The Package Innovation Roadmap Council (PIRC) was established as part of the Failure Analysis Technology Roadmap activity at the direction of the EDFAS Board. This column provides an overview of a technical paper by the PIRC that highlights recent innovations, technology gaps, and future development trends in package fault isolation and failure analysis. The paper focuses on three main categories: 1) Artificial intelligence (AI) applications, 2) Sample handling, and 3) FA tool robustness.
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