This article explains how the addition of FIB tunable circuits in critical paths on ICs can alleviate some of the challenges encountered during the implementation of mixed-signal ASICs. It walks readers through the implementation of a particular digital ASIC, explaining where and how FIB tunable circuits were used to overcome difficulties, resolve problems, and realize a fully functional chip that met all system specifications on the first pass of the design.

This column discusses the potential benefits of developing a dedicated synchrotron-based tool suite for advanced, high-throughput characterization, deprocessing, and validation of ICs.

The 42nd International Symposium for Testing and Failure Analysis (ISTFA 2016) was held in Fort Worth, Texas, November 6-10, 2016. This article provides a summary of the keynote presentation, technical program, panel discussion, tutorials, and User’s Group meetings.

This article discusses the emergence of nanoelectronics and the effect it may have on semiconductor testing and failure analysis. It describes the different types of quantum effect and molecular electronic devices that have been produced, explaining how they are made, how they work, and the changes that may be required to manufacture and test these devices at scale.