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Finite element analysis
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Journal Articles
EDFA Technical Articles (2024) 26 (3): 28–34.
Published: 01 August 2024
Abstract
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A numerical investigation of the probabilistic approach in estimating the reliability of wire bonding is presented along with a reliability based design optimization methodology for microelectronic devices structures.
Journal Articles
EDFA Technical Articles (2017) 19 (4): 12–20.
Published: 01 November 2017
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Scanning microwave impedance microscopy (sMIM) is a relatively new method for making electrical measurements on test samples in AFMs. This article presents examples in which sMIM technology is used to measure dielectric coefficients, doping concentrations, and nanoscale C-V curves for different semiconductor and dielectric materials. It also explains how measured results compare with theoretical models, confirming the validity of each approach.