, a brief synopsis of the presentations and subsequent dialog is provided.

This article provides a summary of the ISTFA 2013 Panel Discussion on failure analysis and reliability challenges in photovoltaic systems.

The 39th International Symposium for Testing and Failure Analysis (ISTFA 2013) was held in San Jose, Calif., November 3-7, 2012. This article provides a summary of the keynote presentation, technical program, panel discussion, tutorials, User’s Group meetings, and equipment exposition.

Several technology-focused User's Groups met at ISTFA 2014 to discuss current issues and advances in their areas of interest. This article summarizes key discussion points from the Contactless Fault Isolation User's Group, the Nanoprobing User's Group, the Sample Prep/3-D Package User's Group, and the FIB User's Group.

Four panel members participated in the ISTFA 2014 Panel Discussion on the importance of correctly determining the cause of failure in electronic devices and systems designated for use in space, downhole drilling, and other such applications. Reliability of these components is critical because they cannot be easily replaced and malfunctions can be catastrophic. The panelists presented several methods for analyzing failures in integrated electrical systems and identifying the root cause.