One of the co-chairs of the Case Histories sessions at ISTFA 2012 provides a summary of three papers that demonstrate a solid understanding of the semiconductor FA process. The first paper describes the investigation of fractures in PCB traces, the second paper presents a method for analyzing defects due to implanter charging effects, and the third paper explains how analysts determined the cause of automatic test pattern generation failures concentrated in certain areas of the wafer.

This article summarizes major discussion points from four User’s Group meetings held at the ISTFA 2009 conference. The topics addressed are "Optical Techniques: Growth and Limitations," "Resolution of Nanoprobing for 45 nm and Beyond: New Challenges," "FIB," and "Fast ASIC Fault Isolation: Efficiency and Accurate Resolution of Software-Based Fault Isolation."