In this article, the authors evaluate micro CNC milling as an alternative to manual parallel lapping for mechanical cross-sectioning of flip-chip packaged samples. They describe both processes, and how they compare to other cross-sectioning techniques, and clearly illustrate the differences. SEM images of a manually polished sample show process-induced cracking, chipping, and delamination at the die-C4 interface. In contrast, the CNC-milled sample is artifact-free and the C4 bumps are uniformly exposed along the entire length of the cross-section.

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