At the ISTFA ’99 event, the organizers arranged for the first time a panel discussion on failure analysis related purely to EOS/ESD issues. Each panelist presented their area of expertise followed by two hours of lively exchange with the attendees and among attendees. The panel discussed how to differentiate EOS and ESD failures. These failures are more critical with the industry move to submicron geometries and newer interconnect materials and other processing technologies, such as copper and flip-chip processing.

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