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FIB circuit edit
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Journal Articles
EDFA Technical Articles (2008) 10 (3): 6–16.
Published: 01 August 2008
...Ted Lundquist; Mark Thompson; Vladimir Makarov FIB circuit edit tools and techniques have thus far kept pace with the evolution of interconnect materials in ICs and downward scaling of device dimensions. This article assesses the coming challenges for FIB circuit edit technology and the changes...
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FIB circuit edit tools and techniques have thus far kept pace with the evolution of interconnect materials in ICs and downward scaling of device dimensions. This article assesses the coming challenges for FIB circuit edit technology and the changes that will be necessary to keep FIB-based etching, milling, and deposition viable in the future.
Journal Articles
EDFA Technical Articles (2014) 16 (3): 20–23.
Published: 01 August 2014
...Taqi Mohiuddin This article discusses recent improvements in FIB circuit edit as well as general uses and optimization techniques. Copyright © ASM International® 2014 2014 ASM International FIB circuit edit focused ion beam httpsdoi.org/10.31399/asm.edfa.2014-3.p020 EDFAAO (2014) 3:20...
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This article discusses recent improvements in FIB circuit edit as well as general uses and optimization techniques.
Journal Articles
EDFA Technical Articles (2010) 12 (1): 6–12.
Published: 01 February 2010
... and promotes the implementation of all edits at the contact level to avoid milling into the metal layers. This article describes the FIB-based circuit edit process and presents several case studies demonstrating its use on 65 nm technology devices. Copyright © ASM International® 2010 2010 ASM International...
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Designing circuit edits at the contact level offers tremendous advantages in reliability and yield success over similar edits designed in the metal stack. To that end, a full-thickness backside circuit edit strategy has been developed that eliminates part thinning and promotes the implementation of all edits at the contact level to avoid milling into the metal layers. This article describes the FIB-based circuit edit process and presents several case studies demonstrating its use on 65 nm technology devices.
Journal Articles
EDFA Technical Articles (2023) 25 (2): 9–13.
Published: 01 May 2023
...David Akerson This article provides an introduction to focused ion beam (FIB) circuit editing, covering the basic process along with best practices and procedures. Copyright © ASM International® 2023 2023 ASM International This article provides an introduction to focused ion beam (FIB...
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This article provides an introduction to focused ion beam (FIB) circuit editing, covering the basic process along with best practices and procedures.
Journal Articles
EDFA Technical Articles (2000) 2 (4): 13–16.
Published: 01 November 2000
... into a newer, faster one. Resolution of the problem, as the article explains, required advanced DFD/DFT (design for debug/design for test) techniques and FIB circuit edit to resolve. Copyright © ASM International® 2000 2000 ASM International debug FIB circuit edit schmoo plots timing analysis...
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Shmoo plotting began in the early 1970s and still has wide use in characterizing device performance against various parameters. Typically, Shmoo plots measure device frequency or cycle time versus voltage. The debug described in this article focused on problems (holes) in Shmoo plots discovered while designing a 637-MHz microprocessor. This problem had two distinct phases as the microprocessor design migrated from an older CMOS process technology into a newer, faster one. Resolution of the problem, as the article explains, required advanced DFD/DFT (design for debug/design for test) techniques and FIB circuit edit to resolve.
Journal Articles
EDFA Technical Articles (2003) 5 (4): 13–24.
Published: 01 November 2003
... etching, and FIB circuit edit and modification. Copyright © ASM International® 2003 2003 ASM International backside analysis laser voltage probing light induced voltage alteration photon emission microscopy thinning httpsdoi.org/10.31399/asm.edfa.2003-4.p013 EDFAAO (2003) 4:13-24 Review ©...
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This article provides a high-level review of the tools and techniques used for backside analysis. It discusses the use of laser scanning and conventional microscopy, liquid and solid immersion lenses, photon emission microscopy (PEM), and laser-based fault isolation methods with emphasis on light-induced voltage alteration (LIVA). It explains how laser voltage probing is used for backside waveform acquisition and describes backside sample preparation and deprocessing techniques including parallel polishing and milling, laser chemical etching, and FIB circuit edit and modification.
Journal Articles
EDFA Technical Articles (2020) 22 (1): 30–41.
Published: 01 February 2020
..., FIB/Circuit Edit, and Nanoprobing. Copyright © ASM International® 2020 2020 ASM International ISTFA 30 EDFAAO (2020) 1:30-32 httpsdoi.org/10.31399/asm.edfa.2020-1.p030 1537-0755/$19.00 ©ASM International® ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 22 NO. 1 ISTFA 2019 HIGHLIGHTS Felix...
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The 45th International Symposium for Testing and Failure Analysis (ISTFA 2019) was held in Portland, Oregon, November 10-14, 2019. This article gives a brief summary of the highlights and identifies key contributors to the event. It also includes highlights of panel discussions from the inaugural meeting of Women in Electronics Failure Analysis (WEFA) and the panel discussion "What Does Artificial Intelligence Mean to Failure Analysis Engineers?" The article concludes with a brief recap of each of the four User Group meetings that took place during the conference: Sample Prep, System on Package, FIB/Circuit Edit, and Nanoprobing.
Journal Articles
EDFA Technical Articles (2011) 13 (2): 12–18.
Published: 01 May 2011
... metallization etch rates FIB circuit edit iodine compound low-k dielectric httpsdoi.org/10.31399/asm.edfa.2011-2.p012 EDFAAO (2011) 2:12-18 Circuit Editing 1537-0755/$19.00 ©ASM International® The Copper Challenge to Circuit Edit Tahir Malik and Ted Lundquist, DCG Systems tahir_malik@dcgsystems.com C...
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The presence of copper layers separated by low-k dielectrics in today’s ICs is a major problem for circuit edit engineers. This article explains why and presents a solution that addresses the challenges CE engineers face. According to the authors, the difficulties are primarily due to the interaction of the ion beam with variations in copper grain orientation, the effects of halogen corrosion, and the presence of CuF. As a result, copper milling tends to be uneven and edit times tend to be quite long. The solution presented is based on a chemically-assisted milling and etching process that quickly and uniformly removes copper and dielectric layers while maintaining planarity.
Journal Articles
EDFA Technical Articles (2015) 17 (4): 14–20.
Published: 01 November 2015
... International® 2015 2015 ASM International analog circuits FIB circuit edit focused ion beam resistors 1 4 httpsdoi.org/10.31399/asm.edfa.2015-4.p014 EDFAAO (2015) 4:14-20 1537-0755/$19.00 ©ASM International® ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 17 NO. 4 DEPOSITING CONTROLLED, MATCHED...
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During a silicon debug, it was found that the gain of a radio receiver circuit dropped dramatically at certain frequencies due to an imbalance in one of the signal paths. A metal fix was proposed, but consensus could not be reached on how to validate it because of the difficulty of the FIB edit required and the inherent uncertainty of the approach. In this article, the authors explain how they came up with an alternative approach that proved to be faster, more reliable, and easier to validate than the cut-and-join fix initially proposed. They describe each step of the analog circuit editing process, explaining how they deposit, characterize, and connect matched resistors using focused ion beam techniques.
Journal Articles
EDFA Technical Articles (2019) 21 (4): 22–28.
Published: 01 November 2019
... that combines FIB, GIS, and nanoprobing, all performed at the same FIB tilt position. It also provides two examples in which the workflow is used. Copyright © ASM International® 2019 2019 ASM International EBAC imaging FIB circuit edit nanoprobing short localization 2 2 httpsdoi.org/10.31399...
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A recent trend in semiconductor failure analysis involves combining the use of different tools and techniques in order to acquire more accurate data at a faster rate. This article describes a new workflow that combines FIB, GIS, and nanoprobing, all performed at the same FIB tilt position. It also provides two examples in which the workflow is used.
Journal Articles
EDFA Technical Articles (2019) 21 (3): 4–6.
Published: 01 August 2019
...Sharang Sharang; Paul Anzalone; Jozef Vincenc Obona Liquid metal ion and plasma beam FIB systems are widely used in the semiconductor industry for TEM lamella preparation, circuit edit, and cross-sectional analysis. This article compares the deprocessing capability of a Ga FIB with that of a Xe...
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Liquid metal ion and plasma beam FIB systems are widely used in the semiconductor industry for TEM lamella preparation, circuit edit, and cross-sectional analysis. This article compares the deprocessing capability of a Ga FIB with that of a Xe plasma FIB. Both systems were used to delayer an Intel 14 nm processor from M8 down to the transistor contacts. As the images in the article show, a 100 × 100 µm window was opened by the Xe plasma FIB and a 20 × 20 µm window was opened with the Ga FIB. Related issues such as processing time, end point detection, and surface roughness are also discussed.
Journal Articles
EDFA Technical Articles (2007) 9 (4): 6–13.
Published: 01 November 2007
... continuity, not a low via resistivity, which is required for circuit edit or mechanical probing.) Initially, vendors offered FIB tools for extending the probe point to the surface and sold numerous tools for this purpose.[21,22] As each level of metallization was added, the time to extend a lower-level...
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By providing timing information and throughput as device complexities and operating frequencies were rapidly increasing, the e-beam prober, which integrated CAD navigation and waveform measurements while enabling the user to almost disregard the technology “under the hood,” was the required tool for IC design debug from the late 1980s to the early 2000s. The history, successes, innovations, mistakes, and possible future of this workhorse tool are visited and described.
Journal Articles
EDFA Technical Articles (2001) 3 (1): 35–35C.
Published: 01 February 2001
... to introduce a delay (slow down a signal) by building a capacitor and attaching it to the failing node. The FC FIB process for cutting and connecting a circuit edit involves: preparing the working platform by milling a large trench over the circuitry of interest, depositing the insulator over the whole...
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Flip chip mounted devices are difficult debug using conventional FIB tools because their internal circuitry is not easily accessible. New flip chip focused ion beam (FC FIB) systems overcome this limitation, however, making it possible to access circuits from the backside through the bulk silicon. In this article, the authors explain how they used the new system to gain access to signal lines for backside waveform acquisition. They also describe some of the procedures they developed to repair and modify flip chip circuits from the backside and prepare cross-section samples from the backside for failure analysis and characterization.
Journal Articles
EDFA Technical Articles (2006) 8 (2): 28–34.
Published: 01 May 2006
... not properly implemented and that the analog circuits of the oscillator were drawing static current. In order to confirm this, a series of focused ion beam (FIB) circuit edit operations were performed on the oscillator. The FIB operations were designed to remove and isolate the oscillator so that it could...
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Government and military ICs, like their commercial counterparts, are subject to ever-tightening cost, performance, and time-to-market demands. They must also comply with strict lifetime, reliability, and radiation hardness standards. In dealing with these challenges for internal applications, engineers at Sandia National Laboratories developed a radiation-hardened structured ASIC platform. In this article, they describe the design and development of the platform and the associated challenges for FA and test.
Journal Articles
EDFA Technical Articles (2013) 15 (1): 37–40.
Published: 01 February 2013
... examples of a new FIB/ SEM technology that is capable of producing multiple image slices assembled as a 3-D model of the integrated circuit. Mr. Hideo Tanaka s talk, Next-Generation FIB Chemistries for Circuit Edit, summarized a number of available beam chemistries, their applications, and some...
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This article provides a summary of the presentations given at the four User’s Group meetings at ISTFA 2012. Each user group focused on one of the following topics: nanoprobing, contactless fault isolation, focused ion beam, and sample preparation.
Journal Articles
EDFA Technical Articles (2017) 19 (1): 26–40.
Published: 01 February 2017
... technology presentation: infrared photo-induced force microscopy (IR PiFM). This is an atomic force sample-prep techniques: delayering, cross sectioning, and focused ion beam (FIB) circuit cut/edit, which are critical to the success of EBIC and EBAC analysis of ICs. microscopy (AFM)-based platform...
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The 42nd International Symposium for Testing and Failure Analysis (ISTFA 2016) was held in Fort Worth, Texas, November 6-10, 2016. This article provides a summary of the keynote presentation, technical program, panel discussion, tutorials, and User’s Group meetings.
Journal Articles
EDFA Technical Articles (2006) 8 (4): 6–11.
Published: 01 November 2006
... and presentations in the fields of materials science and IC failure analysis. Tony Chrastecky is a senior technician at the Quality Product Analysis Laboratories, Freescale Semiconductor, Inc. in Austin, Texas. His areas of expertise include TEM sample preparation techniques and imaging, FIB circuit editing...
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Probing in the sub-100 nm realm requires new tools and techniques that are relatively easy to learn if users follow the advice of the authors of this article. The authors present a probing method based on scanning probe technology and demonstrate its use on a 90-nm transistor failure due to a poly-silicon gate short. They also address challenges associated with sample preparation, probe tip contamination and wear, and the effects of vibration and drift.
Journal Articles
EDFA Technical Articles (2011) 13 (1): 12–19.
Published: 01 February 2011
... circuit edit cross-sectioning electronic packaging focused ion beam milling SEM/FIB systems httpsdoi.org/10.31399/asm.edfa.2011-1.p012 EDFAAO (2011) 1:12-19 FIB-Assisted Analysis 1537-0755/$19.00 ©ASM International® Site-Specific Analysis of Advanced Packaging Enabled by Focused Ion Beams Richard J...
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Packaging integration continues to increase in complexity, driving more samples into FA labs for development support and analysis. For many of the jobs, there is also a need for larger removal volumes, compounding the demand for tool time and throughput. Focused ion beam (FIB) and dual-beam FIB/SEM systems are helping to relieve the pressure with their ability to create site-specific cross sections and to facilitate gate-level circuit rewire and debug. This article reviews the impact of packaging trends on failure analysis along with recent improvements in FIB technology. It also presents examples that illustrate how these new FIB techniques are being applied to solve emerging packaging challenges.
Journal Articles
EDFA Technical Articles (2015) 17 (1): 33–37.
Published: 01 February 2015
..., methodologies for circuit effects. Electrostatic discharge is one of the detrimental edit modification and avoiding factors impacting the outcome electrostatic discharge effects, of semiconductor device and software for calculating DEVELOPMENT OF ADVANCED ION modifications, and it is often FIB jumper resistance...
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Several technology-focused User's Groups met at ISTFA 2014 to discuss current issues and advances in their areas of interest. This article summarizes key discussion points from the Contactless Fault Isolation User's Group, the Nanoprobing User's Group, the Sample Prep/3-D Package User's Group, and the FIB User's Group.
Journal Articles
EDFA Technical Articles (2018) 20 (1): 36–S-6.
Published: 01 February 2018
... a lunchtime discussion some months ago about all the possible options available to those engaged in FIB chip circuit edit. Depending on the tools at one s disposal, time issues, edit-site peculiarities or the need to do multiple edits, and customer requirements (system use or test with or without probing...
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The 43rd International Symposium for Testing and Failure Analysis (ISTFA 2017) was held in Pasadena, Calif., November 5-9, 2017. This article provides a summary of the keynote presentation, technical program, panel discussion, tutorials, and User’s Group meetings.
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