A deep learning-based nondestructive approach for void segmentation in BGA solder balls using 3D x-ray microscopy is presented.

3D X-ray microscopy, ball grid arrays, deep learning, failure analysis, solder balls, solder joints, void detection, void segmentation
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Copyright © ASM International® 2024
2024
ASM International
Topics
Manufacturing defects X-ray microtomography Semiconductor wafer fabrication
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