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3-D x-ray computer tomography

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Journal Articles
EDFA Technical Articles (2012) 14 (3): 4–11.
Published: 01 August 2012
... are essential. Furthermore, FA is becoming an important strategic enabling factor for new products, not just another “cost factor.” Copyright © ASM International® 2012 2012 ASM International 3D integration 3-D x-ray computer tomography electronic device packaging SiP devices httpsdoi.org...
Journal Articles
EDFA Technical Articles (2012) 14 (1): 27–31.
Published: 01 February 2012
.... He also discussed and showed examples of three specific analytical techniques for identifying the location of defects: scanning acoustic microscopy, lock-in thermography, and 3-D x-ray computed tomography. Scanning acoustic microscopy is useful for nondestructive imaging of cracks and delaminations...
Journal Articles
EDFA Technical Articles (2021) 23 (2): 13–19.
Published: 01 May 2021
... a 3D volume via computed tomography. The first demonstration of ptychographic x-ray computed tomography (PXCT) in 2010 at PSI edfas.org 14 (a) (b) (c) ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 23 NO. 2 (d) Fig. 1 (a) Experimental setup for recording x-ray ptychography data in 2D with an example...
Journal Articles
EDFA Technical Articles (2017) 19 (4): 36–44.
Published: 01 November 2017
... to reconstruct the 3-D model. The typical role of lab-based x-ray CT systems in FA and reverse engineering is to provide connectivity information on the printed circuit board (PCB) level and packaging components.[1-5] Synchrotron-based x-ray tomography can improve on the spatial resolution of lab-based x-ray...
Journal Articles
EDFA Technical Articles (2010) 12 (1): 14–18.
Published: 01 February 2010
...-0755/$19.00 ©ASM International® Nondestructive 3-D X-Ray Microscopy Itzik Goldberger, Xradia, Inc. igoldberger@xradia.com X-ray computed tomography (CT) has been used for many years in medical settings to perform noninvasive x-ray imaging for applications such as clinical diagnostics, preclinical...
Journal Articles
EDFA Technical Articles (2009) 11 (1): 46–47.
Published: 01 February 2009
... from navigation at 30 µm to defect localization and characterization at 1 µm spatial resolution. The automated 3-D tomography features virtual crosssectional capability, thus eliminating the need for costly and time-consuming sample preparation. One of the challenges to process control and FA...
Journal Articles
EDFA Technical Articles (2022) 24 (3): 32–40.
Published: 01 August 2022
... methods for electronic packages and printed circuit boards (PCBs) for over three decades. Real time x-ray imaging and computed tomography have now become key workhorses in nondestructive imaging, driven by developments in 3D x-ray microscopy[1-2] through improved resolution and throughput.[3-4] However...
Journal Articles
EDFA Technical Articles (2005) 7 (1): 26–32.
Published: 01 February 2005
...; httpleonardo.phys.washington.edu/ feff/. 11. A.H. Compton and S.K. Alison: X-Rays in Theory and Experiment, 2nd ed., Van Nostrand, Princeton, NJ, 1935, Sec. VII.6-8. 12. G. Schneider, E. Anderson, S. Vogt, C. Knockel, D. Weiss, M. Legros, and C. Larabell: Computed Tomography of Cryogenic Cells, Surf. Rev. Lett., 2002, 9(1), pp...
Journal Articles
EDFA Technical Articles (2019) 21 (3): 26–32.
Published: 01 August 2019
...) is replaced by Ti (yellow). ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 21 NO. 3 31 Fig. 6 Top down view of the 3D reconstruction of a S/D defect in a modern FinFET structure. Gates (TiN and Hf) extend from top right to bottom left; Si fins are not shown. Fig. 7 3D reconstruction of Hf, Si, Ti, Al, and W...
Journal Articles
EDFA Technical Articles (2023) 25 (4): 4–11.
Published: 01 November 2023
..., Appl. Phys. Lett., 1999, 74(1), p. 150-152, doi. org/10.1063/1.123135. 2. D. Zhang, et al.: Fast, Full Chip Image Stitching of Nanoscale Integrated Circuits, Technical report, 2019, SRI International, Princeton. 3. P.B. Weichman and E.M. Lavely: Fluorescent X-ray Scan Image Quality Prediction, J...
Journal Articles
EDFA Technical Articles (2005) 7 (3): 6–12.
Published: 01 August 2005
... in (continued on page 10) Volume 7, No. 3 Electronic Device Failure Analysis 9 Electron Tomography (continued) the computer is necessary to achieve subpixel alignment of the images. This can be done by computerized cross correlation of the features in images, or by using 10 nm gold spherical particles deposited...
Journal Articles
EDFA Technical Articles (2019) 21 (3): 16–24.
Published: 01 August 2019
... of Integrated Circuits, Nature, 2017, 543(7645), p. 402. 4. N. Asadizanjani, M. Tehranipoor, and D. Forte: PCB Reverse Engineering using Nondestructive X-ray Tomography and Advanced Image Processing, IEEE Trans. Compon. Packag. Manuf. Technol., 2017, 7(2), p. 292-299. 5. C. Bao, D. Forte, and A. Srivastava...
Journal Articles
EDFA Technical Articles (2019) 21 (3): 8–14.
Published: 01 August 2019
... research fellowship at the Ginzton Laboratory of Stanford University, Calif. Russell is the founder and director of R&D at Ion Innovations, and is working on research in metrology, instrumentation design and miniaturization, electron and ion source design, machine learning and computer vision, and related...
Journal Articles
EDFA Technical Articles (2016) 18 (1): 14–20.
Published: 01 February 2016
... bump joints. X-ray computed tomography (CT) is one major 3-D analytical method, but its spatial resolution is currently limited to the submicron level. The slice-and-view method using a focused ion beamsecondary electron microscope (FIB-SEM) has high spatial resolution on a nanometer level, which makes...
Journal Articles
EDFA Technical Articles (2021) 23 (1): 12–18.
Published: 01 February 2021
... but is limited in ultimate resolution by the diffraction limits of visible light. This physical limitation means that any feature below around 200 nm will not be resolved. Laboratory based x-ray microscopy and computed tomography systems can achieve an image resolution of down to 50 nm but maintain excessive...
Journal Articles
EDFA Technical Articles (2001) 3 (2): 1–12.
Published: 01 May 2001
... J. Sel. Top. Quant. Elec., Vol. 2, 1996, p 679. 5. D. M. Mittleman, S. Hunsche, L. Boivin, and M. C. Nuss, T-ray tomography, Opt. Lett., Vol. 22, 1997, p 904. 6. Z. G. Lu, P. Campbell, and X.-C. Zhang, Free-space electro-optic sampling with a high-repetition rate regenerative amplified laser...
Journal Articles
EDFA Technical Articles (2011) 13 (3): 4–11.
Published: 01 August 2011
... development. In 2010, she became the manager of the service laboratory (customer application), including several analysis techniques, such as scanning acoustic microscopy, xray tomography, infrared imaging, x-ray microfluorescence, and TDM. Volume 13, No. 3 11 ...
Journal Articles
EDFA Technical Articles (2019) 21 (2): 22–27.
Published: 01 May 2019
... by the manufacturer. For thermal management and reliability reasons, it was important to evaluate the total dimensions of this manufacturing signature. X-ray conventional tomography at 240 KeV did not allow visibility through the heavy metal thermal dissipators. To remedy this problem, microtomography was performed...
Journal Articles
EDFA Technical Articles (2019) 21 (2): 30–36.
Published: 01 May 2019
... Would Have Spotted the Secret Chinese Chip in Seconds [Accessed 18 Oct. 2018]. 14. N. Asadizanjani, M. Tehranipoor, and D. Forte: PCB Reverse Engineering using Nondestructive X-ray Tomography and Advanced Image Processing, IEEE Trans. Components, Packag. Manuf. Technol., 2017, p. 1-8. 15. U. Guin, D...
Journal Articles
EDFA Technical Articles (2014) 16 (1): 31–48.
Published: 01 February 2014
... tomography (CT) x-ray technology and compared the technique with traditional 2-D x-ray technology. He also highlighted some real-life case studies and examples demonstrating the new capabilities and powerful features that the 3-D CT provides to failure analysis scientists and engineers. Kevin Weaver...