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FA engineering

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Journal Articles
EDFA Technical Articles (2010) 12 (1): 30–32.
Published: 01 February 2010
... Discussion 1537-0755/$19.00 ©ASM International® ISTFA 2009 Panel Discussion: The FA Engineer s Career Past, Present, and Future. What Does the Future Hold for a Career in This Field? Martin Keim, Mentor Graphics martin_keim@mentor.com T he failure analyst as a person and as a highly skilled employee took...
Journal Articles
EDFA Technical Articles (2017) 19 (2): 55–56.
Published: 01 May 2017
...David Burgess This column discusses the basic knowledge and skills needed by failure analysis engineers, with a focus on problem-solving ability. Copyright © ASM International® 2017 2017 ASM International FA engineering ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 19 NO. 2 httpsdoi.org...
Journal Articles
EDFA Technical Articles (2022) 24 (3): 32–40.
Published: 01 August 2022
... International® ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 24 NO. 3 HIGH SPEED X-RAY TOMOGRAPHY WITH SUBMICRON RESOLUTION FOR FA AND REVERSE ENGINEERING OF PACKAGES, PCBs, AND 300 mm WAFERS S.H. Lau1, Sheraz Gul1, Jeff Gelb1, Tianzhu Qin1, Guibin Zan2, Katie Matusik1, David Vine1, Sylvia Lewis1, and Wenbing...
Journal Articles
EDFA Technical Articles (2017) 19 (1): 26–40.
Published: 01 February 2017
... in the excellent keynote Local Student Poster Session participants from the University of Texas at Arlington with their advisor, Prof. Dereje Agonafer, and Dr. Felix Beaudoin, ISTFA 2016 Attendee Chair presentation, How to Educate the Next Generation IC Debug/FA Engineer at Academia, by Prof. Christian Boit...
Journal Articles
EDFA Technical Articles (2011) 13 (4): 50–51.
Published: 01 November 2011
... for chemical analysis, secondary ion mass spectroscopy, and atomic force probing (AFP) or nanoprobing. The evolution of the AFP in surface profiling elevates these labs into an elite portfolio of FA. The aforementioned state-of-the-art associated with engineering test patterns cultivated from the electrical...
Journal Articles
EDFA Technical Articles (2005) 7 (2): 42–44.
Published: 01 May 2005
...Jim Colvin In many companies, failure analysis (FA) has evolved to mean much more than analyzing a part from yesteryear and filing a report simply to satisfy a requirement. Failure analysis engineers frequently interface with design, test, and product engineering and are an integral part of yield...
Journal Articles
EDFA Technical Articles (2010) 12 (2): 4–11.
Published: 01 May 2010
... in Fig. 1, the first step after sort is on-tester analysis. In this stage, the FA engineer works with a tester in manual or engineering mode to verify the failure mode detected during wafer sort. He tries to narrow possible failure mechanisms and isolate the physical location electrically...
Journal Articles
EDFA Technical Articles (2010) 12 (2): 12–18.
Published: 01 May 2010
... the suspects. It is quite possible that several suspects have the same score. Groups of of the potential defect. This information allows the FA engineer to select the proper lab equipment and method and to focus on a much smaller area on the die, potentially improving the FA turnaround time and success rate...
Journal Articles
EDFA Technical Articles (2012) 14 (3): 22–28.
Published: 01 August 2012
... a current image is overlaid with an optical image of the packaged sample. Standard Physical FA Procedure for Stacked Devices It can take an experienced failure analysis (FA) engineer up to four days to find an open defect if the failure location is not known beforehand. The sample must first be decapped...
Journal Articles
EDFA Technical Articles (2023) 25 (1): 54–55.
Published: 01 February 2023
... prediction. Future AI application developments are feasible and highly desirable in the fields including: 1) Assisting FA data collection on different tools or performing full FA; 2) Training new FA engineers Li on FI-FA tools; 3) Generation or modification of detailed measurement data from rare failure...
Journal Articles
EDFA Technical Articles (2020) 22 (1): 30–41.
Published: 01 February 2020
... that are closely related. The development of more energy efficient transistors, combined with new computing architectures, will enable running more complex AI workloads. The six panelists pointed out that AI is already here today, assisting FA engineers in identifying manufacturing issues, and is expected to play...
Journal Articles
EDFA Technical Articles (2023) 25 (2): 16–28.
Published: 01 May 2023
... company (Fig. 1). However, all FA activities are very knowledge-intensive and quite tedious as they require an engineer to have a deep understanding of physical processes, possess all relevant information about the device, and be aware of best practices and common failure patterns appearing in images...
Journal Articles
EDFA Technical Articles (2019) 21 (3): 26–32.
Published: 01 August 2019
.... Maps such as these can help an FA engineer understand which textures are more prone to electromigration failure than others. ratio can be achieved by using a mathematical procedure called principle component analysis (PCA4] In PCA, the observed variables are reduced to a smaller number of principle...
Journal Articles
EDFA Technical Articles (2015) 17 (4): 32–36.
Published: 01 November 2015
... of the biggest challenges for failure analysis (FA) engineers in advanced packaging is isolating failures in the early stages of new product development. In the last few years, developers of advanced semiconductor packaging, such as 2.5-D/3-D packages, have faced the daunting challenge of introducing more...
Journal Articles
EDFA Technical Articles (2009) 11 (4): 14–21.
Published: 01 November 2009
... very well be said that the near future looks like the perfect nightmare for the FA engineer. Complexities of present-day and future designs require use of nondestructive, noncontact faultisolation tools and techniques capable of guiding the FA engineer accurately, reliably, and quickly through 14...
Journal Articles
EDFA Technical Articles (2018) 20 (4): 62–64.
Published: 01 November 2018
... training, he joined ETH Zurich/EMPA as a senior expert for failure analysis on micro- and power-electronics, from device to system level. Parallel to this work, he joined Swatch Group EM Microelectronic Marin as a principal FA engineer in 1995. Jacob has authored more than 60 contributed and invited papers...
Journal Articles
EDFA Technical Articles (2019) 21 (1): 32–41.
Published: 01 February 2019
... is a great resource for engineers who are new to FA, changing disciplines within FA, or desiring a better understanding of tools or processes. The program was divided into five sessions Electrical Analysis and Yield, Microscopy, Package and Physical Analysis Challenges, Fault Isolation, and Featured...
Journal Articles
EDFA Technical Articles (2006) 8 (2): 28–34.
Published: 01 May 2006
... applications, engineers at Sandia National Laboratories developed a radiation-hardened structured ASIC platform. In this article, they describe the design and development of the platform and the associated challenges for FA and test. Copyright © ASM International® 2006 2006 ASM International military...
Journal Articles
EDFA Technical Articles (2011) 13 (3): 46–48.
Published: 01 August 2011
..., there were only two or three FA engineers who could perform this task, and they tended to try other methods before taking a deep breath and blowing half a day to prepare RIL vectors. One engineer became so exasperated that he wrote a program for the tester that removed the need to hack into the test...
Journal Articles
EDFA Technical Articles (2012) 14 (1): 27–31.
Published: 01 February 2012
... previously invisible to visualize with the IREM are now brightly visible and easily identified. The last speaker, Jayhoon Chung, FA engineer in charge of analog development technology at Texas Instruments, has already seen the need for a tool to measure the local strains on failing devices. The development...