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3D integration

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Journal Articles
EDFA Technical Articles (2021) 23 (2): 13–19.
Published: 01 May 2021
... EDFAAO (2021) 2:13-19 httpsdoi.org/10.31399/asm.edfa.2021-2.p013 1537-0755/$19.00 ©ASM International® 13 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 23 NO. 2 STATE-OF-THE-ART HIGH-RESOLUTION 3D X-RAY MICROSCOPY FOR IMAGING OF INTEGRATED CIRCUITS Mirko Holler, Manuel Guizar-Sicairos, and Jörg Raabe Paul...
Journal Articles
EDFA Technical Articles (2016) 18 (4): 24–29.
Published: 01 November 2016
...Ingrid De Wolf Chip-level 3D integration, where chips are thinned, stacked, and vertically interconnected using TSVs and microbumps, brings as many challenges as it does improvements, particularly in the area of failure analysis. This article assesses the capabilities of various FA techniques...
Journal Articles
EDFA Technical Articles (2013) 15 (3): 46–47.
Published: 01 August 2013
...E. Jan Vardaman This column provides an update on the latest developments in 3D IC technology and outlines the work that still remains before the promises of full 3D integration can be realized. Copyright © ASM International® 2013 2013 ASM International 3D ICs through-silicon vias...
Journal Articles
EDFA Technical Articles (2011) 13 (1): 46–48.
Published: 01 February 2011
...E. Jan Vardaman This column explains that silicon interposers, considered an interim solution to full 3D integration, may turn out to be more than a stepping stone along the path toward 3D ICs. Copyright © ASM International® 2011 2011 ASM International 3D ICs silicon interposers...
Journal Articles
EDFA Technical Articles (2012) 14 (2): 14–20.
Published: 01 May 2012
...Frank Altmann; Matthias Petzold Failure analysis is becoming increasingly difficult with the emergence of 3D integrated packages due to their complex layouts, diverse materials, shrinking dimensions, and tight fits. This article demonstrates several FA techniques, including high-frequency scanning...
Journal Articles
EDFA Technical Articles (2013) 15 (1): 34.
Published: 01 February 2013
...Dave Vallett This article provides a summary of the ISTFA 2012 Panel Discussion on the FA challenges associated with 3D integrated packages. Copyright © ASM International® 2013 2013 ASM International ISTFA Panel Discussion httpsdoi.org/10.31399/asm.edfa.2013-1.p034 EDFAAO (2013) 1:34...
Journal Articles
EDFA Technical Articles (2020) 22 (2): 29–35.
Published: 01 May 2020
...), chip embedding, and 3D heterogeneous integration are considered a determining factor for continuous innovation in microelectronics.[1] With respect to 3D integration, the through-silicon via (TSV) interconnect technology has rapidly attracted attention for high-density, verticalsystem integration...
Journal Articles
EDFA Technical Articles (2021) 23 (1): 50–51.
Published: 01 February 2021
... measurements to electronics or vice versa, and they are ubiquitous: in phones, automobiles, appliances, games, healthcare, etc. Packaging technologies (wafer bonding, 3D integration, stacked dies) have enabled this growth by drastically reducing costs and improving reliability. To start addressing the theme...
Journal Articles
EDFA Technical Articles (2018) 20 (4): 4–12.
Published: 01 November 2018
... sensitivity. Ongoing advances in microelectronics technologies, such as 3D integration and system in package (SiP), enable significant improvements in performance and integration density, resulting in increasingly complex systems while reducing a device s spatial requirements. However, new failure mechanisms...
Journal Articles
EDFA Technical Articles (2023) 25 (4): 12–16.
Published: 01 November 2023
... INTRODUCTION The rapid development of advanced integrated circuits (IC) with increased performance and expanded features now requires more than shrinking the transistor geometry during fabrication. Designs for 2.5D[1] and 3D[2,3] packaging, highly integrated chiplets,[4,5] backside power delivery,[6] and other...
Journal Articles
EDFA Technical Articles (2008) 10 (4): 30–32.
Published: 01 November 2008
..., Enabling Technologies for 3-D Integration, Mater. Res. Soc. Symp. Proc., C. Bower, P. Garrou, P. Ramm, and K. Takahashi, Ed., 2007, 970, p. 239. 7. R. Rief, C.S. Tan, et al.: Technology and Applications of 3D Integration Enabled by Bonding, 3-D Technol., Model., and Process. Symp. (Burlingame, Calif...
Journal Articles
EDFA Technical Articles (2016) 18 (4): 30–40.
Published: 01 November 2016
... confirm the potential of all three techniques and indicate that a fully nondestructive integration flow for 3D packages may be achievable with further development and optimization. The complexity of sample preparation and deprocessing has risen exponentially with the emergence of 2.5-D and 3D packages...
Journal Articles
EDFA Technical Articles (2012) 14 (3): 4–11.
Published: 01 August 2012
... are essential. Furthermore, FA is becoming an important strategic enabling factor for new products, not just another “cost factor.” Copyright © ASM International® 2012 2012 ASM International 3D integration 3-D x-ray computer tomography electronic device packaging SiP devices httpsdoi.org...
Journal Articles
EDFA Technical Articles (2022) 24 (2): 51–52.
Published: 01 May 2022
... enabler of semiconductor technology innovations. The logic and memory scaling continues at an unabated pace with new materials and transistor architectures being introduced. The integration of advanced packaging heterogeneous technologies like chiplets, 2.5D, and 3D in mainstream devices is exploding...
Journal Articles
EDFA Technical Articles (2023) 25 (4): 4–11.
Published: 01 November 2023
... discusses the challenges of analyzing the internal structure and composition of integrated circuits, and how 3D imaging can benefit manufacturers and researchers. It covers the development of superconducting x-ray sensors, their advantages over traditional sensors, potential applications, and focus areas...
Journal Articles
EDFA Technical Articles (2024) 26 (1): 2–50.
Published: 01 February 2024
.... The initiative focuses on creating U.S. capability for three-dimensional heterogeneous integration (3DHI) manufacturing and pursuing focused research for the manufacture of complex 3D microsystems. This guest editorial describes the outcomes from a three-day summit (Seattle, Washington, August 2023) where...
Journal Articles
EDFA Technical Articles (2023) 25 (1): 54–55.
Published: 01 February 2023
... and investment in advanced packaging as silicon technology scaling encounters barriers moving forward. 3D or advanced microelectronic packaging is the industry trend to meet the ever-increasing market demand for increased performance, reduced power consumption, smaller footprint, lower cost, and integration...
Journal Articles
EDFA Technical Articles (2023) 25 (4): 20–26.
Published: 01 November 2023
... the volumetric mapping 25 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 25 NO. 4 capability of RPM-3D. 3D NAND memory has represented the most striking demonstration of the impact on performance, cost, and scaling of vertical device integration.[8] While 3D NAND is currently stacking more than 100 layers...
Journal Articles
EDFA Technical Articles (2021) 23 (2): 4–12.
Published: 01 May 2021
... in underfill, or void and delamination in through-silicon, are the most common defect types of 3D packaging and all the possible defect locations are shown in Fig.5. The confidentiality and integrity of the sensitive information protected by the security architecture are considered violated if the assets...
Journal Articles
EDFA Technical Articles (2023) 25 (2): 44–46.
Published: 01 May 2023
... analysis challenges associated with the growing number of elements being incorporated into integrated circuit fabrication. It includes tables summarizing top challenges in front end and package analysis. Copyright © ASM International® 2023 2023 ASM International 3D architecture EDFAS FA roadmap...