Over the last few years, new challenges increased the pressure on packaging and assembly analytical resources. Reduced product development cycle time, increased market segmentation, new package and die level materials, ever shrinking device geometries, and fully enabled technologies (i.e. with thermal, retention, and EMI solutions) created these new pressures on fault isolation/failure analysis efforts and package development.

failure analysis, fault isolation, packaging, roadmap
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2001
ASM International
Topics
Electronic packaging Semiconductor wafer fabrication
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