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3D stacking

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Journal Articles
EDFA Technical Articles (2021) 23 (4): 2–37.
Published: 01 November 2021
... are emerging such as advanced fanout, RDL interposer, embedded bridges, and 3D stacking. The close cooperation between all segments of the industry, EDA tool vendors, IC designers, third party IP providers, foundries, and OSATs will help drive the growth of chiplets into a wide range of applications. DRIVERS...
Journal Articles
EDFA Technical Articles (2016) 18 (4): 24–29.
Published: 01 November 2016
...Ingrid De Wolf Chip-level 3D integration, where chips are thinned, stacked, and vertically interconnected using TSVs and microbumps, brings as many challenges as it does improvements, particularly in the area of failure analysis. This article assesses the capabilities of various FA techniques...
Journal Articles
EDFA Technical Articles (2020) 22 (2): 29–35.
Published: 01 May 2020
...Sebastian Brand; Frank Altmann This article describes a form of lock-in thermography that achieves 3D localization of thermally active defects in stacked die packages. In this approach, phase shifts associated with thermal propagation delay are analyzed as a function of frequency. This allows...
Journal Articles
EDFA Technical Articles (2023) 25 (2): 44–46.
Published: 01 May 2023
... module 3D memory Interconnect Challenges/gaps 3D transistor structures with stacked CMOS. Extreme aspect ratios and atomic level dielectric layer thicknesses. Inaccessible cells. Very delicate low-k films. New metals (Co for example). Gap analysis Atomic level resolution imaging. Identification...
Journal Articles
EDFA Technical Articles (2023) 25 (1): 54–55.
Published: 01 February 2023
... larger packages, due to the assembly of multiple chiplets and stacked dice with various functionalities. Optical or infrared microscopes, SAM, 2D or 3D x-ray tools, and fault isolation techniques, which can accommodate large sample size are highly desired. Furthermore, die stacks and chiplet architecture...
Journal Articles
EDFA Technical Articles (2013) 15 (4): 4–11.
Published: 01 November 2013
...Sergej Mutas This article discusses the basic procedures involved in atom probe tomography (APT) and demonstrates its use on complex material stacks. Although still a relatively new technique, APT has moved to the forefront of semiconductor failure analysis because it can provide 3D chemical...
Journal Articles
EDFA Technical Articles (2013) 15 (3): 46–47.
Published: 01 August 2013
...E. Jan Vardaman This column provides an update on the latest developments in 3D IC technology and outlines the work that still remains before the promises of full 3D integration can be realized. Copyright © ASM International® 2013 2013 ASM International 3D ICs through-silicon vias...
Journal Articles
EDFA Technical Articles (2020) 22 (1): 30–41.
Published: 01 February 2020
... orange peel effect and mitigates issues related to underfill and strain mismatch. The thinning process is accompanied with interferometric measurements. The discussion moved onto 2.5D and 3D stacked parts. The user group focus changed to understanding the current situation of sample preparation...
Journal Articles
EDFA Technical Articles (2011) 13 (1): 46–48.
Published: 01 February 2011
...E. Jan Vardaman This column explains that silicon interposers, considered an interim solution to full 3D integration, may turn out to be more than a stepping stone along the path toward 3D ICs. Copyright © ASM International® 2011 2011 ASM International 3D ICs silicon interposers...
Journal Articles
EDFA Technical Articles (2012) 14 (3): 22–28.
Published: 01 August 2012
... in molding compound. Copyright © ASM International® 2012 2012 ASM International 3D stacking fault localization open detection space domain reflectometry stacked-die packages httpsdoi.org/10.31399/asm.edfa.2012-3.p022 EDFAAO (2012) 3:22-28 Stacked-Die FA 1537-0755/$19.00 ©ASM...
Journal Articles
EDFA Technical Articles (2016) 18 (4): 30–40.
Published: 01 November 2016
.... 6. A. Orozco et al.: 3D IC/Stacked Device Fault Isolation Using 3D Magnetic Field Imaging, Int. Sym. Test. Fail. Anal. (ISTFA), 2014, pp. 33-37. 10. S. Barbeau, J. Alton, and M. Igarashi: Electro Optical Terahertz Pulse Reflectometry A Fast and Highly Accurate Non-Destructive Fault Isolation...
Journal Articles
EDFA Technical Articles (2012) 14 (2): 14–20.
Published: 01 May 2012
... of Stacked-Die Devices by Combining Non-Destructive Localization and Target Preparation Methods, Proc. 35th Int. Symp. Test. Fail. Anal. (ISTFA), 2009, pp. 319-23. 8. C. Schmidt and F. Altmann: Quantitative Phase Shift Analysis for 3D Defect Localization Using Lock-In Thermography, Proc. 37th Int. Symp...
Journal Articles
EDFA Technical Articles (2012) 14 (3): 46–47.
Published: 01 August 2012
...E. Jan Vardaman The pace of development for 2.5-D packaging solutions appears to be accelerating as the timeline for the adoption of 3D through-silicon via (TSV) technology continues to slide. This column discusses the latest advancements in 2.5-D or interposer packaging technology and the growing...
Journal Articles
EDFA Technical Articles (2022) 24 (2): 24–32.
Published: 01 May 2022
... of an interposer. The implementations of interposers are both passive and active in design. INTERPOSER VS. PCB INTERPOSER OVERVIEW Interposer technology enables 2.5D and 3D stacking, which can incorporate side-by-side and vertical alignment of the chips in a single package. The interposer offers interdie...
Journal Articles
EDFA Technical Articles (2021) 23 (1): 50–51.
Published: 01 February 2021
... measurements to electronics or vice versa, and they are ubiquitous: in phones, automobiles, appliances, games, healthcare, etc. Packaging technologies (wafer bonding, 3D integration, stacked dies) have enabled this growth by drastically reducing costs and improving reliability. To start addressing the theme...
Journal Articles
EDFA Technical Articles (2014) 16 (4): 20–24.
Published: 01 November 2014
... for 3D Through-Si Stacking, EuroSimE, 2009. 7. X. Liu et al.: Failure Mechanisms and Optimum Design for Electroplated Copper TSV, Electron. Components Technol. Conf., (ECTC), 2009. 8. J. De Messemaeker et al.: Correlation between Cu Microstructure and TSV Cu Pumping, Electron. Components Technol...
Journal Articles
EDFA Technical Articles (2021) 23 (2): 4–12.
Published: 01 May 2021
... in the closest proximity possible instead of a vertically stacked 3D topology. The interposer forms a base for mounting the chips and also provides a high density Fig. 1 Packaging development trends. ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 23 NO. 2 5 Fig. 2 Interposer-based advanced SIP packaging. edfas.org...
Journal Articles
EDFA Technical Articles (2016) 18 (3): 54–55.
Published: 01 August 2016
... in implementing new TSV techniques. Copyright © ASM International® 2016 2016 ASM International 3D ICs through-silicon vias ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 18 NO. 3 5 4 httpsdoi.org/10.31399/asm.edfa.2016-3.p054 GUEST COLUMNIST 2.5- AND 3-D TSV TECHNOLOGY APPLICATIONS AND FAILURE ANALYSIS...
Journal Articles
EDFA Technical Articles (2015) 17 (4): 32–36.
Published: 01 November 2015
...Jesse Alton; Martin Igarashi; Ka Chung Lee This article discusses the concept of a virtual known good device (VKGD) and how it used in the development of advanced 3D packaging. It explains that a VKGD is essentially an electromagnetic model of an IC package, including bumps, interposers...
Journal Articles
EDFA Technical Articles (2021) 23 (2): 33–37.
Published: 01 May 2021
... to stimulate discussion. This triggered multiple questions from the audience. Colvin gave an overview of ultra-thin silicon sample prep challenges on 2.5D/3D packages and discussed issues with different die heights with adjacent die on 2.5D. The challenges on CoWoS and DDR4 stacked die packages were discussed...