Explore Subjects

Laser signal injection microscopy

• Light induced voltage alteration (LIVA)
• Optical beam induced current (OBIC)
• Optical beam induced resistance change (OBIRCH)
• Soft defect localization (SDL)
• Thermal induced voltage alteration (TIVA)

Physical imaging and inspection

• Infrared imaging
• Scanning acoustic microscopy (SAM)
• Scanning electron microscopy (SEM)
• Scanning transmission electron microscopy (STEM)
• Transmission electron microscopy (TEM)
• X-ray imaging

Fault isolation techniques

• Electron beam absorbed current (EBAC)
• Electron beam induced current (EBIC)
• Lock-in thermography
• Magnetic current imaging (MCI)
• Photon emission microscopy (PEM)
• Reflectometry

Failure modes and defects

• Crystal defect analysis
• Dielectric breakdown
• Electrostatic discharge
• Hot spot detection
• Leakage current detection

Packaging-related failures

• Ball grid arrays (BGAs)
• Board-level issues
• Flip chip packages
• Interposers
• Stacked die packages

Counterfeit ICs and security

• Counterfeit detection
• Detecting malicious attacks
• Hardware trust and assurance
• Reliability testing and analysis
• Risk assessment

Sample preparation

• Cross-sectioning
• Decapsulation
• Delayering
• Deprocessing
• Polishing

Device-specific failure analysis

• Capacitor failures
• Electromechanical relay failures
• FinFET analysis
• Photovoltaic device failures
• Quantum device failures
• SRAM analysis 

Other FA tools and techniques

• Circuit edit and repair
• Dopant/junction profiling
• Nanoprobing
• Scanning probe techniques
• Spectroscopy
• Yield analysis and improvement