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Volume 26, Issue 3

15 August 2024

ISSN 1537-0755

Demand for AI Computing will Shape FA Community

James Chambers

View articletitled, Demand for AI Computing will Shape FA Community

Nondestructive Defect Detection in 3D X-ray Microscopy Data of Ball Grid Array Solder for Void Detection in Solder Joints using Deep Learning

Kishansinh Rathod; Sankeerth Desapogu; Andreas Jansche; Timo Bernthaler; Gerhard Schneider ...

View articletitled, Nondestructive Defect Detection in 3D X-ray Microscopy Data of Ball Grid Array Solder for Void Detection in Solder Joints using Deep Learning

Assessing Compatibility of Advanced IC Packages to X-ray Based Physical Inspection

M. Shafkat; M. Khan; Chengjie Xi; Nitin Varshney; Aslam A. Khan ...

View articletitled, Assessing Compatibility of Advanced IC Packages to X-ray Based Physical Inspection

Reliability and Optimization of Wire Bonding in Power Microelectronic Devices

Norelislam El Hami; Aicha Koulou; Abdelkhalak El Hami

View articletitled, Reliability and Optimization of Wire Bonding in Power Microelectronic Devices

EDFAS' Role and Recent Progress in Cultivating Future Leaders

Lun Chan

View articletitled, EDFAS' Role and Recent Progress in Cultivating Future Leaders

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Demand for AI Computing will Shape FA Community

EDFAS' Role and Recent Progress in Cultivating Future Leaders

Nondestructive Defect Detection in 3D X-ray Microscopy Data of Ball Grid Array Solder for Void Detection in Solder Joints using Deep Learning

Assessing Compatibility of Advanced IC Packages to X-ray Based Physical Inspection

Reliability and Optimization of Wire Bonding in Power Microelectronic Devices

Print ISSN 1537-0755

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