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X-ray microtomography
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Journal Articles
Nondestructive 3D X-ray Microscopy Speeds Throughput in New Failure Analysis Workflows
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EDFA Technical Articles (2024) 26 (4): 14–19.
Published: 01 November 2024
Abstract
View articletitled, Nondestructive 3D X-ray Microscopy Speeds Throughput in New Failure Analysis Workflows
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for article titled, Nondestructive 3D X-ray Microscopy Speeds Throughput in New Failure Analysis Workflows
This article shows how 3D XRM can be applied to nondestructively detect non-optimized assembly processes that can influence local stresses and overall device reliability. This makes it useful for process development and failure analysis. When used along with AI training models, 3D XRM can achieve analysis of highly integrated packaging structures with reasonable throughput for process validation and error correction guidance.
Journal Articles
Nondestructive Defect Detection in 3D X-ray Microscopy Data of Ball Grid Array Solder for Void Detection in Solder Joints using Deep Learning
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EDFA Technical Articles (2024) 26 (3): 4–11.
Published: 01 August 2024
Abstract
View articletitled, Nondestructive Defect Detection in 3D X-ray Microscopy Data of Ball Grid Array Solder for Void Detection in Solder Joints using Deep Learning
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for article titled, Nondestructive Defect Detection in 3D X-ray Microscopy Data of Ball Grid Array Solder for Void Detection in Solder Joints using Deep Learning
A deep learning-based nondestructive approach for void segmentation in BGA solder balls using 3D x-ray microscopy is presented.
Journal Articles
Assessing Compatibility of Advanced IC Packages to X-ray Based Physical Inspection
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EDFA Technical Articles (2024) 26 (3): 14–24.
Published: 01 August 2024
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View articletitled, Assessing Compatibility of Advanced IC Packages to X-ray Based Physical Inspection
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for article titled, Assessing Compatibility of Advanced IC Packages to X-ray Based Physical Inspection
This article describes a proposed novel metric to furnish chip designers with a prognostic tool for x-ray imaging in the pre-silicon stage. This metric is fashioned to provide designers with a concrete measure of how visible the fine-pitched features of their designs are under x-ray inspection. It utilizes a combination of x-ray image data collection, analysis, and simulations to evaluate different design elements.
Journal Articles
Superconducting X-ray Sensors for Tomography of Microelectronics
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EDFA Technical Articles (2023) 25 (4): 4–11.
Published: 01 November 2023
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View articletitled, Superconducting X-ray Sensors for Tomography of Microelectronics
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for article titled, Superconducting X-ray Sensors for Tomography of Microelectronics
The high energy-resolving power of superconducting x-ray detectors reduces unwanted x-ray backgrounds, uses x-ray photons efficiently, and allows for discrimination among multiple chemical elements in a sample. This article discusses the challenges of analyzing the internal structure and composition of integrated circuits, and how 3D imaging can benefit manufacturers and researchers. It covers the development of superconducting x-ray sensors, their advantages over traditional sensors, potential applications, and focus areas for future work to develop this technology.
Journal Articles
High Speed X-ray Tomography with Submicron Resolution for FA and Reverse Engineering of Packages, PCBs, and 300 mm Wafers
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EDFA Technical Articles (2022) 24 (3): 32–40.
Published: 01 August 2022
Abstract
View articletitled, High Speed X-ray Tomography with Submicron Resolution for FA and Reverse Engineering of Packages, PCBs, and 300 mm Wafers
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for article titled, High Speed X-ray Tomography with Submicron Resolution for FA and Reverse Engineering of Packages, PCBs, and 300 mm Wafers
This article provides an overview of a commercial 3D X-ray system, explaining how it acquires high-resolution images of submicron defects in large intact samples. It presents examples in which the system is used to reveal cracks in thin redistribution layers, voids in organic substrates, and variations in TSV metallization on 300-mm wafers. As the authors explain, each scan can be done in as little as a few minutes regardless of sample size, and the resulting images are clear of the beam hardening artifacts that often cause problems in failure analysis and reverse engineering.
Journal Articles
State-of-the-Art High-Resolution 3D X-ray Microscopy for Imaging of Integrated Circuits
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EDFA Technical Articles (2021) 23 (2): 13–19.
Published: 01 May 2021
Abstract
View articletitled, State-of-the-Art High-Resolution 3D X-ray Microscopy for Imaging of Integrated Circuits
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for article titled, State-of-the-Art High-Resolution 3D X-ray Microscopy for Imaging of Integrated Circuits
X-ray ptychography, as recent studies show, has the potential to bridge the gap that currently exists between conventional X-ray imaging and electron microscopy. This article covers the evolution of the technology from basic 2D imaging to computed tomography to 3D ptychographic X-ray laminography (PyXL) with zoom. To demonstrate the capabilities of PyXL, a 16-nm FinFET logic IC was mechanically polished to a thickness of 20 µm and several regions were imaged at various levels of resolution.
Journal Articles
Defect Characterization of Advanced Packages using Novel Phase and Dark Field X-Ray Imaging
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EDFA Technical Articles (2020) 22 (3): 18–25.
Published: 01 August 2020
Abstract
View articletitled, Defect Characterization of Advanced Packages using Novel Phase and Dark Field X-Ray Imaging
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for article titled, Defect Characterization of Advanced Packages using Novel Phase and Dark Field X-Ray Imaging
Modified Talbot X-ray interferometry provides three contrast modes simultaneously: absorption, phase, and dark field/scattering. This article describes the powerful new imaging technique and shows how it is used to characterize various types of defects in advanced semiconductor packages.
Journal Articles
Plasma FIB Deprocessing of Integrated Circuits from the Backside
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EDFA Technical Articles (2017) 19 (4): 36–44.
Published: 01 November 2017
Abstract
View articletitled, Plasma FIB Deprocessing of Integrated Circuits from the Backside
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for article titled, Plasma FIB Deprocessing of Integrated Circuits from the Backside
Deprocessing of ICs is often the final step for defect validation in FA cases with limited fault-isolation information. This article presents a workflow for deprocessing ICs from the backside using automated thinning and large-area plasma FIB delayering. Advantages to this approach include a reduction in manual planarization and depackaging and a higher degree of precision and repeatability.
Journal Articles
Emerging Techniques For 2-D/2.5-D/3-D Package Failure Analysis: EOTPR, 3-D X-Ray, and Plasma FIB
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EDFA Technical Articles (2016) 18 (4): 30–40.
Published: 01 November 2016
Abstract
View articletitled, Emerging Techniques For 2-D/2.5-D/3-D Package Failure Analysis: EOTPR, 3-D X-Ray, and Plasma FIB
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for article titled, Emerging Techniques For 2-D/2.5-D/3-D Package Failure Analysis: EOTPR, 3-D X-Ray, and Plasma FIB
The complexity of sample preparation and deprocessing has risen exponentially with the emergence of 2.5-D and 3D packages. This article provides answers and insights on how to deal with the challenges of increasingly complex semiconductor packages. After identifying pressing issues and potential bottlenecks with state-of-the-art FA flows, the authors present two case studies demonstrating the capabilities of electro-optical terahertz pulse reflectometry (EOTPR), plasma FIB milling, and 3D X-ray imaging. The FA results confirm the potential of all three techniques and indicate that a fully nondestructive integration flow for 3D packages may be achievable with further development and optimization.
Journal Articles
3-D System in Package: How to Cope with Increasing Challenges
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EDFA Technical Articles (2012) 14 (3): 4–11.
Published: 01 August 2012
Abstract
View articletitled, 3-D System in Package: How to Cope with Increasing Challenges
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for article titled, 3-D System in Package: How to Cope with Increasing Challenges
It seems that scaling of chip technology according to Moore’s Law will continue for digital functionalities (logic and memory); however, increasing system integration on chip and package levels, called “More than Moore,” has been observed in the past several years. This strong trend in the worldwide semiconductor industry enables more functionality, diversification, and higher value by creating smart microsystems. This article discusses the many challenges faced in FA of 3-D chips, where well-staffed and equipped FA labs are essential. Furthermore, FA is becoming an important strategic enabling factor for new products, not just another “cost factor.”
Journal Articles
Nondestructive 3-D X-Ray Microscopy
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EDFA Technical Articles (2010) 12 (1): 14–18.
Published: 01 February 2010
Abstract
View articletitled, Nondestructive 3-D X-Ray Microscopy
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for article titled, Nondestructive 3-D X-Ray Microscopy
X-ray computed tomography is a noninvasive technique that can reveal the internal structure of objects in three dimensions with spatial resolution down to 50 nm. This article discusses the basic principles of this increasingly important imaging technology and presents examples of its use on various types of defects in semiconductor packages.
Journal Articles
An X-Ray Tomography Primer
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EDFA Technical Articles (2005) 7 (1): 26–32.
Published: 01 February 2005
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for article titled, An X-Ray Tomography Primer
X-ray tomography has been rapidly gaining acceptance in the semiconductor industry since the first demonstration of its use on IC interconnect in 1999. As failure analysts are discovering, X-ray imaging is more powerful than visible light microscopy and can be used to analyze larger samples than those that fit in an electron microscope. This article provides an introduction to the physics, signal processing, and algorithms involved in X-ray imaging and tomography and the factors that affect resolution.