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Issue
1 February - Volume 14, Issue 1, Pages 4 - 48
1 May - Volume 14, Issue 2, Pages 4 - 29
1 August - Volume 14, Issue 3, Pages 4 - 47
1 November - Volume 14, Issue 4, Pages 4 - 47
Volume 14, Issue 3
1 August 2012
ISSN
1537-0755
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3-D System in Package: How to Cope with Increasing Challenges
Walter Mack
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Magnetic Microscopy to Reconstruct 3-D Currents in Complex Systems
Fulvio Infante
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Space Domain Reflectometry for Opens Detection in Stacked-Die Packages
Jan Gaudestad
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Vladimir V. Talanov
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Po Chih Huang
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TSV Developments
E. Jan Vardaman
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